Sanyo Electric Co., Ltd.

Semiconductor Components Industries, LLC

Tatsuya Ando

Takashi Noma

Hiroyuki Shinogi

Takayasu Otagaki

Katsuhiko Kitagawa

Mitsuru Okigawa

Nobuyuki Takai

Ryoji Tokushige

Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.

Method of manufacturing semiconductor device with wiring on side surface thereof

Semiconductor device with holding member

Semiconductor device with sidewall wiring

Growing community of inventors

Hashima, Japan

Tatsuya Ando