Intel Corporation

Tawfik Arabi

Gregory F Taylor

Ali Muhtaroglu

Hung-Piao Ma

Gregory M Iovino

Shai Rotem

Avner Kornfeld

Srirama Pedarla

Patrick Elwer

Dan Murray

Greg F Taylor

Kent R Callahan

Stephen H Gunther

Benson D Inkley

Chi-Yeu Chao

Gary A Andrew

Michael Bitan

Matthew C Reilly

Srirama Pedaria

Thomas D Barrett

Greg Eberlein

Dave Riendeau

Methods and apparatus to provide per die temperature programming for thermally efficient integrated circuit (IC) operation are described. In some embodiments, the junction temperature of an IC component is determined, e.g., to reduce power consumption and/or improve performance. Other embodiments are also described.

Per die temperature programming for thermally efficient integrated circuit (IC) operation

Methods and apparatus to provide per die voltage programming for energy efficient integrated circuit (IC) operation are described. In some embodiments, the voltage potential supplied to an IC component is lowered below a peak performance voltage level, e.g., to reduce power consumption by the component. Other embodiments are also described.

Per die voltage programming for energy efficient integrated circuit (IC) operation

Some embodiments of the invention include apparatus and systems having integrated circuits. Terminals or pins of the integrated circuits are configured to be driven to a state, to be floated for a time interval, and to be measured to determine the state of the terminals after the time interval. The measurement involves sampling the RC time constant of leakage current of the terminals. Other embodiments are described and claimed.

AC testing of leakage current in integrated circuits using RC time constant

Systems for testing a plurality of integrated circuits at a plurality of frequencies and voltages is disclosed. In one embodiment, a plurality of integrated circuits is tested at least once within a predetermined set of combinations of frequencies and voltages. If the integrated circuit fails testing within any combination of a frequency and voltage within the predetermined set, the integrated circuit is retested at a different predetermined set of combinations of frequencies and voltages. If the integrated circuit fails testing within any combination of a frequency and voltage within the different predetermined set, the integrated circuit is discarded.

Arrangements having IC voltage and thermal resistance designated on a per IC basis

An on-die device is provided to measure/detect voltage fluctuations. This may include a control unit to generate differential reference signals (such as differential current signals), a first detector unit and a second detector unit. The differential reference signals may be generated based on a Vcc reference signal and a Vss reference signal. The first detector unit may receive the differential reference signals from the control unit and may receive first voltage signals (also called monitored signals) from a first device under test (DUT) located on the die or from a first area on the die. The first detector unit may provide (or output) a first signal indicative of a voltage fluctuation (voltage droop or overshoot) of the first voltage signals. The second detector unit may receive the differential reference signals from the control unit and may receive second voltage signals (also called monitored signals) from a second device under test (DUT) located on the die. The second detector unit may provide (or output) a second signal indicative of a voltage fluctuation (or voltage droop) of the second voltage signals.

Method and apparatus for on-die voltage fluctuation detection

An on-die temperature control variable is provided to throttle a thermal actuator for cooling an integrated circuit. The integrated circuit includes a storage element to hold the temperature control variable. A temperature sensor is thermally coupled to the integrated circuit to sense an operating temperature of the integrated circuit. A thermal controller is communicatively coupled to the storage element and to the temperature sensor. The thermal controller throttles the thermal actuator when the temperature sensor indicates that the operating temperature of the integrated circuit is below the temperature control variable.

On-die temperature control data for communicating to a thermal actuator

Arrangements having integrated circuit (IC) voltage and thermal resistance designated on a per IC basis.

Testing arrangement to distribute integrated circuits

A method of testing an integrated circuit includes applying a voltage to one of the pins of the integrated circuit. The pin is floated for a predetermined time. A measurement is performed after the predetermined time. The measurement involves sampling the RC time constant of leakage current of the pins.

An integrated circuit includes circuitry to test input/output (I/O) devices. Test data is provided to a loopback circuit that drives data through the output buffer to the pad, and back onto the integrated circuit through the input buffer. Separate clock signals, with varying phase, are generated for input synchronous elements and output synchronous elements. The phase, and the relative time delay between the separate clocks, changes as an external clock is varied. The external clock is varied to verify the performance parameters of the I/O devices. Each I/O device includes a shift register that can be coupled to the other buffers in a chain, or can be configured to be in a loop.

I/O device testing method and apparatus

An apparatus that can determine whether a Tva parameter and a Tvb parameter of a device under test (DUT) complies with a design specification where the device under test is coupled to a secondary device. The Tvb parameter corresponds to a setup time of the secondary device. The Tva parameter corresponds to the hold time of the secondary device. The apparatus allows the DUT to be coupled to a secondary device that normally operates with the DUT. The apparatus writes data to the DUT and secondary device. The data is then written back to the apparatus which then determines whether the DUT complies with the Tvb and Tva design specifications. The apparatus may also implement tunable delay circuits to compensate for different setup and hold times of the secondary device.

Test and characterization of source synchronous AC timing specifications by trace length modulation of accurately controlled interconnect topology of the test unit interface

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Tigard, OR, United States of America

Tawfik Arabi