Meiko Electronics Co., Ltd.

Other

Toagosei Chemical Industry, Co., Ltd.

Koito Seisakusho Co., Ltd.

Toagosei Chemical Industry

Machine Active Contact Co., Ltd.

Tatsuo Wada

Teruaki Yamamoto

Tasuku Touyama

Noboru Shingai

Katsuro Aoshima

Toshiro Miki

Hiroyuki Sasabe

Hiromi Kimura-Suda

Keizo Yamashita

Glenn R Schaer

Norio Kawachi

Takafumi Sassa

Katsurou Aoshima

Takeharu Kato

Keisuke Honda

Masamitsu Takenaka

According to the present invention, it is adapted to calculate simultaneously an absolute molecular orientation with an effective second order nonlinear optical constant in an object to be measured without changing a measuring point. Further, in order that a period of time required for measuring an absolute molecular orientation and an effective second order nonlinear optical constant in an object to be measured is reduced, whereby a possibility of damaging the object to be measured can be minimized, measurement is carried out by the use of a single light source in accordance with SHG phase method without shifting the measuring point of the; object to be measured, so that the absolute molecular orientation and the effective second order nonlinear optical constant can be calculated from a fitting curve achieved as a result of fitting the fringe obtained by the above described measurement.

Method for measuring simultaneously absolute molecular orientation with effective second order nonlinear optical constant and apparatus therefor

A method of manufacturing a polymer film having second order non-linear optical properties which has excellent stability of orientated molecules and does not become disorientated, and a polymer film and a non-linear optical element are provided. A polymer solution is placed between two substrates, which are disposed substantially perpendicular with respect to a rotating stand and substantially symmetrical with respect to a rotation axis of the rotating stand, and the rotating stand is rotated. A polymer film having second order non-linear optical properties is formed by the centrifugal force generated at the polymer solution. The polymer solution is a solution formed by dissolving, in an organic solvent, at least one of (1) a host-guest polymer in which low molecular weight compounds are dispersed in polymers, (2) a modified polymer in which regions which exhibit a function of second order non-linear optical properties are chemically modified in polymer side chains and/or a polymer main chain, and (3) a crosslinked polymer. Among these, modified polymers are particularly preferable.

Method of manufacturing polymer films having second order non-linear optical properties, polymer films, and non-linear optical element

A circuit board which is formed with bump patterns subject to a narrow variation in height on the surface of the circuit board, and which permits high-density packaging of a semiconductor component thereon. In this circuit board, conductor circuits formed by electroplating are embedded in an insulating base that is formed of a resist layer and an insulating substrate, and bumps are exposed in the surface of the insulating base. The bumps and the conductor circuits are connected electrically with one another by means of pillar-shaped conductors that are formed by electroplating. Each bump is a multilayer structure in two or more layers formed by successively depositing different electrically conductive materials by electroplating.

Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board

A circuit board, which is formed with bump patterns subject to a narrow variation in height on the surface of the circuit board, and which permits high-density packaging of a semiconductor component thereon. In this circuit board, conductor circuits formed by electroplating are embedded in an insulating base that is formed of a resist layer and an insulating substrate, and bumps are exposed in the surface of the insulating base. The bumps and the conductor circuits are connected electrically with one another by means of pillar-shaped conductors that are formed by electroplating. Each bump is a multilayer structure in two or more layers formed by successively depositing different electrically conductive materials by electroplating.

Circuit board, manufacturing method therefor, and bump-type contact head

A process for producing a copper-clad laminate is disclosed which includes the steps of (a) contacting the surface of a conductive carrier with a catalyst liquid containing at least one noble metal selected from the group consisting of Pd, Pt, Ru, Au, and Ag; (b) subsequently forming a copper foil layer on the treated surface of the conductive carrier by copper electroplating; (c) laminating an insulating base on the copper foil layer by hot-press bonding; and (d) separating the conductive carrier from the resulting laminate. The copper foil layer in the resulting copper-clad laminate has reduced pinholes and exhibits isotropic mechanical characteristics.

Process for producing copper-clad laminate

A process for producing a copper-clad laminate, which comprises a step (S2) of forming a copper foil of at least several micrometers on a planar conductive substrate by electrolysis, a step (S3) of roughening the surface of the copper foil, a step (S4) of laminating the copper foil together with the conductive substrate on an insulating substrate and tightly integrating the assembly by applying pressure and heat, and a step (S5) of separating only the conductive substrate. A metal film may exist between the conductive substrate and the copper foil. When the metal film has a thickness of 0.1 to 3 .mu.m, only the conductive substrate is separated with the metal film being firmly adhered to the copper foil surface and, when the metal film has a thickness of 70 to 250 .mu.m, it is separated together with the conductive substrate after the lamination. The copper foil formed by high-speed plating under the conditions of 6 to 12.0 m/sec in solution contact speed and 0.8 to 4.0 A/cm.sup.2 in current density has about the same flexibility as that of rolled and annealed copper. Thus, ultrathin copper-clad laminates with a copper foil of 10 .mu.m or less suited for flexible circuit boards can be produced in a short time using small equipment.

Process for producing a copper-clad laminate

A method suited for producing a conductor circuit board having a high-density, fine circuit pattern. Conductor circuits and dummy circuits are formed on the surface of a planar, electrically conductive substrate, and after removing a resist mask, unnecessary dummy circuits are removed. A thin metal film is formed over the surface of the conductive substrate and the surfaces of the conductor circuits and remaining dummy circuits. An insulating substrate is superposed on the surface of the conductive substrate on which the thin metal film is formed, and the two substrates are pressure-bonded together with heat applied thereto. Subsequently, only the conductive substrate is removed, and exposed portions of the thin metal film are removed by etching. In the case of producing a conductor circuit board with a through hole, a through hole is formed after the step of separating the conductive substrate, and then through-hole plating is carried out, followed by the removal of exposed portions of the thin metal film by etching.

Method of producing conductor circuit boards

Apparatus for the production of metal foil or printed circuit patterns on a continuously advancing strip of electrically conductive material includes a cathode under which the conductive strip is fed in sliding contact therewith. An insoluble anode is disposed under the cathode, with an interelectrode gap between the anode and the cathodic conductive strip traveling under the cathode. Lying next to one end of the anode is a solution inlet block defining a solution inlet from which the electroplating solution containing the metal to be deposited is fed turbulently into the interelectrode gap to cause the electrodeposition of the metal on the downward-facing surface of the conductive strip. A shield block of electrically insulating material is mounted over the solution inlet block for shielding the conductive strip traveling thereover from premature metal deposition due to leaking current and hence for avoiding the development of pinholes in the metal foil or circuit patterns.

Growing community of inventors

Ayase, Japan

Tatsuo Wada