Mitsubishi Electric Corporation

Elpida Memory, Inc.

Tokyo University of Science Educational Foundation Administrative Organization

Tatsuya Sakamoto

Hitoshi Arai

Tomohiro Takahashi

Toru Fukasawa

Kanji Oishi

Akihito Hirai

Tsutomu Iida

Takamichi Kono

Kenjiro Takanishi

Narihiro Nakamoto

Gen Koshita

Naoya Noguchi

Kei Yokokawa

Keisuke Fujiwara

Kensuke Iwaki

Yohiko Mito

Yasuhiko Honda

Hirokuni Nanba

Yutaka Taguchi

A composite printed wiring board includes a first printed wiring board, a second printed wiring board, an intermediate plate, a first bonding layer, and a second bonding layer. The intermediate plate is provided to surround a space. The first printed wiring board closes one side of the space and is bonded to the intermediate plate. The second printed wiring board closes the other side of the space and is bonded to the intermediate plate. At least any of the first printed wiring board and the second printed wiring board has a through hole. A cavity is provided that is the space surrounded by the first printed wiring board, the second printed wiring board, the intermediate plate, the first bonding layer, and the second bonding layer. The through hole in communication with the cavity.

Composite printed wiring board and method of manufacturing composite printed wiring board

Antenna

A composite printed wiring board that allows for reflow heating for mounting electronic components using solder includes a first printed wiring board, an intermediate member, a second printed wiring board, and a bonding layer. The intermediate member is stacked on the first printed wiring board. The intermediate member has a cavity. The second printed wiring board is stacked on a surface on the opposite side to a surface opposed to the first printed wiring board in the intermediate member. The bonding layer is arranged at a bonding section between the first printed wiring board and the intermediate member and at a bonding section between the second printed wiring board and the intermediate member. The bonding layer contains high melting point metal and low melting point metal. The melting point of the bonding layer is higher than the melting point of the low melting point metal.

Composite printed wiring board and method of manufacturing the same

A semiconductor memory integrated circuit having an X-row controller which includes a high-speed-operation control circuit by which when receiving a bank active signal, a period for stopping a latch circuit from receiving the X address is produced after a predetermined time has elapsed, and in the other periods, the latch circuit receives and holds the X address; a low-current-operation control circuit by which when receiving no bank active signal, the latch circuit stops receiving the X address, and when receiving the bank active signal, the latch circuit holds the X address after a predetermined time has elapsed; a circuit for selecting whether the bank active signal is output to the high-speed-operation control circuit or the low-current-operation control circuit; and a circuit for selecting whether the latch-circuit control signal from the high-speed-operation control circuit or the latch-circuit control signal from the low-current-operation control circuit is output to the latch circuit.

Semiconductor device and manufacturing method thereof

A semiconductor device includes internal voltage generating circuits, a switching circuit, load circuits, a control circuit. Each of the plurality of load circuits is supplied with voltage through the switching circuit from any one of the plurality of internal voltage generating circuits. The control circuit defines connecting combinations by the switch circuit. The control circuit supplies a control signal to the switch circuit, based on the control signal corresponding to the definitions of the connecting combinations. The control circuit allows switching the connecting combinations when the semiconductor device tests in a test mode. The control circuit prohibits switching the connecting combinations in a non-test mode. The switch circuit connects between each of m of the internal voltage generating circuits and each of n of the load circuits through a connecting combination which is selected, based on the control signal, from mof the connecting combinations.

Semiconductor device

Semiconductor memory integrated circuit

Growing community of inventors

Tokyo, Japan

Tatsuya Sakamoto