Ricoh Company, Ltd.

Tatsuya Tsuyuki

Shigeru Fujita

Hiroshi Takemoto

Yoshihiro Morii

Jun Ando

Shigeo Kobayashi

Jun Andoh

The present invention is made to provide a fixing structure for solid state image forming device made inexpensively and easily by simple caulking adhering method with keeping high positional accuracy, by which it is achieved that the solid state image forming device can be separated easily from the image focusing lens holding member when the image focusing lens holding member has a defect. In the fixing structure of present invention, an image focusing lens holding memberand an intermediate holding memberare adhered by caulking adhering method. Because one or more projecting portionfor painting adhesive material formed on the image focusing lens holding memberhave smaller area than that of bottom surfaceof the intermediate holding membera spaceis formed between the image focusing lens holding memberand the intermediate holding memberthe solid state image forming devicefixed on the intermediate holding membercan be easily separated from the image focusing lens holding memberby inserting and turning a toolwhose width of top portion is smaller than the width of space

Fixing structure for solid state image forming device, image data input unit and image data input apparatus including the same

Disclosed is a solid state image sensing device. The solid state image sensing device comprises a semiconductor chip for image sensing which has at least one of photoelectric conversion element line; and a package into which the semiconductor chip is received. The package is composed of an insulating package body which has the semiconductor chip mounted on a flat inner bottom surface of a concave portion; a transparent cover glass to be fixed on an upper surface of an outer frame of the concave portion for sealing the concave portion; and a lead frame which is brought out to the outside of the package body. The solid state image sensing device has a reference plane for attaching onto an image input apparatus is arranged on the package. The reference plane for attaching is made parallel to the inner bottom surface of the concave portion on which the semiconductor chip is mounted.

Supporting structure for a solid state image sensing device

Disclosed is a member mounting structure and a member mounting apparatus for mounting a member such as a solid state image input unit in which mounting of the solid state image input unit can be achieved with high accuracy after positioning adjustment along five axes, yield of production can be increased, and at the same time, decrease of fixing force of the solid state image input unit after production (after adhesive material has been hardened) does not occur by means that positioning adjustment of the solid state image input unit along five axes is easily performed before adhering and fixing of the solid state image input unit. An intermediate holding member is disposed between a frame and the solid state image input unit so that a first adhered surface between the frame and the intermediate holding member, and a second adhered surface between the solid state image input unit and intermediate holding member are arranged parallely with pixel lines and at the same time, the first adhered surface and second adhered surface are arranged to make a right angle.

Growing community of inventors

Tokyo, Japan

Tatsuya Tsuyuki