Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Dai-Ichi Kogyo Seiyaku Co., Ltd.

Dowa Mining Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Tatsuo Ogawa

Seiichi Nakatani

Takeshi Suzuki

Kouji Kawakita

Koichi Hirano

Satoru Tomekawa

Tamao Kojima

Akihito Hatakeyama

Fumio Echigo

Daizo Andoh

Hiroshi Sogou

Masatoshi Suehiro

Kouichi Iwaisako

Hideo Akiyama

Yoshihiro Bessho

Takashi Ichiryu

Yoshihiro Kawakita

Yasuhiro Nakatani

Yoji Ueda

Kenichi Hotehama

Susumu Matsuoka

Shinobu Kokufu

Tetsuyoshi Ogura

Kazuo Kimura

Tousaku Nishiyama

Tsukasa Shiraishi

Kazuyuki Okano

Chiharu Hayashi

Yo Hasegawa

Kazunori Omoya

Shigetoshi Segawa

Yasuhito Isozaki

Takashi Oobayashi

Hirishi Sogou

There is provided a substrate for light-emitting element, including a mounting surface on which a light-emitting element is to be mounted, the mounting surface being one of two opposed main surfaces of the substrate. The substrate of the present invention is provided with a protection element for the light-emitting element, the protection element comprising a voltage-dependent resistive layer embedded in a body of the substrate, and comprising a first electrode and a second electrode each of which is in connection with the voltage-dependent resistive layer wherein the light-emitting element is to be mounted such that it is positioned in an overlapping relation with the voltage-dependent resistive layer.

Substrate for mounting light-emitting element and light-emitting device

There is provided a flexible semiconductor device. The flexible semiconductor device of the present invention comprising a support layer, a semiconductor structure portion formed on the support layer, and a resin film formed on the semiconductor structure portion. The resin film comprises an opening formed by a laser irradiation therein, and also an electroconductive member which is in contact with the surface of the semiconductor structure portion is disposed within the opening of the resin film.

Method for manufacturing flexible semiconductor device having gate electrode disposed within an opening of a resin film

Flexible semiconductor device having gate electrode disposed within an opening of a resin film

A method for manufacturing a flexible semiconductor device includes (i) forming an insulating film on the upper surface of metal foil, (ii) forming an extraction electrode pattern on the upper surface of the metal foil, (iii) forming a semiconductor layer on the insulating film such that the semiconductor layer is in contact with the extraction electrode pattern, (iv) forming a sealing resin layer on the upper surface of the metal foil such that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, and (v) forming electrodes by etching the metal foil, the metal foil being used as a support for the insulating film, the extraction electrode pattern, the semiconductor layer, and the sealing resin layer formed in (i) to (iv) and used as a constituent material for the electrodes in (v). The metal foil need not be stripped, and a high-temperature process can be used.

Flexible semiconductor device

A method for manufacturing a flexible semiconductor device comprises (i) forming an insulating film on the upper surface of a resin film, (ii) forming a pattern of extraction electrodes on the upper surface of the resin film, (iii) forming a semiconductor layer on the insulating film in such a manner that the semiconductor layer is in contact with the pattern of extraction electrodes, and (iv) forming a sealing resin layer on the upper surface of the resin film in such a manner that the sealing resin layer covers the semiconductor layer and the pattern of extraction electrodes, wherein at least one of the stepsof the above steps (i) to (iv) is carried out by a printing method. With this manufacturing method, various layers can be formed by a simple printing process without using a vacuum process, photolithography, or the like.

Method for manufacturing flexible semiconductor device

Flexible semiconductor device and method for manufacturing same

A circuit boardhaving a base materialand an electrodeformed on at least one main surface of the base materialincludes an easy peeling portionformed in at least one of an inner portion and a side portion of the electrode, with the adhesive strength between the electrodeand the easy peeling portionbeing less than the adhesive strength between the electrodeand the base material. A circuit board that has high connection reliability and enables narrow pitch mounting thereby can be provided.

Circuit board, method for manufacturing the same, and semiconductor device

A circuit board manufacturing method including the steps of forming a through hole on an insulator layer and then filling the through hole with a conductive paste; dispersing and forming a protective agent on an adhesion surface of a conductor foil so as to include adhesion surface regions where the protective agent does not exist; sticking the conductor foil to the insulator layer; and abutting a plurality of conductive powders constituting the conductive paste and the conductor foil to each other through the adhesion surface regions by means of heating and pressurizing the insulator layer and conductor foil.

Method of manufacturing circuit board

The present invention aims to provide a wiring substrate highly reliable in insulation and connection and a method for manufacturing the wiring substrate. A wiring substrate having two or more wiring layers, insulation layers interposed between the neighboring wiring layers and containing an organic resin, and a via formed in the insulation layers and extended between neighboring wiring layers. The via including functional substances, as well as some of the voids (first voids) where at least the organic resins from the insulation layers exist and the remaining voids (second voids) where a gas exists.

Wiring board and production method thereof

A protective agent for protecting a wiring is dispersed and placed in mottle-like on an interface between a via and a wiring layer . Then, each dimension of interface regions where the protective agent does not exist is set to such a size that a plurality of conductive powders constituting the via can abutted on the wiring layer . Therefore, the plurality of conductive powders and the wiring layer are abutted each other in each interface region where the protective agent does not exist to electrically connect, thereby stabilizing the connection resistance for a prolonged period of time.

Circuit board and its manufacture method

A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.

Method of producing a circuit board

Circuit board and production of the same

A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

Printed circuit board

Printed circuit board and method of manufacturing the same

A paste for via-hole filling is provided, and the paste comprises at least (a) 30-70 volume % of conductive particles whose average diameter ranges from 0.5 to 20 .mu.m and whose specific surface area ranges from 0.05 to 1.5 m.sup.2 /g, and (b) 70-30 volume % of resin comprising at least 10 weight % of epoxy resin comprising at least one epoxy group per molecule, in which the total amount of a hydroxyl group, an amino group and a carboxyl group is not more than 5 mol % of the epoxy group, and the epoxy equivalent ranges from 100 to 350 g/eq. The conductive paste for filling via-holes and a printed circuit board comprising thereof can be used to provide an inner-via-hole connection between electrode layers without using a through-hole plating technique. The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener and a dispersant if necessary. The paste having low viscosity and low volatility is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foils on both sides to attain a printed circuit board where both sides are electrically connected by inner-via-hole.

Conductive paste for filling via-hole, double-sided and multilayer

Growing community of inventors

Osaka, Japan

Tatsuo Ogawa