Olympus Corporation

Tatsuya Daimaru

Hironobu Ichimura

Tomohisa Takahashi

Tomokazu Yamashita

An imaging module includes: a solid-state imaging element including a light receiving face for receiving light; a mounting substrate including a connection portion which is located inside an imaging element projection area that is a projection area where the solid-state imaging element is projected in an optical axis direction and which is connected to a back surface of the solid-state imaging element on a distal end side of the mounting substrate, the mounting substrate on a rear end side being extended in the optical axis direction; and a metallic reinforcing member that has a sleeve shape open at both ends and covers the solid-state imaging element and the connection portion of the mounting substrate along the optical axis direction in a state where an inner circumferential surface of the reinforcing member is away from the solid-state imaging element and the mounting substrate.

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Hachioji, Japan

Tatsuya Daimaru