Tokyo Electron Limited

Tatsuo Kawashima

Kazumi Yamagata

Hiroshi Amemiya

Hiroshi Kaneko

Koji Kawaguchi

Michio Murata

There is provided an inspection apparatus, including: a housing having an upper surface on which an interface part for electrical connection with a probe card is provided; a first frame configured to be movable to a connection position where the first frame covers an upper portion of the interface part and to a retraction position where the first frame is retracted from the upper portion of the interface part; and a second frame configured to support a test head, arranged inside the first frame, and held by the first frame so as to be switchable between a fixed state in which the second frame is fixed to the first frame and a movable state in which the second frame is movable at least in a direction parallel to the interface part at the connection position.

Inspection apparatus

A probe card holding device includes: a frame that holds a probe card by vacuum suction; a sealing member provided on the frame and configured to form an enclosed space by contacting the probe card; a placement section in which a first engaging portion provided at an outer circumference of the probe card is placed when the probe card is attached to the frame; a second engaging portion configured to be engaged with the first engaging portion; and an actuator configured to drive the second engaging portion between a first position and a second position. When the second engaging portion is engaged with the first engaging portion in response to dissipation of the vacuum suction, the probe card is held by the probe card holding device while the sealing member maintains a seal with the probe card.

Probe card holding device and inspection device

There is provided a substrate inspection apparatus capable of inspecting the electrical characteristics of a packaged semiconductor device in a mounting environment. A prober includes a test box, a probe card and a package inspection card. A packaged device is attached to the package inspection card. A test board of the test box and a card board of the package inspection card reproduce the mounting environment in which a wafer-level system-level test is performed.

Substrate inspection apparatus

A probe system according to the present invention includes a probe unit and a loader unit which are adjacent to each other. The probe unit has a case defining a prober chamber for receiving an object to be tested, and a contact probe for testing the object received into the prober chamber. The loader unit has a case defining a loader chamber partially communicated with the prober chamber, and a carrying mechanism for carrying the object between the prober chamber and the loader chamber. In the loader unit, a main shielding cover for covering the carrying mechanism in the loader chamber is provided. The probe system is provided with means for supplying dry air into the interior of the main shielding cover of the loader unit and the prober chamber.

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Nirasaki, Japan

Tatsuo Kawashima