Fujifilm Corporation

Tatsuya Fujinami

Manabu Tobise

Yoshiyuki Takase

Yukihiro Kaneko

Kenji Yamakawa

Motokazu Shimizu

Toshiya Takahashi

Masaru Inamura

Mikio Watanabe

Daisuke Hayashi

Shinsuke Takahashi

Hiroyuki Nishida

Norihiro Kadota

Jun Fujinawa

Kiyofumi Yamamoto

Kouji Tonohara

Tomoo Murakami

Masami Nakagame

Kiyoto Sato

Takashi Mitsuyasu

Kenichi Wakisaka

Meiki Ooseki

The present invention provides an imaging device and a time-lapse imaging method capable of simply realizing time-lapse imaging using a pan and tilt mechanism. In a preferred aspect of the present invention, an imaging device includes a pan and tilt mechanism that rotates an imaging unit in a horizontal direction and a vertical direction relative to a device body, transmits a live view image to a smartphone, displays the live view image on a display and input unit, and receives an instruction input for specifying camerawork in time-lapse imaging using the display and input unit. Accordingly, the instruction input for specifying camerawork for performing time-lapse imaging using the pan and tilt mechanism can be simply input. The imaging device controls at least the pan and tilt mechanism based on the instruction input for specifying camerawork and controls the imaging unit to perform time-lapse imaging.

Imaging device and time-lapse imaging method

A manufacturing device holds a lens unit on a Z axis that is orthogonal to a chart surface of a measurement chart, holds an image pickup element unit on the Z axis, picks up an image of the measurement chart by an image pickup element while changing a Z-axis direction position of the image pickup element unit held on the Z axis in a state in which current is applied to a second lens drive unit and a third lens drive unit of the lens unit held on the Z axis, adjusts the position and a tilt of the image pickup element unit relative to the lens unit on the basis of image pickup signals that are obtained in the case where the image of the measurement chart is picked up, and fixes the image pickup element unit to the lens unit.

Image pickup module manufacturing method, and image pickup module manufacturing device

An imaging moduleincludes a lens unitwhich has a lens group, and an imaging element unitwhich is fixed to the lens unitand has an imaging elementwhich images a subject through the lens group. The lens unithas a lens drive unit, and a flexible substrateA which includes a wiring groupwhich is electrically connected to the lens drive unit. The imaging element unithas a wiring connection portionwhich is electrically connected to the wiring groupincluded in the flexible substrateA. The flexible substrateA is folded in the middle of the flexible substrateA.

Imaging module, manufacturing method of imaging module, and electronic device

There are provided an image pickup module manufacturing method and an image pickup module manufacturing device that can align an image pickup element unit with a lens unit at a low cost and with high accuracy. A manufacturing deviceholds a lens uniton a Z axis so that an x direction is parallel to a direction of gravity; holds an image pickup element uniton the Z axis; changes a z direction position of the image pickup element unitwith respect to the lens unitwhile holding an x-direction position of a lens groupat a predetermined position, to pick up an image of a measurement chartand adjusts a position and a tilt of the image pickup element unitwith respect to the lens uniton the basis of image pickup signals.

The present invention provides an imaging module manufacturing method capable of performing positioning of an imaging element unit and a lens unit with high accuracy and provides an imaging module manufacturing device. In a manufacturing device (), in a state where a top surface () of a housing () of a lens unit () is adsorbed to an adsorption surface () of an adsorption head () so as to hold the lens unit () on a Z axis and an imaging element unit () is held on the Z axis, a Z axis direction position of the imaging element unit () with respect to the lens unit () is changed, a measurement chart () is imaged by the imaging element (), and a position and an inclination of the imaging element unit () with respect to the lens unit () are adjusted based on imaging signals obtained by the imaging.

Image pickup module manufacturing method and image pickup module manufacturing device

Provided is a manufacturing method of an imaging module which includes a lens unit having a housing in which a lens barrel and a lens drive unit are accommodated, and an imaging element unit. The manufacturing method includes, a first process of holding the lens unit and the imaging element unit on a axis orthogonal to a measurement chart, a second process of moving the imaging element unit in the direction of the axis and imaging the measurement chart at each position, and a third process of adjusting the inclination of the imaging element unit with respect to the lens unit based on imaging signals of the measurement chart. In the first process, a tubular portion of which a position in a plane perpendicular to the axis is fixed and the lens barrel are fitted to each other.

Manufacturing method of imaging module and imaging module manufacturing apparatus

The present invention provides an imaging module capable of performing positioning of an imaging element unit, and a lens unit at a low cost and with high precision and an electronic device including the imaging module. An imaging moduleincludes a lens unitincluding VCMsA,C, andE which move a lens groupin an x direction, a y direction, and a z direction, respectively, terminalsA andB which are connected to the VCMA, terminalsC andD which are connected to the VCMC, and terminalsE andF which are connected to the VCME, and an imaging element unitincluding terminalsA toF which are connected to the terminalsA toF. Exposed areas of the terminalsA andB are larger than exposed areas of the terminalsC toF.

Imaging module and electronic device

The present invention provides an imaging module, an electric device provided therewith, and an imaging-module manufacturing method capable of simply and reliably performing probing and fixing a lens unit and an imaging element unit to each other with high accuracy even when the miniaturized lens unit is used. A the lens unit () includes a focus driving unit, a housing (), a first connection portion (A), a first wiring portion by which the focus driving unit and the first connection portion are electrically connected to each other, and a second wiring portion which is electrically connected to the focus driving unit to which the first wiring portion is connected. The second wiring portion extends from the inside of the housing to the outside thereof, and a wire of the second wiring portion extends to an end surface on an end () of the extended second wiring portion.

Imaging module, electronic device provided therewith, and imaging-module manufacturing method

The invention provides an imaging module that can reliably perform probing, and an electronic apparatus including the imaging module. An imaging module includes a lens unit, and an imaging element unit that is fixed to the lens unit. The lens unit includes a focus drive unit, first and second image blur-correction drive units, a housing, a first connecting portion that is electrically connected to the imaging element unit, a first wiring portion that electrically connects the respective drive units to the first connecting portion, second connecting portions that are disposed outside the housing, a second wiring portion that is electrically connected to the second connecting portions and is electrically connected to the respective drive units to which the first wiring portion is connected, and a wiring board that includes at least a part of the second wiring portion and the plurality of second connecting portions.

Imaging module and electronic apparatus

An imaging module, an electronic device, and an imaging-module manufacturing method capable of relatively easily adjusting a relative position between an imaging element unit and a lens unit with high accuracy are provided. An imaging moduleincludes an imaging element unita lens unitwhich includes a lens groupa first image-blur correction driving unita second image-blur correction driving unita focus driving unitand a connection portionwhich is electrically connected to a circuit of the imaging element unit by a conductive joining material, and a flexible wiring portionwhich includes a wiring group which connects the circuit of the imaging element unit to at least one driving unit among the first image-blur correction driving unit, the second image-blur correction driving unit, and the focus driving unit, and extends between the imaging element unit and the lens unit.

Imaging module, electronic device, and imaging-module manufacturing method

An imaging moduleincludes a lens unitand an imaging element unit. The lens unitincludes a VCMA which moves a lens groupin a z direction, terminalsA andB which are electrically connected to the VCMA, a VCMC and a VCME which move the lens groupin an x direction and a y direction, and terminalsC toF which are electrically connected to the VCMC and the VCME. The imaging element unitincludes terminalsA toF which are electrically connected to the terminalsA toF. Exposed areas of the terminalsA andB are larger than exposed areas of the terminalsC toF.

An imaging module () includes a lens unit () that includes a lens group, and an imaging element unit () that is fixed to the lens unit and includes an imaging element. The lens unit () includes: a focus drive unit; first and second image blur-correction drive units; a first connecting portion (A) that is electrically connected to the imaging element unit; a first wiring portion that electrically connects the focus drive unit, the first image blur-correction drive unit, and the second image blur-correction drive unit to the first connecting portion; a second wiring portion that is electrically connected to only a part of a plurality of wires of the first wiring portion; and a plurality of second connecting portions () that are electrically connected to the second wiring portion.

The invention provides an imaging module having second connecting portions capable of reliably performing probing and can maintain a small installation space, and an electronic apparatus including the imaging module. A lens unit includes at least one drive unit, a housing, a first connecting portion that is electrically connected to an imaging element unit, a first wiring portion that electrically connects the drive unit to the first connecting portion, a plurality of second connecting portions that are disposed outside the housing, and a second wiring portion that electrically connects the second connecting portions to the drive unit. The second wiring portion includes wires that are electrically connected to the drive unit to which the first wiring portion is connected, and at least a part of the second wiring portion extends to the outside of the housing in a direction in which an element wiring portion extends from the support portion.

A film depositing apparatus comprises: a rotatable drum within a chamber around which a substrate is wrapped in a specified surface region; a film depositing unit comprising a film depositing electrode spaced facing to a surface of the drum, and a feed gas supply section supplying a feed gas for forming a film into a gap between the drum and the film depositing electrode; and an exhaust unit that exhausts the gap between the drum and the film depositing electrode during film formation by the film depositing unit so as to forcibly discharge the feed gas, supplied into the gap by the feed gas supply section, through at least one of end portions of the gap upstream side and downstream side in a rotating direction of the drum uniformly over an entire region of the gap in a direction parallel to the axis of rotation of the drum.

Film depositing apparatus

A film deposition method deposits a film on a surface of a substrate in strip form traveling on a peripheral surface of a cylindrical drum in at least one film deposition compartment around the peripheral surface of the drum. The method disposes previously a differential compartment between one film deposition compartment and a compartment including a wrapping space containing at least one of a first position at which the substrate starts to travel on the drum and a second position at which the substrate separates from the drum, the differential compartments communicating with the compartment including the wrapping space and the film deposition compartment, sets a first pressure of the wrapping space lower than a second pressure of the at least one film deposition compartment and performs film deposition in the film deposition compartment with electric power supplied to the drum.

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Saitama, Japan

Tatsuya Fujinami