Denso Corporation

Denso Corportion

Tatsuya Watanabe

Masahiko Imoto

Yoshinari Goshima

Yasunori Kawamoto

Hideyuki Iiboshi

Shinichi Awano

Yozo Iwai

A pressure sensor is provided. The pressure sensor includes a body, a sensing element, and a projection part. The body has an internal space and an introduction passage. The internal space is in communication with an outside of the body through the introduction passage. The sensing element is disposed in the internal space of the body and capable of detecting pressure of air in the internal space. The projection part is disposed in the internal space of the body or the introduction passage of the body, and inhibits liquid from entering the internal space.

Pressure sensor with water restriction plate

A metal wiring plate includes a soldering portion to which an electronic device is soldered and a wiring portion extending from the soldering portion and configured to electrically connect the electronic device to other device. The wiring portion includes a narrow portion located adjacent to the soldering portion. The width of the narrow portion is less than the width of the soldering portion so that the narrow portion helps prevent melted solder applied to the soldering portion from spreading to areas outside the soldering portion. The narrow portion allows the electronic apparatus to be surely soldered to the soldering portion without using solder resist.

Metal wiring plate

A resin leak detector includes a pressure sensor element and a leak determination unit. The pressure sensor element detects a pressure in a case cavity. That is, when resin leaks into a space between an upper circuit case and a lower circuit case, the pressure in the case cavity decreases temporarily. The decrease of the pressure in the case cavity is detected by the pressure sensor element based on comparison between a detected pressure and a predetermined lower limit. The resin leak into the upper and lower circuit case is detected without cutting an outer case of an electronic device such as an acceleration sensor or the like.

Apparatus and method for detecting resin leak

In a method of manufacturing an electronic device, an electronic element is disposed on a wiring plate that is electrically coupled with a connector terminal, a first surface of the wiring plate is covered with a first casing element and a second surface of the wiring plate is covered with a second casing element to form an electronic circuit part, the electronic circuit part is disposed in a case cavity of a molding tool, and a resin is filled into the case cavity to form the resin-molded case while keeping a state where a first pressure that pushes the first casing element toward the wiring plate and that changes with time is substantially equal to a second pressure that pushes the second casing element toward the wiring plate and that changes with time.

Method of manufacturing electronic device having resin-molded case and molding tool for forming resin-molded case

A semiconductor device includes: a semiconductor chip; a package for accommodating the chip, wherein the package has a box shape with an opening and a bottom; and a cover for sealing the opening of the package. The semiconductor chip is disposed on the bottom of the package. The cover has a plate shape. The cover includes a protrusion, which is disposed at a center of the plate shape. The protrusion protrudes toward an outside of the package.

Physical quantity sensor and semiconductor device having package and cover

A method for manufacturing a resin mold includes the steps of: attaching a transmitting resin member capable of transmitting a laser beam and an absorbing resin member capable of absorbing the laser beam; and irradiating the laser beam on an interface between the transmitting resin member and the absorbing resin member from a surface of the transmitting resin member so that a welding spot is formed on the interface and the transmitting resin member and the absorbing resin member are welded. The laser beam is irradiated homogeneously on the interface by a homogenizer so that a center portion of the welding spot and an outer portion of the welding spot are heated homogeneously by the laser beam.

Growing community of inventors

Anjo, Japan

Tatsuya Watanabe