Kabushiki Kaisha Toshiba

Tokyo Shibaura Denki Kabushiki Kaisha

Tatsuro Beppu

Kazuhiro Itsumi

Shiroh Saitoh

Shunji Shirouzu

Yujiro Naruse

Masayuki Shiratori

Akinobu Kasami

Masami Iwamoto

Shigeki Obata

Makoto Tashiro

Toshiro Hiraoka

Kenji Sano

Shuji Hayase

Tetsuo Sadamasa

Atsushi Kamata

Osamu Ichikawa

A silicon thin film is formed by coating on a substrate a solution of polysilane represented by the general formula --(SiR.sup.1.sub.2).sub.n --, where R.sup.1 substituents are selected from the group consisting of hydrogen, an alkyl group having two or more carbon atoms and a .beta.-hydrogen, a phenyl group and a silyl group, and thermally decomposing the polysilane to deposit silicon.

Method of forming semiconductor thin film and method of fabricating

A device for performing identification by sensing the fingerprint of a finger includes an input unit. The input unit is constituted by a plurality of linear contact electrodes formed on a substrate, and a pressure-sensitive sheet formed on the linear contact electrodes and a resistance thereof changes in accordance with a pressure applied thereto. When the finger touches the surface of the pressure-sensitive sheet, a change in resistance is caused between the electrodes, and this change is converted to data of a one-dimensional electrical signal distribution. The obtained data is compared with registered data, thereby performing identification. The time required for signal processing necessary in the identification device can be decreased.

Surface shape sensor, identification device using this sensor, and

An apparatus transposes a matrix of semiconductor pellets mounted on a first adhesive tape to a second adhesive tape in such a manner that the respective pellet rows are arranged spaced from the adjacent pellet rows. It has pellet-supporting means having an inclined plane and apical plane. The first adhesive tape bearing the matrix is carried stepwise along the inclined plane toward the apical plane to successively bring the respective rows of the matrix to the apical plane. Above the apical plane, a second adhesive tape is carried in a direction intersecting the pellet columns at right angles with the adhesive plane thereof facing the matrix. When each row mounted on the first tape is on the apical plane, the second tape is pressed against the row. Each time one pellet row is transposed to the second tape, the pellet-supporting means is shifted in a direction intersecting the pellet columns at right angles.

Apparatus and method for arranging semiconductor pellets

A green light emitting device, includes an n-type gallium phosphide (GaP) substrate, an n-type GaP layer and a p-type GaP layer laminated on the n-type GaP substrate. The net donor concentration in the n-type GaP layer decreases abruptly in steps from the GaP substrate side to the p-type GaP layer side. Nitrogen is contained in only the n-type GaP layer portion closest to the p-type GaP layer.

Green light emitting device

Growing community of inventors

Tokyo, Japan

Tatsuro Beppu