Dai Nippon Printing Co., Ltd.

Tatsuro Imamura

Yuji Yamaguchi

Osamu Shimada

Yoshitaka Fukuoka

Kenji Sasaoka

Kenichi Matsumura

Hiroyuki Hirai

Kazuhiro Shinozaki

Satoshi Shibazaki

To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating-reliability. The component built-in wiring board includes: a conductive layer () extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component () having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member () provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers () which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.

Component built-in wiring board and manufacturing method of component built-in wiring board

To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability. The component built-in wiring board includes: a conductive layer () extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component () having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member () provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers () which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.

Wiring board incorporating components and process for producing the same

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Tokyo, Japan

Tatsuro Imamura