Mitsubishi Engineering-plastics Corporation

Tatsuya Kikuchi

Yasushi Yamanaka

Hiromitsu Nagashima

Ryusuke Yamada

Yuki Hiwatashi

Masahide Sugiyama

A thermoplastic resin composition contains 10 to 90% by mass of (A) thermoplastic resin; 1 to 20% by mass of (B) laser direct structuring additive; and 0.3 to 7.0% by mass of (D) graphite, a total of the ingredient (A), the ingredient (B) and the ingredient (D) being always kept at 100% by mass or below, and a ratio by mass given by ingredient (B)/ingredient (D) being 1.0 to 20.

Thermoplastic resin composition, molded article, method for manufacturing thermoplastic resin composition, and, method for manufacturing plated molded article

Making formation of a plated layer on a surface of a resin molded article possible, without adding the LDS additive to the thermoplastic resin composition. Provided is a composition for forming a laser direct structuring layer, the composition comprising a water-compatible organic substance, water, and a laser direct structuring additive. Further provided is a kit having the composition for forming a laser direct structuring layer and a method for manufacturing a resin molded article with a plated layer, which uses the composition for forming a laser direct structuring layer.

Composition for forming laser direct structuring layer, kit, and method for manufacturing resin molded article with plated layer

Provided is a resin composition having higher platability. The resin composition contains at least two kinds of metals and also containing a conductive oxide having a resistivity of 5&#xd7;10&#x3a9;&#xb7;cm or less.

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Kanagawa, Japan

Tatsuya Kikuchi