Agc Inc.

Daiichi Pharmaceutical Co., Ltd.

Asahi Glass Company, Limited

Tatsuya Terada

Takashi Sato

Tomoya Hosoda

Toru Sasaki

Wataru Kasai

Nobutaka Kidera

Atsumi Yamabe

Makoto Ono

Yukio Sato

Shigeki Kobayashi

Masatoshi Abe

Eiichi Nishi

Shinji Kamihara

Hiroaki Kitaoka

Keiji Uchiyama

Mai Nishi

Atsumi Mitsunaga

Sota Yuki

Tohru Kaneuchi

To provide a reinforced glass container which has impact resistance and which can be used for treatment involving exposure to high temperatures or ultraviolet irradiation. The reinforced glass container of the present invention comprises a glass container and a polymer layer provided on the outer surface of the glass container and having a thickness of more than 1 μm, wherein the polymer layer contains a tetrafluoroethylene type polymer having a melting temperature of more than 260° C. and having carbonyl group-containing groups or hydroxy group-containing groups.

Reinforced glass container, method for producing pharmaceutical container, and method for producing reinforced glass container

A heat-resistant film that has high adhesion and low warping, a method for producing the film, and a metal-clad laminate and a coated metal conductor, using the film. The film includes an aromatic polyimide base film, and a layer containing a polymer having units based on tetrafluoroethylene and units based on a perfluoro(alkyl vinyl ether) and an aromatic polymer, formed on each side of the base film.

Film, method for producing film, metal-clad laminate, and coated metal conductor

The purpose of the present invention is to provide a fluororesin film or fluororesin laminate excellent in heat resistance and excellent in interlayer adhesion to an object to be laminated, such as a prepreg, a method for producing a hot pressed laminate using said film or laminate, and a method for producing a printed circuit board. The fluororesin film contains a fluororesin having a melting point of from 260 to 380&#xb0; C., and has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 &#x3bc;mof at least one surface thereof in the thickness direction is measured by an atomic force microscope. The laminatehas a layer Acontaining said fluororesin and a layer Bmade of another substrate, wherein the layer Ahas an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 &#x3bc;mof a second surfacethereof is measured by an atomic force microscope.

Fluororesin film and laminate, and method for producing hot pressed laminate

To provide a liquid composition whereby a resin powder can be uniformly dispersed in a resin or the like without being scattered, and a method for producing a film, a laminate or the like by using the liquid composition. The liquid composition comprises a liquid medium and a resin powder dispersed in the liquid medium, and characterized in that the average particle size of the resin powder is from 0.3 to 6 &#x3bc;m, the volume-based cumulative 90% diameter of the resin powder is at most 8 &#x3bc;m, and the resin powder is a resin containing a fluorinated copolymer having a specific functional group. And, the method is a method for producing a film, a laminate or the like by using the liquid composition.

Liquid composition, and method for producing a film and a laminate by using the liquid composition

To provide a fluorinated copolymer composition having improved impact resistance and excellent moldability without impairing the excellent heat resistance and mechanical properties inherent to a thermoplastic heat-resistant resin. This fluorinated copolymer composition comprises a thermoplastic resin A being a melt-moldable heat-resistant thermoplastic resin and a fluorinated elastomer B being a fluorinated elastic copolymer, wherein the fluorinated elastomer B is dispersed in the thermoplastic resin A, the number average particle diameter of the fluorinated elastomer B is from 1 to 300 &#x3bc;m, the volume ratio of the thermoplastic resin A to the fluorinated elastomer B is from 97:3 to 55:45, and the fluorinated copolymer composition has a flexural modulus of from 1,000 to 3,700 MPa.

Fluorinated copolymer composition, method for its production, and molded product

To provide a laminate having a fluororesin layer and a thermoplastic resin layer laminated with a good adhesive strength. A method for producing a laminate, comprising carrying out heat lamination of a fluororesin film containing the following fluororesin (A) and a thermoplastic resin film containing a thermoplastic resin (B) having a melting point higher by at least 5&#xb0; C. than the melting point of the fluororesin (A), at a temperature of at least a melting point of the fluororesin (A) and lower than a melting point of the thermoplastic resin (B). The fluororesin (A) is a fluororesin having at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and having a melt flow rate of from 0.5 to 30 g/10 min at 372&#xb0; C. under a load of 49N.

Laminate, printed circuit board and method for producing laminate

To provide a wiring substrate having excellent transmission characteristics, of which initial failure of a plating layer formed on an inner wall surface of a hole is suppressed regardless of the type of the pre-treatment applied to the inner wall surface of the hole, and of which the plating layer has favorable heat resistance, and a process for producing it. A wiring substratecomprising an electrical insulator layera first conductor layerformed on a first surface of the electrical insulator layera second conductor layerformed on a second surface of the electrical insulator layerand a plating layerprovided on an inner wall surface of a holewhich opens from the first conductor layerthrough the second conductor layerwherein the electrical insulator layerhas a heat resistant resin layercontaining a heat resistant resin and a resin powder; the resin powder is formed from a resin material containing a melt-formable fluororesin having a functional group such as a carbonyl group-containing group; the content of the resin powder is from 5 to 70 mass % to the heat resistant resin layerand the electrical insulator layerhas a dielectric constant of from 2.0 to 3.5.

Wiring substrate and process for producing it

To produce a wiring substrate having excellent electrical characteristics with conduction failure in a hole formed in a layer made of a fluororesin material sufficiently suppressed without conducting an etching treatment using metal sodium. A process for producing a wiring substrate, which comprises forming a hole in a laminate comprising a first conductor layer, a layer (A) which is made of a fluororesin material containing a melt-moldable fluororesin having specific functional groups and a reinforcing fiber substrate and which has a dielectric constant from 2.0 to 3.5, a second conductor layer, an adhesive layer and a layer (B) made of a cured product of a thermosetting resin laminated in this order, applying, to an inner wall surface of the hole, either one or both of a treatment with a permanganic acid solution and a plasma treatment without conducting an etching treatment using metal sodium, and then forming a plating layer.

Process for producing wiring substrate

A fluorinated resin composition includes a copolymer (A); and a copolymer (B). A mass ratio (A/B) of the copolymer (A) to the copolymer (B) is from 60/40 to 99/1, and a volume flow rate is from 0.5 to 100 mm/sec. The copolymer (A) comprises: units derived from a monomer (a) which is tetrafluoroethylene; units derived from a monomer (b) which is at least one member selected from ethylene, hexafluoropropylene and a perfluoro(alkyl vinyl ether). The copolymer (A) has carbonyl groups. The copolymer (B) comprises: units derived from the monomer (a); units derived from the monomer (b); and units derived from the monomer (c) having two or more polymerizable carbon-carbon double bonds. A content of the units derived from the monomer (c) is from 0.1 to 2 mol % based on total units in the copolymer (B).

Fluorinated resin composition

A fluorinated copolymer excellent in adhesion and elongation deformation processability. This fluorinated copolymer has carbonyl groups, its melting point is from 120 to 230&#xb0; C., the ratio (X/W) of the melt tension X (N) to the load W (N) at the time of measuring the melt tension X, is from 0.5&#xd7;10to 2.0&#xd7;10, it contains units derived from the following monomers (a), (b), and (c), the molar ratio of the units derived from the monomer (a) to the units derived from the monomer (b) is from 30/70 to 70/30, and the total content of the units derived from the monomer (a) and the units derived from the monomer (b) is from 80 to 99.995 mol % based on the total of all units (a), (b) and (c): Monomer (a): tetrafluoroethylene; Monomer (b): ethylene; Monomer (c): a monomer having two or more polymerizable carbon-carbon double bonds.

Fluorinated copolymer

An anhydrous crystal of a compound represented by the formula: R,&mdash;CH,CONH&mdash;R,wherein R,represents a substituted or non-substituted pyridyl group or substituted or non-substituted phenyl group and R,represents a substituted or non-substituted 2-oxo-1-pyrrolidinyl group, characterized in that said crystal is substantially free from hygroscopicity. For example, by drying a hydrous crystal of said compound at a temperature of 80&deg; C. or above under reduced pressure, an anhydrous crystal is provided that exhibits a weight increase of 1% or less when stored under the relative humidity of 83% at the temperature of 25&deg; C. for 30 days. By using the anhydrous crystal for the manufacture of a medicament comprising the compound as an active ingredient, a product with a constant content of the active ingredient can be obtained.

Anhydrous crystals

A process for preparing a 2-(1-pyrrolidinyl)acetamide derivative useful as a cerebral function improving agent is disclosed, comprising reacting a halogenoacetamide derivative with substituted or unsubstituted 2-pyrrolidinone, the halogenoacetamide derivative being prepared by reacting an amine and a halogenoacetyl chloride. High yields of the intermediate compound as well as the final product are attained at low cost.

Growing community of inventors

Chiyoda-ku, Japan

Tatsuya Terada