Hitachi Cable, Inc.

Asmo Co., Ltd.

Nec Electronics Corporation

Tatsuya Ohtaka

Takashi Aoyama

Sachio Suzuki

Hiroshi Sugimoto

Shigeharu Takahagi

Gen Murakami

Yukio Ikeda

Kenji Uchida

Yoshikazu Hayakawa

Tomiya Abe

Manabu Kato

Koki Hirasawa

Masaaki Shimizu

Ryousuke Sakamaki

Takaharu Yonemoto

Osamu Yoshioka

Akira Yamaura

Akihiro Tanba

Akio Hattori

Kouichi Sato

Toshimichi Matsusaki

Kazuhisa Kishino

Teruji Sato

Kazuhisa Hatano

A foreign objection detection sensor has a lengthy sensor part having a sensor electrode having a first sensor electrode which detects a proximity of a foreign object and a second sensor electrode which detects a contact of the foreign object, a sensor terminal part provided at one end of the sensor part, a leading wire pulled out from the sensor terminal part, the leading wire being electrically connected to the sensor electrode at the sensor terminal part to provide a proximity detecting function for detecting the proximity of the foreign object to the sensor part and a contact detecting function for detecting the contact of the foreign object to the sensor part. The sensor terminal part has a support member which supports a detection circuit unit electrically connected to the sensor electrode to carry out the proximity detecting function and the contact detecting function together with the sensor electrode. The detection circuit unit is disposed in the support member.

Foreign object detection sensor and method for manufacturing the same

A cord switchhas wire electrodesA,B spirally arranged along an inner surface of a hollow partof a hollowed insulatorin a longitudinal direction such that the wire electrodes do not electrically contact with each other, an outer electrodeprovided around an outer periphery surface of the hollowed insulatorand jacketed with an insulating layer. An electrostatic capacitance is formed between the outer electrodeand a wire electrode for grounding, and a floating electrostatic capacitance is formed between the outer electrodeand the earth. The close approach of the human body to the cord switchcan be detected in a non-contact manner by measuring the alteration in the electrostatic capacitance.

Cord switch and detecting apparatus using the same

A torque sensoris provided with two shafts(input shaftand output shaft) which constitute a shaft member, which is a torque detection object, an elastic memberwhich connects the shaftsandcoaxially, and a torsion angle of the elastic memberis detected as a torque which affects on the shaft member. The torque sensoris provided with a hard magnetic memberwhich generates a magnetic flux therearound, a pair of first soft magnetic memberswhich constitute a first magnetic circuit Htogether with the hard magnetic memberto change a reluctance by torsion of the elastic member, a pair of second soft magnetic memberswhich constitute a second magnetic circuit Htogether with the hard magnetic memberto keep the reluctance constant, and a flux detection meanswhich detects a flux density of the second magnetic circuit Hthat varies in accordance with a torsion angle of the elastic member

Torque sensor

A recess for fully receiving an electronic component and a window opened from the bottom of the recess to the bottom surface of a metal substrate are formed in the metal substrate. A wiring board is bonded to the underside of the metal substrate, and the electronic component is fixed to the bottom of the recess. Input and output terminals of the electronic component are connected to electrode pads of the wiring board exposed within the window using wire bonding. A metal lid is bonded to the top surface of the metal substrate to close the opening of the recess. Electromagnetic waves generated by the electronic component are confined to the electronic device because the electronic device is surrounded by the metal substrate, the metal lid, and a ground electrode disposed on the wiring board. Heat dissipation performance is assured because the electronic component is connected to the metal substrate.

Electronic device capable of preventing electromagnetic wave from being radiated

A wiring board with microstrip structure has: a first conductor layer that is provided with conductor wirings to be connected to a semiconductor chip in its external terminal (bonding pad); a second conductor layer that is provided with a conductor pattern connected through a via to a ground wiring, for supplying a power supply of ground potential to the semiconductor chip; and a third conductor layer that is provided with a power supply terminal connected through a via to a power supply wiring for supplying an operation power supply of a potential other than the ground potential to the semiconductor chip, a signal terminal connected through a via to a signal wiring for transmitting an electric signal, and a ground terminal connected through a via to the conductor pattern in the second conductor layer.

Wiring board and process for producing the same

A TAB tape with a stiffener is prepared by bonding a one-metal TAB tape having a structure wherein a circuit pattern is formed on either surface of a first tape base material, a part thereof is covered with an insulating film , and a via hole is defined on a connecting regional section for via, to a tape for second metal prepared by providing a metallic foil layer on either surface of a second tape base material through an adhesive layer ; the connecting regional section for via on the upper edge of a via hole is electrically connected with a part of the metallic foil layer on the bottom of the hole by means of conducting means ( , and ), and at the same time, an exposed portion of the metallic foil layer , which has not been covered with the one-metal TAB tape , is connected to an electrode of a ground line in the semiconductor by means of a bonding wire to lead a ground potential. Thus, an inexpensive TAB tape with a stiffener having equivalent electrical characteristics to that in the case where a conventional two-metal and one-base material TAB tape is used, and a TBGA semiconductor device using such TAB tape with a stiffener is obtained.

Tab tape with stiffener and semiconductor device using same

A semiconductor device has a semi-conductor chip 1 having bonding pads 2 thereon, conductive leads 4, each of which comprises an inner lead 41 and an outer lead 42, insulating adhesive tapes 3 by which each of the inner leads 41 of the leads 4 is stuck to the surface 1a of the semiconductor chip 1, bonding wires 6 by which each of the leads 4 is electrically connected to each corresponding bonding pad 2. The semiconductor chip 1, bonding pad 2, adhesive tapes 3, inner leads 41, and bonding wires 6 are molded by a molding resin 5. The boundary of the inner lead 41 and the cuter lead 42 of the lead 4 is bent in S-shape so that there is a step between inner lead 41 and the upper side portion 42a of the outer lead 42 in a certain depth. Then the outer lead 42 protrude out of the molding resin and extend in J-shape. The surface 4a of the upper side portion 42a of the outer lead 42 is higher than the top of the looped bonding wire 6.

Semiconductor device having lead on chip structure

Growing community of inventors

Hitachi, Japan

Tatsuya Ohtaka