Kabushiki Kaisha Toshiba

Toshiba Electronic Devices & Storage Corporation

Tatsuo Tonedachi

Kazuhisa Iwashita

Teruo Takeuchi

Satoshi Shimizu

Kazuhiro Inoue

Tetsuro Komatsu

Hiroaki Oshio

Gen Watari

Naoya Ushiyama

Masahiko Hori

Jia Liu

Eitaro Miyake

Toshihiro Tsujimura

Mami Yamamoto

Iwao Matsumoto

Mami Fujihara

Hidenori Egoshi

Yoshinari Tamura

Kentaro Takao

Teruo Takeguchi

A semiconductor package includes a PDA chip, a MOS chip, and a wiring plate including a first principal surface and a second principal surface, the first principal surface being provided with a first rigid plate that is non-conductive and a second rigid plate that is conductive, the PDA chip being fixed to the first rigid plate by using a non-conductive bonding agent, a lower surface terminal of the MOS chip being soldered to the second rigid plate, the second principal surface being provided with an input terminal and an output terminal, the input terminal being electrically connected to the PDA chip, the output terminal being electrically connected to the second rigid plate.

Semiconductor package

According to one or more embodiments, a semiconductor device includes a mounting substrate and a semiconductor element on the mounting substrate. The mounting substrate has a first electrode pad and a second electrode pad. The semiconductor element has a supporting substrate, third and fourth electrode pads, first slits and second slits. The third and fourth electrode pads are provided on a first surface of the supporting substrate facing the mounting substrate. The first slits are provided both in the supporting substrate and in the third electrode pad. The second slits are provided both in the supporting substrate and in the fourth electrode pad. The semiconductor device further includes a first conductive bonding agent that connects the first electrode pad to the third electrode pad and a second conductive bonding agent that connects the second electrode pad to the fourth electrode pad.

Semiconductor device

A photorelay of an embodiment includes a polyimide substrate having a first surface and a second surface on an opposite side of the polyimide substrate from the first surface, the polyimide substrate having a thickness equal to or more than 10 &#x3bc;m and equal to or less than 120 &#x3bc;m, an input terminal provided on the second surface, an output terminal provided on the second surface, a light receiving element provided on the first surface, a light emitting element provided on the light receiving element, and a MOSFET provided on the first surface.

Photorelay

A semiconductor device includes a first and a second metal layer, the second provided on a same plane as the first layer, and first second and third terminals. A first metal wiring layer is electrically connected to the first terminal. A second metal wiring layer is electrically connected to the second terminal and the second metal layer and disposed over the first metal wiring layer. A third metal wiring layer is electrically connected to the third terminal and the first metal layer. A first semiconductor chip is provided between the first metal wiring layer and the first metal layer. A second semiconductor chip is provided between the third metal wiring layer and the second metal layer. The first chip has electrodes connected to the first metal wiring layer and the first metal layer. The second chip has electrodes connected to the third metal wiring layer and the second metal layer.

A semiconductor module includes a substrate, first and second wirings on the substrate, a semiconductor package disposed on the first wiring and having a pair of main electrodes on top and bottom surfaces of the semiconductor package, and a third wiring extending between the top surface of the semiconductor package and the second wiring.

Semiconductor module that have multiple paths for heat dissipation

A semiconductor device includes a light emitting element comprising a substrate having a first and a second surface and an outer edge connecting the first and second surfaces. A light emitting layer is on a central portion of the first surface but not on a peripheral portion between the central portion and the outer edge of the substrate. A first insulating layer is disposed on the peripheral portion of the first surface, a side surface of the light emitting layer, and a third surface of the light emitting layer that is spaced from the first surface of the substrate. A first electrode is electrically contacting the third surface of the light emitting layer. A light receiving element is provided in a propagation path of light emitted from the light emitting element.

According to one embodiment, an LED module includes a substrate, an interconnect layer, a light emitting diode (LED) package, and a reflection member. The interconnect layer is provided on the substrate. The LED package is mounted on the interconnect layer. The reflection member is provided on a region in the substrate where the LED package is not mounted and has a property of reflecting light emitted from the LED package. The LED package includes a first lead frame, a second lead frame, an LED chip, and a resin body. The first lead frame and the second lead frame are arranged apart from each other on the same plane. The LED chip is provided above the first lead frame and the second lead frame, with one terminal connected to the first lead frame and one other terminal connected to the second lead frame. The resin body covers the LED chip, covers an upper surface, a part of a lower surface, and a part of an end surface of each of the first lead frame and the second lead frame, and exposes a remaining part of the lower surface and a remaining part of the end surface.

LED module

According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 &#x3bc;m or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.

LED package, method for manufacturing LED package, and packing member for LED package

According to one embodiment, an LED package includes a first lead frame, a second lead frame, an LED chip, a wire, and a resin body. The first lead frame and the second lead frame are arranged with a space between each other. The LED chip is provided above the first lead frame and the second lead frame. The LED chip has a first terminal connected to the first lead frame and a second terminal connected to the second lead frame. The wire connects the first terminal to the first lead frame. The resin body covers the LED chip as well as a top surface, a part of a bottom surface, and a part of an edge surface of each of the first lead frame and the second lead frame. A remaining portion of each of the bottom surfaces and a remaining portion of each of the edge surfaces are exposed. A chip side angle formed by a top surface of the LED chip and a direction in which the wire is extracted from the first terminal is smaller than a frame side angle formed by the top surface of the first lead frame and a direction in which the wire is extracted from the first lead frame.

LED package

According to one embodiment, an LED package includes first and second lead frames spaced from each other, and an LED chip. Each of the first and second lead frames includes a base portion and a plurality of extending portions extending from the base portion. A part of a lower surface of the base portion, side surfaces of the base portion, lower surfaces of the extending portions and side surfaces of the extending portions are covered by resin. A remaining part of the lower surface of the base portion and tip surfaces of the extending portions are not covered by resin. The part of the lower surface of the base portion includes a first edge of the first lead frame and a second edge of the second lead frame. The first edge and the second edge are opposed each other.

According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are made of a metal material, and disposed to be apart from each other. The LED chip is provided above the first and second lead frames, the LED chip having one terminal connected to the first lead frame and another terminal connected to the second lead frame. The resin body is made of a resin material having a shore D hardness of 25 or higher. In addition, the resin body covers the first and second lead frames and the LED chip. And, an appearance of the resin body is an appearance of the LED package.

LED package and method for manufacturing the same

According to one embodiment, an LED module includes a board, an interconnection and an LED package. The interconnection is formed on an upper surface of the board. The LED package is mounted on the board. The LED package includes first and second lead frames disposed to be apart from each other, and connected to portions of the interconnection insulated from each other. The LED package includes an LED chip provided above the first and second lead frames. The LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the LED package includes a resin body covering an upper surface, portions of a lower surface and an edge surface of each of the first and second lead frames, also covering the LED chip, but exposing remaining portions of the lower surface and the edge surface. And, an appearance of the resin body is an appearance of the LED package.

Growing community of inventors

Fukuoka-ken, Japan

Tatsuo Tonedachi