Seiko Epson Corporation

Tatsuo Ikeda

Hiroyuki Ogiso

Kazushige Ichinose

Eiji Karaki

Takuo Kuwahara

The case of a piezoelectric resonator in which a piezoelectric vibrator having a piezoelectric body and an electrode is flattened and a guard is provided protruding by the amount about the same as the thickness of the case on the hermetic terminal so that the open edge is received by insertion. Then the hermetic terminal in which one end of the piezoelectric vibrator is supported by the inner lead is inserted in the open edge of the case and the case is sealed by laser welding the welding area extending to the guard and to the open edge. By so doing, a thin piezoelectric resonator is provided which is desirable for surface mounting and being capable of maintaining the inside of the case in a stable vacuum state or sealed with nitrogen and the like for a long time. Moreover, by supporting the piezoelectric vibrator by the flattened inner lead inside the air tight case, a piezoelectric resonator is provided which has excellent frequency characteristics and long term aging characteristics.

Method and apparatus for sealing piezoelectric resonator via laser

The case of a piezoelectric resonator in which a piezoelectric oscillator piece having a piezoelectric body and an electrode is flattened and a guard is provided protruding by the amount about the same as the thickness of the case on the hermetic terminal so that the open edge is received by insertion. Then the hermetic terminal in which one end of the piezoelectric oscillator piece is supported by the inner lead is inserted in the open edge of the case and the case is sealed by laser welding the welding area extending to the guard and to the open edge. By so doing, a thin piezoelectric resonator is provided which is ideal for surface mounting and being capable of maintaining the inside of the case in a stable vacuum state or sealed with nitrogen and the like for a long time.

A resin mold type piezoelectric oscillator is provided comprising a piezoelectric oscillator having outer leads, a semiconductor integrated circuit for electrically oscillating the piezoelectric oscillator, and a lead frame formed substantially in a plane for mounting the piezoelectric oscillator and integrated circuit the lead frame having connection pads for connecting to the outer leads of the piezoelectric oscillator. The outer leads of the piezoelectric oscillator are bent at least twice in a plane substantially perpendicular to the lead frame so as to provide a clearance for crossing over inner leads of the lead frame.

Piezoelectric oscillator including a piezoelectric resonator with outer

A piezoelectric resonator is formed with a case and a stem for housing the piezoelectric vibrating portion thereof. The case and stem are coupled by press-fitting and the interface is coated with a high temperature solder containing at least 90% lead. An inner lead of the resonator is also coated with the solder and a portion of the vibrator is fixed to the lead by melting the solder. Alternative constructions employ a resin case or a metallic plate case and a configuration in which an integrated circuit and a piezoelectric vibrator are integrally molded to achieve a highly desirable mounting configuration.

Resin mold type piezoelectric resonator and resin mold type

Pressure seal type piezoelectric resonator

The invention relates to a piezoelectric oscillator wherein a case and a stem are coated with a solder containing 90% and higher of lead, an inner lead is also coated with the solder thereby fixing a piece of piezoelectric oscillator by melting the solder. The invention further relates to a piezoelectric oscillator wherein the piezoelectric oscillator is performed casing by resin or metallic plate, and to a piezoelectric oscillating apparatus wherein IC and a piezoelectric oscillator are internally mold to achieve a molding of high efficiency without inferiority while surface mounting.

Growing community of inventors

Minowa, Japan

Tatsuo Ikeda