Mitsubishi Chemical Corporation

Lsi Medience Corporation

Mitsubishi Chemical Medience Corporation

Tatsushi Isojima

Hiroyuki Tanaka

Toshiyuki Tanaka

Minako Hanasaki

Takuya Suzuki

Masanori Yamazaki

Toshifumi Shiroya

Akinori Kimura

Maki Saito

Toshiyuki Sawamura

Hisao Takeuchi

Yasuo Ifuku

Sawa Hiramatsu

Kazuki Takeda

Katsura Ikemiya

Tetsuo Kasai

Phuong Thi Kim Dao

Tsutashi Matsuura

The object of the present invention is to provide an emulsion composition that maintains emulsion stability even after high temperature process such as sterilization (heat resistance), shows a small change in particle size distribution between before and after heating, and maintains emulsion stability even under conditions where transformation of an oil phase component (for example, solidification or crystallization of the oil phase component due to temperature drop, or melting of the oil phase component due to temperature rise) occurs (temperature drop resistance), wherein the composition is easily handled during the production process. The object is solved by an oil-in-water emulsion composition containing solid particles, a predefined surfactant, an oil phase component, and an aqueous phase component, wherein the oil phase component includes a predefined oil component and the solid particles are distributed along the interface between the oil phase component and the aqueous phase component.

Oil-in-water type emulsion composition, and method for producing said oil-in-water type emulsion composition

The present invention addresses the problem of providing agglomeraterd boron nitride particles which are suitable to be used as a thermally conductive filler for a heat dissipation sheet of a power semiconductor device, and which exhibit excellent isotropy of thermal conductivity, excellent degradation resistance, and excellent kneadability with respect to resin. The agglomerated boron nitride particles are obtained by agglomerating boron nitride primary particles. The agglomerated BN articles are characterized in that: a peak area intensity ratio ((100)/(004)) of a (100) plane to a (004) plane of the BN primary particles is 0.25 or more, and the average crystallite size of the BN primary particles obtained from a (002) plane peak of the BN primary particles is 375 &#x212b; or more.

Agglomerated boron nitride particles, production method for agglomerated boron nitride particles, resin composition including agglomerated boron nitride particles, moulded body, and sheet

The present invention addresses the problem of providing agglomerated boron nitride particles which are suitable to be used as a thermally conductive filler for a heat dissipation sheet of a power semiconductor device, and which exhibit excellent isotropy of thermal conductivity, excellent degradation resistance, and excellent kneadability with respect to resin. The agglomerated boron nitride particles are obtained by agglomerating boron nitride primary particles. The agglomerated BN articles are characterized in that: a peak area intensity ratio ((100)/(004)) of a (100) plane to a (004) plane of the BN primary particles is 0.25 or more, and the average crystallite size of the BN primary particles obtained from a (002) plane peak of the BN primary particles is 375 &#x212b; or more.

A biomaterial structure containing a larger amount of biomaterial than the conventional art with maintaining the reactivity of the biomaterial is provided by linking particulate lumps in which the biomaterial is bound with a compound capable of binding to the biomaterial, wherein the particle diameter of the particulate lumps is 10 &#x3bc;m or smaller.

Biomaterial construct, its producing method, biomaterial support, target material purifying method, affinity chromatography container, separation chip, analyzing method and analyzing separator for target material, biomaterial complex, and its support, sensor chip, solid support with biomaterial fixed thereon

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Yokohama, Japan

Tatsushi Isojima