Mitsubishi Materials Corporation

Tatsuya Numa

Masayuki Ishikawa

Kazuhiko Yamasaki

Kotaro Masuyama

The invention provides a power module substrate with a heat sink, which includes a power module substrate provided with an insulating substrate, a circuit layer provided on one surface of the insulating substrate and a metal layer provided on the other surface of the insulating substrate. The heat sink is bonded to the power module substrate via a bonding layer () to a surface on an opposite side to the insulating substrate of the metal layer. Bonding layer is a sintered body of silver particles, a porous body having a relative density in a range of 60% or more and 90% or less, and having a thickness in a range of 10 &#x3bc;m or more and 500 &#x3bc;m or less.

Growing community of inventors

Kobe, Japan

Tatsuya Numa