Murata Manufacturing Co., Ltd.

Tatsuya Funaki

Atsushi Yamamoto

Kenji Nishiyama

Takeshi Furukawa

Noriyuki Inoue

Koshi Himeda

Shinya Kiyono

Tatsuya Kitamura

Chiharu Sakaki

Sho Fujita

Shunsuke Abe

Takehito Ishihara

Kinya Aoki

Yoshimasa Yoshioka

Haruhiko Ikeda

Ryoichi Morimoto

Jitsuho Hirota

A surface-mount passive component includes a passive element and a size conversion unit on which the passive element is mounted. The size conversion unit has a body, a plurality of first external terminals each of which is exposed on an element mount surface of the body and is electrically connected to a corresponding one of passive element external terminals of the passive element, a plurality of second external terminals exposed on a board-side mount surface of the body, and connection wires that electrically connect the first external terminals and the second external terminals. An area of the board-side mount surface is larger than an area of a first main surface of the passive element, and a total area of the plurality of second external terminals on the board-side mount surface is larger than a total area of the passive element external terminals on the first main surface.

Surface-mount passive component

A composite component that includes an interposer structure and an electronic component. The interposer structure includes a Si base layer having a first main surface and a second main surface facing each other, a rewiring layer on the first main surface, a through Si via electrically connected to the rewiring layer and penetrating the Si base layer, an interposer electrode facing the second main surface, and an adhesive layer. The electronic component has a surface and a component electrode on the surface and connected to the through Si via, and is located between the interposer electrode and the Si base layer such that the component electrode and the surface are adhered to the second main surface of the Si base layer with the adhesive layer interposed therebetween. The through Si via extends from the second main surface, penetrates the adhesive layer, and is electrically connected to the component electrode.

Composite component and method for manufacturing the same

An electrode-equipped passive component is an electrode-equipped passive component to be mounted on a mount target, and includes a passive component main body, an electrode provided on a mount surface of the passive component main body, and an underfill layer provided on the mount surface of the passive component main body. The underfill layer includes a thermosetting resin, a flux, and a solvent, and has a surface having a skin layer. The skin layer has tack power equal to or smaller than 25 mN/mmat room temperature and equal to or larger than 60 mN/mmat 40&#xb0; C.

Electrode-equipped passive component and collective body of electrode-equipped passive components

A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.

Semiconductor composite device and package board used therein

A capacitor is provided that includes an electrostatic capacitance forming portion with a first electrode/dielectric layer/second electrode structure, and a silicon portion. Moreover, the silicon portion is disposed on at least a part of a side of the electrostatic capacitance forming portion. When the capacitor is viewed in a thickness direction thereof, a region occupied by the silicon portion in a lower portion of the electrostatic capacitance forming portion is 50% or less.

Capacitor

A wafer level package which includes an IC chip; a rewiring layer on the IC chip; and a capacitor embedded in the rewiring layer.

Wafer level package and capacitor

An electronic element including an electronic element base and electrodes each of which has a first electrode having a surface composed of at least Al or an Al alloy and a second electrode composed of a metal nanoparticle sintered body and bonded to the first electrode. A bonding interface between the first electrode and the second electrode has a multilayer structure including, from the side of the first electrode to the side of the second electrode, (a) a first layer primarily composed of Al, (b) a second layer primarily composed of an Al oxide, (c) a third layer primarily composed of an alloy of Al and a constituent element of metal nanoparticles, and (d) a fourth layer primarily composed of the constituent element of the metal nanoparticles.

Electronic element that includes multilayered bonding interface between first electrode having aluminum-containing surface and second electrode composed of metal nanoparticle sintered body

A connection method and a connection structure, using solder bumps, for component-side pad electrodes and substrate-side pad electrodes, and inspecting methods for the connection state thereof which are adaptable to high density mounting, and which allow the miniaturization of the product formed by mounting a surface-mount component onto a substrate. Substrate-side pad electrodes are arranged inside a component-corresponding region A; the length of the substrate-side pad electrodes is set to be larger than that of the corresponding component-side pad electrode; an IC chip (surface-mount component) is placed on the substrate so that each of the solder bumps is opposed to a predetermined substrate-side pad electrode; and the solder bumps are melted by heating, thereby connecting each of the component-side pad electrodes and one of the substrate-side pad electrodes through the solder.

Growing community of inventors

Nagaokakyo, Japan

Tatsuya Funaki