Kuraray Co., Ltd.

Kurarau Co., Ltd.

Tatsuya Sunamoto

Minoru Onodera

Tadao Yoshikawa

Takahiro Nakashima

Kazuyuki Ohmori

Shigeaki Suzuki

Shuji Matsunaga

Shinji Hiramatsu

Takafumi Konno

Takahiro Miyata

Katsunori Hatashi

Tetsuya Hara

Takeshi Takahashi

Toshinori Tsugaru

Michiyuki Nanba

Xianwen Zhang

A method producing thermoplastic liquid crystal polymer (TLCP) film(s) may include (i) preparing a TLCP film (adherend film) and a TLCP film (adhesive film); (ii) examining each TLCP film for relative intensity calculated as a ratio in percentage of a sum of peak areas of C—O bond peak and COO bond peak based on the total area of C1s peaks in the X-ray photoelectron spectroscopy (XPS) profile to calculate relative intensity X (%) for the adherend film and relative intensity Y (%) for the adhesive film; and (iii) controlling the TLCP film adhesive film to have a relative intensity Y by selection or activation treatment of the adhesive film so that the relative intensity X of the adherend film and the relative intensity Y of the adhesive film satisfy38≤≤65  (1), and−8.0≤≤8.0  (2).

Methods for manufacturing thermoplastic liquid crystal polymer film and circuit board

A thermoplastic liquid crystal polymer (TLCP) molded body including a thermoplastic polymer capable of forming an optically anisotropic melt phase. The TLCP molded body includes an adherend portion in at least a part of the TLCP molded body. The adherend portion has a surface satisfying: a ratio <C—O>/<COO> of 1.5 or greater in which the <C—O> represents a proportion of a peak area of [C—O bond] to a C(1s) peak area, and the <COO> represents a proportion of a peak area of [COO bond] based on the C(1s) peak area; and a ratio <C═O>/<COO> of 0.10 or higher in which the <C═O> represents a proportion of a peak area of [C═O bond] based on the C(1s) peak area, and the <COO> represents the proportion of the peak area of the [COO bond] based on the C(1s) peak area in a result of X-ray photoelectron spectroscopy analysis.

Thermoplastic liquid crystal polymer molded body and method for manufacturing same

Provided is a thermoplastic liquid crystal polymer film (TLCP film) having a dielectric constant in a thickness direction of the film, which is suitable for a millimeter-wave radar substrate. The TLCP film is a film comprising a thermoplastic polymer capable of forming an optically anisotropic melt phase, wherein the TLCP film has a dielectric constant of from 2.5 to 3.2 in the thickness direction of the film at a temperature of 23° C. and a frequency of 20 GHz, and a heat deformation temperature of from 180 to 320° C. The TLCP film has, on a film plane, dielectric constants of from 2.6 to 3.7 at a temperature of 23° C. and a frequency of 15 GHz both in one direction of the film and in a direction perpendicular to the one direction of the film.

Thermoplastic liquid crystal polymer film and circuit board using same

Provided is an acoustic diaphragm with required properties for a vibrating part and an edge part thereof. The acoustic diaphragm comprises a vibrating partand an edge partlocated at an outer periphery of the vibrating part, wherein the vibrating part comprises a thermoplastic liquid crystal polymer (TLCP) having a certain composition; the edge part comprises a TLCP having a same composition as the TLCP of the vibrating part; and the vibrating partand the edge parthave elastic moduli Eand Emeasured by nanoindentation technique, respectively, which satisfy the following formula: E&#x3e;E. For example, a ratio E/Eof the elastic modulus Eof the vibrating partto the elastic modulus Eof the edge partmay fall within a range of from 1.05 to 5.0.

Acoustic diaphragm, manufacturing method therefor, and acoustic device

Provided are a thermoplastic polymer capable of reducing a dielectric dissipation factor in high frequency bands and a film thereof. The thermoplastic liquid crystal polymer includes repeating units represented by the following formulae (I), (II), (III) and (IV), in which a molar ratio of a total amount of the repeating units represented by formulae (I) and (II) to a total amount of all the repeating units in the thermoplastic liquid crystal polymer is 50 to 90 mol %, and a molar ratio of the repeating unit represented by formula (III) to the repeating unit represented by formula (IV) is the former/the latter=23/77 to 77/23.

Thermoplastic liquid crystal polymer and film of same

A metal-clad laminate () includes a thermoplastic liquid crystal polymer film (), a metal deposition layer () formed on one surface of the thermoplastic liquid crystal polymer film (), and metal foil () laminated to the other surface of the thermoplastic liquid crystal polymer film ().

Metal-clad laminate and manufacturing method for same

Provided is a method of manufacturing a circuit board including preparing a board structural body () and covering a conductor circuit element () on an outermost layer of the board structural body () with a cover film (), wherein a heat treatment is performed while having a release material () interposed between the cover film () and a heat-processing device. The release material () is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film () selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (), a first high-density polyethylene film (), a second high-density polyethylene film (), and a second aluminum foil (). The first high-density polyethylene film () and the second high-density polyethylene film () are positioned such that respective MD directions are perpendicular to each other.

Release material

Circuit board

To provide a thermoplastic liquid crystal polymer film capable of suppressing change in relative dielectric constant before and after heating, and a laminated and a circuit board using the same. In this film, a change ratio of a dielectric constant (&#x2208;) of the film after heating to a dielectric constant (&#x2208;) of the film before the heating satisfies the following formula (I) where the film is heated for 1 hour at a temperature in a range from a temperature being 30&#xb0; C. lower than a melting point of the film to a temperature being 10&#xb0; C. higher than the melting point,|&#x2208;&#x2212;&#x2208;|/&#x2208;&#xd7;100&#x2266;5&#x2003;&#x2003;(I)

Thermoplastic liquid crystal polymer film, and laminate and circuit board using same

A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection pad and a first opposite connection pad and a first power supply path connected between the first connection pad and the first opposite connection pad and a second flexible circuit board that includes at least one second connection pad and a second opposite connection pad and a second power supply path connected between the second connection pad and the second opposite connection pad, and the first flexible circuit board is stacked, in a vertical direction, on the second flexible circuit board in such a way that the first power supply path and the second power supply path form a parallel-connected power supply path that serves as a power path or a grounding path for the first flexible circuit board.

Circuit board and method for manufacturing same

Circuit board and method of manufacturing same

A method of making a multi-layer circuit board that has a first film and at least two more films, second and third films, each being made of a thermoplastic polymer capable of forming an optically anisotropic melt phase, the first film having a low melting point, the second and third films having respective melting points higher than the melting point of the first film and at least one of the second and the third films having a circuit pattern thereon, and the first to third films are thermo compressed together with the first film interposed between the second and third films. This method entails causing at least one of the circuit patterns on one of the second and third films to contact an opposing surface of the other of the second and third films through the first film during the thermo compression bonding of the first to third films.

Multi-layer circuit board and method of making the same

A method of making a thermotropic liquid crystal polymer film includes continuously heat treating of the thermotropic liquid crystal polymer filmwhile the latter is jointed to a sheet-like support member, and subsequently separating the heat-treated thermotropic liquid crystal polymer filmfrom the support member. The continuous heat treatment of the thermotropic liquid crystal polymer filmthen jointed to the support memberis carried out for a predetermined heating time within the range of 5 to 60 seconds at a predetermined heating temperature T&#xb0; C. equal to or higher than the melting point Tm&#xb0; C. of the thermotropic liquid crystal polymer film less 15&#xb0; C. (i.e., Tm&#x2212;15&#xb0; C.), but lower than the melting point Tm&#xb0; C. (thus, Tm&#x2212;15&#xb0; C.&#x2266;T&#xb0; C.&#x3c;Tm&#xb0; C.), to thereby increase the thermal expansion coefficient of the thermotropic liquid crystal polymer film.

Method of making liquid crystal polymer films

The method of manufacturing a film of thermotropic liquid crystal polymer includes extruding a thermotropic liquid crystal polymer of a kind in which any one of activation energies Ea1 and Ea2 of a melt viscosity is within the range of 30 to 90 kcal/mol, with the ratio (Ea1/Ea2) of the activation energy Ea1 relative to the activation energy Ea2 being within the range of 1 to 1.7. The activation energies Ea1 and Ea2 are measured by means of a capillary rheometer, including a nozzle of 1 mm in inner diameter and 10 mm in length disposed at an angle of introduction of 90&#xb0; and a barrel of 9.55 mm in inner diameter, at respective shear rates of 243 secondsand 2432 secondsunder a temperature ranging from the temperature [(Tm&#x2212;10)&#xb0; C.], which is lower by 10&#xb0; C. than the melting point [(Tm)&#xb0; C.] of the thermotropic liquid crystal polymer, to the temperature [(Tm+20)&#xb0; C.], which is higher by 20&#xb0; C. than the melting point [(Tm)&#xb0; C.] of the thermotropic liquid crystal polymer. The thermotropic liquid crystal polymer also has a melt viscosity of not lower than 400 poises measured under predetermined conditions, and is extruded from a die that is heated to a temperature of predetermined range.

Film forming method

An apparatus for making an inflation film formed by extruding a raw resin in a molten state through a circular die to form a tubular film, and expanding the tubular film by the pressure of a gaseous medium introduced into an inner space thereof, while the tubular film is being cooled. The apparatus includes a cooling ring, at least one air ring coaxial with the circular die, and an adjusting device for adjusting the temperature of a gaseous medium, blown from the air ring, to a range effective to retain the tubular film, then still in a molten phase, in a condition in which the tubular film is inflated. A method for making an inflation film is also disclosed.

Growing community of inventors

Chiyoda-ku, Japan

Tatsuya Sunamoto