Shin-etsu Chemical Co., Ltd.

Tatsuya Yamazaki

Tsutomu Kashiwagi

Miyuki Wakao

A thermosetting silicone resin composition contains the following components (A-1) to (D): (A-1) an alkenyl group-containing linear organopolysiloxane; (A-2) a branched organopolysiloxane shown by (RSiO)(RSiO)(SiO)(1); (B-1) a branched organohydrogenpolysiloxane shown by (HRSiO)(RSiO)(SiO)(2); (B-2) a linear organohydrogenpolysiloxane shown by (RSiO)(HRSiO)(RSiO)(3); (C) an adhesion aid which is an epoxy group-containing branched organopolysiloxane; and (D) a catalyst containing a combination of a zero-valent platinum complex with a divalent platinum complex and/or a tetravalent platinum complex. This provides a thermosetting silicone resin composition which causes little contamination at a gold pad portion and has excellent adhesiveness to a silver lead frame.

Thermosetting silicone resin composition and die attach material for optical semiconductor device

Provided is a silicone resin composition having a low level of contamination to gold pad portions on an LED chip during curing of the composition and is excellent in adhesiveness to the silver lead frame on a substrate formed of a reflector member. An addition-curable silicone resin composition comprising (A-1) a linear organopolysiloxane having, per molecule, two or more alkenyl groups having 2 to 8 carbon atoms, (A-2) a branched organopolysiloxane having, per molecule, two or more alkenyl groups having 2 to 8 carbon atoms, (B-1) a branched organohydrogenpolysiloxane, wherein the weight average molecular weight of the polysiloxane and the content of SiH group-containing organosilicon compounds having 1 to 10 silicon atoms are each in a specified range, (B-2) a linear organohydrogenpolysiloxane, wherein the content of SiH group-containing organosilicon compounds having 1 to 10 silicon atoms is in a specified range, and (C) an addition reaction catalyst.

Addition-curable silicone resin composition and die attach material for optical semiconductor device

An addition-curable silicone resin composition includes (A-1) a linear organopolysiloxane having at least two alkenyl groups per molecule, (A-2) a terminal alkenyl group-containing branched organopolysiloxane having at least two alkenyl groups per molecule, (B) an organohydrogenpolysiloxane with a content of low-molecular-weight siloxane having a degree of polymerization of up to 10 and one or more terminal SiH group per molecule of 5 wt % or less, and (C) an addition reaction catalyst. The composition can be cured to form a product which, when used as a die attach material for optical semiconductor devices, minimizes contamination of the gold electrode pads on LED chips and imparts a good wire bondability.

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Annaka, Japan

Tatsuya Yamazaki