Fuji Electric Co., Ltd.

Shinano Kenshi Kabushiki Kaisha

Fuji Electric Device Technology Co., Ltd.

Fuji Electric Systems Co. Ltd.

Tatsuo Nishizawa

Eiji Mochizuki

Yoshinari Ikeda

Yoshito Kinoshita

Shinji Tada

Yuhei Nishida

Ryoichi Kato

Motohito Hori

Rikihiro Maruyama

Hideyo Nakamura

Yoshitaka Nishimura

Norihiro Nashida

Yuichiro Hinata

Masafumi Horio

Takashi Saito

Kyohei Fukuda

Takao Maeda

Yusuke Tashiro

Kenji Watanabe

Hiromichi Gohara

Takeshi Matsushita

Kazunaga Onishi

Kohei Yamauchi

Shunsuke Saito

Masanori Tanaka

Shinji Sano

Tomoki Kodaira

Shoji Tsunoda

Katsuhiko Yoshihara

Masaaki Chino

Motokiyo Yokoyama

Tomonobu Sugiyama

Hiroshi Moriya

A semiconductor module includes a laminated substrate having an insulating plate, a circuit pattern arranged on an upper surface of the insulating plate and a heat dissipating plate arranged on a lower surface of the insulating plate. The semiconductor module also includes a semiconductor device having a collector electrode arranged on its upper surface, having an emitter electrode and a gate electrode arranged on its lower surface, and bumps respectively bonding the emitter electrode and the gate electrode to an upper surface of the circuit pattern. Each of the bumps is made of a sintered metal such that the bump is formed to be constricted in its middle portion in a thickness direction orthogonal to a surface of the insulating plate.

Manufacturing method of packaging structure for bipolar transistor with constricted bumps

A semiconductor module includes a laminated substrate having an insulating plate, a circuit pattern arranged on an upper surface of the insulating plate and a heat dissipating plate arranged on a lower surface of the insulating plate. The semiconductor module also includes a semiconductor device having a collector electrode arranged on its upper surface, having an emitter electrode and a gate electrode arranged on its lower surface, and bumps respectively bonding the emitter electrode and the gate electrode to an upper surface of the circuit pattern. Each of the bumps is made of a metal sintered material such that the bump is formed to be constricted in its middle portion in a thickness direction orthogonal to a surface of the insulating plate.

Packaging structure for bipolar transistor with constricted bumps

A semiconductor module includes a laminated substrate having an insulating plate, a circuit pattern on an upper surface of the insulating plate and a heat dissipating plate on a lower surface of the insulating plate. The module further includes a semiconductor device having upper and lower surfaces, and including a collector electrode on the device upper surface, an emitter electrode and a gate electrode on the device lower surface, and the emitter electrode and the gate electrode each being bonded to an upper surface of the circuit pattern via a bump, and a block electrode bonded to the collector electrode. The block electrode includes a flat plate portion covering over the semiconductor device, and a pair of projecting portions projecting toward the circuit pattern from both ends of the flat plate portion in a thickness direction orthogonal to a surface of the insulating plate, and being bonded to the circuit pattern.

Semiconductor module having block electrode bonded to collector electrode and manufacturing method thereof

A semiconductor device includes an insulated circuit board having conductor layers arranged away from each other and bonding materials each provided on the conductor layers; a wiring board having an opposing surface facing the conductor layers and through holes each corresponding to a position of each bonding material; hollow members each having a cylindrical portion and a flanged portion at one end of the cylindrical portion and having a cavity in common with the cylindrical portion, ok cylindrical portions press-fitted into the through holes, and other ends of the cylindrical portions bonded to the conductor layers by the bonding materials; and external connection terminals each inserted into the cavity of each hollow member and bonded to the conductor layers. Each cylindrical portion is inserted into each through hole such that each flanged portion contacts with an upper surface opposed to the opposing surface of the wiring board.

Semiconductor device and method for manufacturing the same

A semiconductor device includes: an insulation circuit substrate including a metal layer and an insulation substrate, the metal layer being formed on one surface of the insulation substrate, a connecting member having a cylindrical shape joined to the metal layer via a bonding material, a terminal pin inserted in the connecting member, and a reinforcement member having a cylindrical shape disposed on an outer periphery of the connecting member. The reinforcement member is made of a material having a hardness greater than that of the connecting member.

Semiconductor device having terminal pin connected by connecting member and method of manufacturing semiconductor device

A semiconductor module includes block-shaped first and second lower base members provided by bonding of flat lower surfaces on an insulated circuit board and having bottomed first and second hole portions open in upper surfaces in upper portions of the first and second lower base members, tubular first and second upper slide support members inserted in the first and second hole portions in a state where at least a part of outside surfaces is in contact with inside walls of the first and second hole portions, first and second pins inserted in contact with the insides of the first and second upper slide support members, and a sealing resin sealing the first and second pins except for the upper portions of the first and second pins.

Semiconductor module and semiconductor module manufacturing method

A semiconductor device includes a conductive plate to which a semiconductor element is mounted on a front surface; a sealing resin internally encapsulating at least the front surface of the conductive plate and the semiconductor element; and an external connection terminal connected to the conductive plate and exposed outside the sealing resin. The external connection terminal has a buckling portion or an expanding and contracting portion. The external connection terminal may have a notch and the buckling portion is a part having the notch.

Semiconductor device and method of manufacturing semiconductor device

A semiconductor device includes: an insulated circuit board including metal layers having recesses, and an insulating board having an upper surface on which the metal layers are arranged; external terminals having bottom ends with a width narrower than the width of openings of the recesses, these bottom ends being inserted into the recesses; a printed circuit board that directly supports the external terminals; and first bonding material that is arranged inside the recesses and respectively conductively connects the bottom ends of the external terminals to the metal layers.

An education support system provides information that helps educators and students to achieve effective and efficient learning. The system includes a plurality of terminal devices and a server. The terminal devices include a terminal display unit, voice output unit, reproduction log data memory unit, and transmission unit. The server includes a digital content memory unit that stores digital content received from the terminal devices, a receiver unit that receives the reproduction log data transmitted from the respective terminal devices, a data conversion unit, a server display unit; and a display control unit that arranges strings of phrases in the reproduction log data in a vertical direction, displays times spent on reproduction of the strings of the phrases to be displayed with the lateral length of the squares on a right side of the respective strings, and displays number of times of reproduction by phrase on the same screen.

Education support system and terminal device

The semiconductor device includes a first insulating circuit substrate; a semiconductor chip including a plurality of control electrodes, disposed on the first insulating circuit substrate; a second insulating circuit substrate including a plurality of first through-holes in which conductive members are arranged on inner walls and/or an outer periphery of ends of the first through-holes, the second insulating circuit substrate being disposed above the semiconductor chips; and first pins inserted into the first through-holes and having at one end a columnar part connected to the control electrodes of the semiconductor chips, and having at another end a head part that is wider than an inner diameter of the first through-holes.

Semiconductor device

To provide an education support system that allows educators to conduct adequate assessments considering handicaps or characteristics of individual students and to offer effective and efficient learning. Solving means includes: a plurality of terminal devices () including: a terminal display unit () that displays digital content; a voice output unit () that outputs voice data by voice; a reproduction log data memory unit () that memorizes ID information of phrases and phrase reproduction start times as reproduction log data; and a transmitter unit () that transmits the reproduction log data; and a server device () including: a digital content memory unit () in which digital content is memorized; a receiver unit () that receives reproduction log data from the respective terminal devices (); a data conversion unit () that converts the received reproduction log data into times spent on reproduction and numbers of times of reproduction by phrase; a server display unit () that displays the times spent on reproduction and numbers of times of reproduction by phrase; and a display control unit () that causes the server display unit to display a plurality of sets of the times spent on reproduction and numbers of times of reproduction by phrase at different times and dates in the same terminal device and for the same digital content simultaneously on a same screen.

A semiconductor device includes semiconductor elements and a multilayer substrate including an insulating plate and a circuit board on which the semiconductor elements are arranged that is arranged on the front surface of the insulating plate. The semiconductor device also includes a printed circuit board that is arranged facing a principal surface of the multilayer substrate and in which through holes are formed, as well as conductive posts that are inserted through the through holes and are electrically connected to the semiconductor elements via bonding materials. Furthermore, the semiconductor device includes fuses that are formed between the interior walls of the through holes and the outer peripheral surfaces of the conductive posts, are electrically connected to the printed circuit board via the conductive posts, and melt at a first temperature.

A semiconductor module includes sealing resin from which a main terminal protrudes, which seals an insulating substrate. The module includes a semiconductor element and a wiring substrate. The sealing resin has a nut housing portion in which a nut is disposed. The semiconductor module also has a busbar terminal to which a main terminal that protrudes from the sealing resin is electrically connected and which has an insertion hole facing the nut.

Semiconductor module

A semiconductor device according to the invention includes an insulating substrate including an insulating plate, a circuit pattern that is formed on a front surface of the insulating plate, and a radiator plate that is fixed to a rear surface of the insulating plate, a semiconductor chip that is fixed to the circuit pattern, an external lead terminal that is connected to a surface electrode of the semiconductor chip through a wiring line, a molding resin that covers the insulating substrate, the semiconductor chip, the wiring line, and the external lead terminal such that a rear surface of the radiator plate and a portion of the external lead terminal are exposed, and an anchor layer including a stripe-shaped concave portion which is formed in the circuit pattern by laser beam irradiation.

A semiconductor device is disclosed in which an implant board and a semiconductor element of a semiconductor mounting board are bonded and electrically connected through implant pins and which can be manufactured with high productivity. Implant pins are bonded to a semiconductor element and/or a circuit pattern of a semiconductor mounting board through cylindrical terminals press-fitted into the other ends of the implant pins. Press-fitting depth Lof each of the implant pins into corresponding cylindrical terminals is adjustable, so that total length of the implant pin and cylindrical terminal which are press-fitted to each other matches up with the distance between the semiconductor element and/or the circuit pattern on the semiconductor mounting board and an implant board.

Growing community of inventors

Matsumoto, Japan

Tatsuo Nishizawa