Murata Manufacturing Co., Ltd.

Tatsuya Ueda

Koji Furutani

Norio Nakajima

Mitsuhide Kato

Ken Tonegawa

Koji Tanaka

Masato Nomiya

Akira Baba

Kimihide Sugou

Satoshi Asakura

In a multilayer ceramic substrate manufactured by a non-shrinking process, a bonding strength of an external conductive film formed on a primary surface of the multilayer ceramic substrate is increased. After a laminate of a multilayer ceramic substrate is formed from first ceramic layers and second shrinkage suppressing ceramic layers, and an underlayer is formed along one primary surface of the multilayer ceramic substrate, an external conductive film is formed on the underlayer. A non-sintering ceramic material powder in a non-sintered state is included in both the external conductive film and the underlayer, and this non-sintering ceramic material powder is fixed due to diffusion of a glass component from the first ceramic layers.

Multilayer ceramic substrate and method for manufacturing the same

A multilayered ceramic substrate is produced by laminating and sintering insulating ceramic layers and one or more dielectric ceramic layers. The insulating ceramic layer is composed of a BaO&mdash;Al O -SiO low temperature sintering ceramic material. The dielectric ceramic layer is composed of a dielectric ceramic material containing a dielectric ceramic component represented by BaO&mdash;TiO -(Nd Me )O wherein Me is a lanthanoid and 0&lE;m&lE;1.0, and a glass component of about 20.0 to 65.0 mole percent of barium oxide, about 5.0 to 50.0 mole percent of silicon oxide and about 10.0 to 50.0 mole percent of boron oxide.

Dielectric ceramic composition and multilayered ceramic substrate

A composite high-frequency component is designed to occupy a smaller area and a smaller volume when mounted in an apparatus, can be located in the apparatus with improved flexibility, and is able to operate without an impedance matching circuit. The composite high-frequency component includes a multilayer substrate, diodes constituting a high-frequency switch component, and a circuit base. External terminals for connection to a transmitting circuit, a receiving circuit and an antenna, external terminals for control and an external terminal for connection to ground potential are formed on an outer surface of the multilayer substrate. Strip lines and capacitors constituting the high-frequency switch and strip lines and capacitors constituting a low-pass filter circuit are formed in the multilayer substrate.

Composite high-frequency component

A composite high frequency apparatus includes a high frequency filter and a high frequency switch which have a substantially reduced size and do not require an impedance matching circuit. The apparatus includes a multilayered base having an outer surface with a plurality of diodes, an external ground electrode, an external electrode for a transmission circuit, an external electrode for a receiving circuit, an external electrode for an antenna circuit and external electrodes for control terminals located thereon. A plurality of strip lines, capacitor electrodes and an external grounding electrode are located within the multilayered base.

Composite high frequency apparatus and method of forming same

A compact high frequency hybrid switch suitably operated in a diversity-type antenna system. A high frequency hybrid switch is comprised of: first to fourth ports; a first high frequency switch circuit for switching a connection established between the first port and the third port; and a second high frequency switch circuit for selecting one from two connections respectively established between the first port and the fourth port, and between the second port and the fourth port. The first and second high frequency switch circuits include respective series and parallel arrangements of diodes, capacitors and distributed constant signal lines which reduce the size and improve the reliability of the switch.

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Kyoto, Japan

Tatsuya Ueda