Matsushita Electric Industrial Co., Ltd.

Tatsuro Kikuchi

Seiichi Nakatani

Satoru Yuhaku

Hideyuki Okinaka

Toru Ishida

Osamu Makino

Yasuhiko Hakotani

Tsutomu Nishimura

Hyogo Hirohata

Tsuneshi Nakamura

Yoshitsugu Uenishi

Tetsuo Hino

Yukihito Yamashita

Kenichi Fujimura

Akira Omi

Shigeki Inagaki

Yoshinori Tomita

Takeshi Iino

A method for screening multi-layered ceramic capacitors having internal defects at a high accuracy by superposing a direct-current constant current between external electrodes of a multi-layered ceramic capacitor having a defective part in an effective layer of the dielectric ceramic, raising the voltage between the external electrodes, and further feeding the direct-current constant current for a specific time after the voltage curve becomes flat, capacitors experiencing a sudden drop in the voltage between the external electrodes during the feeding time are sorted out and removed as a defective product.

Screening method for a multi-layered ceramic capacitor

Integrated circuit device and manufacturing method thereof

A laminated ceramic capacitor comprises a plurality of inner electrode layers for developing a capacitance, dielectric layers sandwiched with the inner electrode layers, and a pair of outer electrodes coupled to their associated inner electrode layers for output of the capacitance. The inner electrode layers are made of Ni. The dielectric layers are made of a dielectric ceramic composition having a structural formula of:

Laminated ceramic capacitor

A manufacturing method for a multilayered ceramic body using Cu, Ni, Co or Fe as a conductor material, and a conductor forming paste of particular composition of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component, the paste being applied to the multilayered body. The manufacturing method comprises: a process of forming the multilayered body with conductor paste of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component and insulating paste formed of glass and/or ceramic, so that a binder is removed from the laminate by heat treatment in an oxidizing atmosphere; a process of heat treatment for reducing the oxide; and a sintering process for sintering the laminate in a nitrogen atmosphere.

Conductor paste and method of manufacturing a multilayered ceramic body

A manufacturing method for a multilayered ceramic body using Cu, Ni, Co or Fe as a conductor material, and a conductor forming paste of a particular composition of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component, the paste being applied to the multilayered body. The manufacturing method comprises: a process of forming the multilayered body with conductor paste of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component and insulating paste formed of glass and/or ceramic, so that a binder is removed from the laminate by heat treatment in an oxidizing atmosphere; a process of heat treatment for reducing the oxide; and a sintering process for sintering the laminate in a nitrogen atmosphere.

A hybrid integrated circuit component for insertion in a slit of a mother printed circuit board, and a method of mounting the hybrid integrated circuit component. The circuit component includes a flexible circuit board composed of a flexible insulated substrate, a circuit conductor formed on one side of the substrate, and a pair of conductor layers formed along opposite sides of the substrate to serve as external connection terminals. Circuit elements are mounted on the substrate and electrically connected to the circuit conductor. A pair of hard supporting plates are cemented on the other surface and at the opposite sides of the substrate so that the flexible circuit board can be folded at a center bending portion of the substrate so that the supporting plates face each other and so that the connection terminals are arranged close to each other when the substrate is folded and so that the substrate at its bending portion, when folded, has a sufficient spring characteristic for ensuring contact between the slit of the mother printed circuit board and each of the connection terminals, when the connection terminals are inserted into the slit of the mother printed circuit board.

Hybrid integrated circuit component and printed circuit board mounting

An etchant comprising an electrolytic liquid which comprises sulfuric acid as a main component and water in such amount that the weight ratio of sulfuric acid to water is between 9:1 and 2:1. The ferrite surface having been electrolytically etched by using this etchant is smooth. Thus, this etchant makes it possible to etch a ferrite to a large depth, and thereby easily shape a ferrite by electrolytic etching, e.g. to define the track width of a magnetic head.

Etchant for electrolytic etching of a ferrite for a magnetic head and

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Kyoto, Japan

Tatsuro Kikuchi