Fuji Electric Co., Ltd.

Kyushu University

Fuji Electric Fa Components & Systems Co., Ltd.

Tatsuya Ganbe

Takeshi Watanabe

Kenji Okamoto

Nobuyuki Sekine

Daisuke Kawaguchi

Yuji Takematsu

Keiji Tanaka

Atsuomi Shundo

Mika Aoki

A transformer is configured to include a pair of cores that each have an inner leg, wherein a primary winding that is wound around a bobbin having a hollow into which the inner legs of the cores are inserted and that is hermetically sealed with resin material, and a secondary winding that has a hollow into which the inner legs of the cores are inserted and that is constituted of a conductor formed by die-cutting a metal plate into a ring are dispersedly arranged over the inner legs of the cores.

High-voltage and high-frequency insulation transformer

A method evaluates the mobility of a polymer composition in a high-temperature region of 150&#xb0; C. or above. The method for evaluating a physical property of a polymer composition, the method comprising the steps of: obtaining a thin film sample which is formed on a substrate and which comprises: a fluorescent probe including a fluorescent rare earth complex having a melting point of 200&#xb0; C. or higher; and a target polymer composition; and obtaining a relationship between a temperature and a fluorescent characteristic of the thin film.

Method for evaluating physical properties of polymer compositions

A soldering flux is disclosed which exhibits improved shape retention properties during printing, can inhibit sagging upon heating, and exhibits high electrical reliability between conductors. The soldering flux contains an epoxy resin, an organic carboxylic acid and, as a heat-resistant shape-retaining agent, and a plastic having a linear structure, wherein the epoxy resin and the organic carboxylic acid are blended so that the quantity of carboxyl groups in the organic carboxylic acid is 0.8 to 2.0 equivalents relative to 1.0 equivalent of epoxy groups in the epoxy resin, and the total quantity of the epoxy resin, the organic carboxylic acid and the plastic having a linear structure is 70 mass % or more relative to the total mass of the flux.

Cream solder composition

A resin composition for obtaining a cured resin material exhibiting improved heat resistance and a higher glass transition temperature is disclosed. The resin composition contains a resin selected from a) a thermosetting resin and a curing agent, or b) a thermoplastic resin, and an inorganic filler with an average particle diameter of 1000 nm or less.

Resin composition

An insulating member of the invention can include an epoxy resin, a first inorganic filler diffused in the epoxy resin and having an average particle diameter of 1 to 99 nm, and a second inorganic filler diffused in the epoxy resin and having an average particle diameter of 0.1 to 100 &#x3bc;m. The first and second inorganic fillers can be independent of each other, and can be selected from a group including AlO, SiO, BN, AlN, and SiN, and the blending ratios of the first and second inorganic fillers in the insulating member can be 0.1 to 7% by weight and 80 to 95% by weight respectively. A metal base substrate can be formed by forming a metal foil and a metal base on either surface of the insulating member.

Growing community of inventors

Asaka, Japan

Tatsuya Ganbe