Sekisui Chemical Co., Ltd.

Seiku Chemical Co., Ltd.

Tatsushi Hayashi

Susumu Baba

Takashi Nishimura

Tomoki Kunikawa

Reona Yokota

Kazutaka Shirahase

Yuko Kawahara

Kohei Takeda

Sayaka Wakioka

Takashi Shinjo

Akihiro Uenishi

Masami Shindo

Yuta Oatari

Kazuyoshi Shiomi

Daisuke Tottori

Koichi Shibayama

Hidenobu Deguchi

A curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less. The curable resin composition is excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. An adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition are also provided.

Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board

Provided is an interlayer insulating material that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The present invention is an interlayer insulating material used for a multilayer printed wiring board, which contains an epoxy compound, a curing agent, a silica, and a polyimide, and in which the polymide is a reactant of a tetracarboxylic anhydride and a dimer acid diamine, a content of the silica is 30% by weight or more and 90% by weight or less in 100% by weight of components excluding a solvent in the interlayer insulating material, and the total content of the epoxy compound and the curing agent in 100% by weight of components excluding the silica and a solvent in the interlayer insulating material is 65% by weight or more.

Interlayer insulating material and multilayer printed wiring board

Provided is a cured body that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The cured body according to the present invention is a cured body of a resin composition that includes an epoxy compound, a curing agent, an inorganic filler, and a polyimide, in which the content of the inorganic filler is 30% by weight or more and 90% by weight or less in 100% by weight of the cured body, the cured body has a sea-island structure having a sea part and an island part, the island part has an average long diameter of 5 &#x3bc;m or less, and the island part contains the polyimide.

Cured body and multilayered substrate

A manufacturing method of a multilayer substrate uses a multilayer insulation film which includes a first insulation layer and a second insulation layer laminated on one surface of the first insulation layer, the second insulation layer being configured such that, in partially removing the second insulation layer, only the second insulation layer is enabled to be selectively removed to form a groove having a depth equal to a thickness of the second insulation layer on an obtained insulation layer. The manufacturing method includes: laminating the multilayer insulation film on a surface of a circuit board; selectively and partially removing only the second insulation layer out of the first insulation layer and the second insulation layer to form the groove having a depth equal to the thickness of the second insulation layer on the obtained insulation layer; and forming metal wiring within the groove formed on the insulation layer.

Method for manufacturing multilayer substrate, multilayer insulation film, and multilayer substrate

Provided is an insulating resin material capable of reducing surface roughness of the surface of a cured object, and, when a metal layer is formed on the surface of the cured object, increasing adhesive strength between the cured object and the metal layer. The insulating resin material of the present invention includes a thermosetting resin, a curing agent, a first inorganic filler surface-treated with a first silane coupling agent, and a second inorganic filler surface-treated with a second silane coupling agent. When absolute difference between SP values of a most-abundantly contained thermosetting resin and an organic group of the first silane coupling agent is defined as SP(A), and when absolute difference between SP values of the most-abundantly contained thermosetting resin and an organic group of the second silane coupling agent is defined as SP(B); (SP(A)&#x2212;SP(B)) is not smaller than 0.5 but not larger than 3.5.

Insulating resin material and multilayer substrate

A preliminary-cured material permits reduced surface roughness of a roughening-treated surface, and increase of an adhesive strength between a cured object and a metal layer. The preliminary-cured material is obtained by advancing curing of an epoxy resin material that contains an epoxy resin, a curing agent, and a silica. The preliminary-cured material includes a first principal surface to be roughening-treated, and a second principal surface. The silica includes a first small particle-diameter silica whose particle diameter is not smaller than 0.01 &#x3bc;m but smaller than 0.5 &#x3bc;m, and a second large particle-diameter silica whose particle diameter is not smaller than 0.5 &#x3bc;m but not larger than 20 &#x3bc;m. The first small particle-diameter silica is localized to exist in large quantity on a side of the first principal surface, and the second large particle-diameter silica is localized to exist in large quantity on a side of the second principal surface.

Preliminary-cured material, roughened preliminary-cured material, and laminated body

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Tsukuba, Japan

Tatsushi Hayashi