Fanuc Corporation

Tatsuo Shinohara

Yoshiki Fujioka

Makoto Takeshita

Kosei Nakamura

Shunsuke Matsubara

Shinichi Kono

Kiichi Inaba

Naoyuki Suzuki

Yuuichi Yamada

Katsuo Kohari

Naoki Yamaguchi

Takayuki Akazawa

Hideyuki Nakamura

Takumi Mizuno

Hikaru Fujita

Takashi Ogura

An object is to reduce the risk of outflow of defects and improve the work efficiency of assembly work. An assembly systemaccording to an embodiment of the present invention is used to assemble a finished product while sequentially placing and fixing multiple types of components to a workpiece. The assembly systemincludes a collaborative robotconfigured to collaborate with a worker, an identification information reading unitconfigured to read identification information indicated on a component placed on the workpiece, and a controllerconfigured to determine whether a type of the component placed on the workpiece is correct or incorrect based on the read identification information and control the collaborative robot in accordance with a result of the correctness determination.

Assembly system

A semiconductor signal connector has a contact area provided with a contact part. The contact part is elongated in a transverse direction so that a signal terminal can contact at any location thereof. Further, the semiconductor signal connector has a first contact part to contact a first signal terminal, a second contact part to contact a second signal terminal, and a connecting part formed by a deformable member for connecting the first contact part and the second contact part.

Semiconductor signal connector

Leg portions are provided at the four corners of a resistor that generates a large amount of heat and a partition panel is secured to the top of the leg portions through a heat-insulating spacer. A adiabatic layer is formed by an empty space between the resistor and the partition panel. Further, the transmission of heat from the resistor through the leg portions to the partition panel is suppressed by the heat-insulating spacer. A servo amplifier is connected to the mounting portions provided on the partition panel, at the side opposite the resistor main body. As the transmission of heat generated by the resistor to the servo amplifier main body is cut off by the partition panel and suppressed, components inside the servo amplifier are protected from heat.

Resistor for a servo amplifier and servo amplifier provided thereof

A semiconductor module is mounted on a printed circuit board so that a heat radiating surface of the module and surfaces of the printed circuit boards are parallel to inner wall surfaces of a unit case. The total thickness of the semiconductor module constituting an inverter essential to a servo amplifier, and the printed circuit boards on which the semiconductor module is mounted is made substantially equal to a distance between the inner walls of the unit case so that the width of the servo amplifier can be minimized. The other components having sizes smaller than the width of the unit case are selected, and an electrolytic capacitor and the like are divided into a plurality of parts so that the divided parts are separately accommodated. Further, air passages are defined by guide plates closing gaps between the components, so that air is impinge concentratedly on components which need to be cooled during forced air cooling by fans, whereby the cooling efficiency is enhanced, permitting dense arrangement of the components and making it possible to provide a servo amplifier reduced in thickness and in size.

Servo amplifier unit

A heat sink attached to a heat plate comprising a heat plate (1) produced by sticking two aluminum plates (11, 12) to each other, leaving a closed path (13) therebetween for confining a heat exchange medium therein, and of which the bottom is attached by an object to be cooled, a cooling fin (2) which is stuck to the upper region of the heat plate (1), and a flange (4) for mounting the assembly of the heat plate (1) and the cooling fin 92), wherein the surface of the heat plate (1) on which the cooling fin (2) is to be attached, is even and the cooling fin (2) and the flange (4) are a one-piece structure fabricated by employing die casting.

Heat sink attached to a heat plate

Motor output changeover control apparatus

Casing structure for an amplifier unit for an AC spindle

High-frequency noise absorbing circuit

Growing community of inventors

Yamanashi, Japan

Tatsuo Shinohara