Samsung Electronics Co., Ltd.

Tatsuya Ishimoto

Masato Kajinami

Takahiro Tokumiya

Shinji Ueyama

Fumitaka Moroishi

Masanori Izumita

Daisuke Nagatomo

Akihiro Komatsu

Yoshiaki Yukimori

Takamasa Sugiura

YoungBum Kim

Naoyuki Takada

Joongha Lee

Keiji Murata

A mounting device includes: a bonding head configured to hold a first object, a bonding stage configured to hold a second object, and a dual-field-of-view (FOV) optical system including an image sensor configured to simultaneously capture an image of a first alignment mark on the first object and an image of a second alignment mark on the second object to obtain a first image. At least one of the bonding head and the bonding stage is configured to adjust a relative position between the first object and the second object based on the first image, and bond the first object to the second object.

Mounting device and mounting method

A chip peeling apparatus may include a peeling device. The peeling device may include a plurality of vacuum adsorption holes and a plurality of first air blow holes arranged around the plurality of vacuum adsorption holes. The peeling device may be configured to peel a chip off a tape when the peeling device is arranged below a region of the tape on which the chip is attached, vacuum pressure is applied through the plurality of vacuum adsorption holes to adsorb the peeling device to the region of the tape, and a first air blow is directed through the plurality of first air blow holes to the region of the tape.

Chip peeling apparatus and chip peeling method using the same

A pressure heating apparatus that uniformly heats an object in a chamber in a short time includes a stage onto which the object is loaded; a heating light source that faces the stage, where the heating light source heats the object a non-contact manner while irradiating light onto the object; and a lower reflector disposed around the stage and that reflects light emitted from the heating light source toward the object.

Pressure heating apparatus

An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.

Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor device

A method of fabricating a semiconductor device with improved quality and an encapsulant are provided. The method may include coating a chip wafer including a plurality of semiconductor chips with an encapsulant, performing a pre-curing process to bring the encapsulant into a B-stage, dicing the chip wafer to divide the chip wafer into a plurality of semiconductor chips, forming a chip stack by stacking the semiconductor chip on the base wafer in such a way that a coupling electrode on the base wafer and a bump electrode of each of the semiconductor chips face each other with a conductive adhesive element interposed therebetween, performing a reflow process on the chip stack under pressurized gas to bond the coupling electrode and the bump electrode to each other with the conductive adhesive element interposed therebetween, and performing a post-curing process on the chip stack under pressurized gas to bring the encapsulant into a C-stage.

Method of fabricating semiconductor device and encapsulant

An apparatus for testing an object includes a moving unit configured to hold and move the object. A transmissive illuminating unit includes a light source generating light and a transmissive mask pattern. The transmissive mask pattern includes a first region configured to convert the light generated from the light source into a slit light, and a second region arranged in a movement direction of the object with respect to the first region to partially transmit the light generated from the light source. The transmissive illuminating unit is configured to project a measuring light, which is provided by transmitting the light generated from the light source through the transmissive mask pattern, to the object. A detecting unit is configured to receive a reflected light of the measuring light from the object and to detect a height and surface state of the object based on the reflected light.

Method of testing an object and apparatus for performing the same

A fluid pressure actuator including a fluid pressure cylinder having a first position detector and a second position detector, a piston body having a piston head and a rod, the piston head mounted on the rod and slidably accommodated in the fluid pressure cylinder, the rod including a first scale and a second scale, the first scale facing the first position detector and the first position detector configured to detect a position in a sliding direction of the piston body, the second scale facing the second position detector and the second position detector configured to detect a position of the rod in a rotation direction of the piston body, and a controller configured to perform a first positioning control of a position of the rod in the sliding direction and a second positioning control of the rod in the rotation direction may be provided.

Growing community of inventors

Yokohama, Japan

Tatsuya Ishimoto