Matsushita Electric Industrial Co., Ltd.

Takeda Chemical Industries, Inc.

Panasonic Corporation

Mitsubishi Gas Chemical Company, Inc.

Itoki Kosakusho Co., Ltd.

Three Bond

Tatsuo Fujii

Suzushi Kimura

Yuji Mido

Katsumasa Miki

Junji Oshima

Tsuyoshi Yoshino

Minoru Yamada

Junichi Kurita

Yuji Midou

Makoto Nakano

Hiroshi Fujii

Shinji Tachibana

Hideki Masumi

Seiji Takagi

Kenji Kuranuki

Goro Shimaoka

Hiroyuki Shiraki

Hiroyuki Mikuni

Tetsuhiro Korechika

Makoto Mizutani

Ichiro Sasaki

Kazuhiko Ishii

Kazuo Tadanobu

Hiroshi Serikawa

Hiroshi Takeuchi

Nobuyuki Oku

Yoichi Tabata

Hirokazu Morita

Nobuo Ohsawa

Yoshiaki Shishido

A chip type solid electrolytic capacitor includes a capacitor element-laminate. In the capacitor element-laminate, a plurality of capacitor elements, each having an anode portion and a cathode portion, are laminated so that the anode portions of the adjacent capacitor elements are disposed in the direction opposite to each other. Anode lead terminals are joined to the bottom faces of the anode portions of the capacitor elements disposed at both ends of the capacitor element-laminate. A cathode lead terminal is joined to the bottom face of the cathode portion of the capacitor element disposed in the center of the capacitor element-laminate. An Electrically insulating exterior resin coats the capacitor element-laminate so as to expose at least a part of the bottom faces of the anode lead terminals and a part of the cathode lead terminal.

Chip type solid electrolytic capacitor

A capacitor includes a first capacitor element and a second capacitor element laminated on this first capacitor element. The first capacitor element is a solid electrolytic capacitor including a through-hole electrode penetrating a valve metal sheet and having one surface on which cathode and anode terminal portions are taken out. The second capacitor element has first and second electrodes which are provided via a dielectric layer, and second through-hole electrodes penetrating the dielectric layer. The second through-hole electrodes are coupled to the first electrode and insulated from the second electrode. Lead-out portions of the second electrodes are exposed from the dielectric layer. The second through-hole electrodes and the lead-out portions are disposed alternately. The first electrode is electrically coupled to the first through-hole electrode and the second electrode is electrically coupled to the valve metal sheet.

Capacitor

A solid electrolytic capacitor includes a flat-shaped anode terminal having a first surface connected to an anode portion of a capacitor element and having a second surface opposite to the first surface, a flat-shaped cathode terminal having a first surface connected to a cathode layer of the capacitor element and having a second surface opposite to the first surface thereof, and an insulating resin package accommodating the capacitor element, the anode terminal, and the cathode terminal. The second surface of the cathode terminal is flush with the second surface of the anode terminal. The second surface of the anode terminal and the second surface of the cathode terminal expose to an outside of the resin package. The anode terminal includes a first thick portion and a first thin portion thinner than the first thick portion. The first thick portion has the second surface of the anode terminal and a portion of the first surface of the anode terminal. The first thin portion has a portion of the first surface of the anode terminal and being connected to the first thick portion. The cathode terminal includes a second thick portion and a second thin portion thinner than the second thick portion. The second thick portion has the second surface of the cathode terminal and a portion of the first surface of the cathode terminal. The second thin portion has a portion of the first surface and being connected to the second thick portion. This solid electrolytic capacitor has a small equivalent series inductance, and is stably mountable to a mount body.

Solid-state electrolytic capacitor and manufacturing method thereof

A chip solid electrolytic capacitor includes a capacitor element with an anode portion and a cathode portion, an anode lead frame, a cathode lead frame and packaging resin. The anode lead frame includes a first plane, an anode junction and an anode terminal. The anode junction is formed on one end of the first plane and connected to the anode portion. The anode terminal is formed on the other side of the first plane. The cathode lead frame has a second plane and a cathode terminal. The second plane has the cathode portion mounted thereon, is connected to the cathode portion, and is stacked on the first plane. The cathode terminal is formed on the same side of the second plane as the anode terminal. The packaging resin has a surface to be mounted and covers the capacitor element, with the anode terminal and the cathode terminal exposed on the surface to be mounted.

Chip solid electrolytic capacitor

A solid electrolytic capacitor includes a valve metal sheet having a porous portion on one side of the sheet, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer formed on the solid electrolyte layer, a through-hole electrode connected to the collector layer and penetrating the valve metal sheet to be exposed to the other side of the sheet, and an electrode terminal insulated from the through-hole electrode and connected to the valve metal sheet. The capacitor further includes an insulating portion penetrating the valve metal sheet and a penetration electrode penetrating the insulating portion. The solid electrolytic capacitor has a large capacitance and an excellent radio frequency response, and can be easily mounted on a semiconductor device.

Electrolytic capacitor and method for manufacturing the same

A method for manufacturing large capacitance solid electrolytic capacitors that can be connected direct with semiconductor component, and offer a superior high frequency characteristic. An aluminum foilis made porous in one of the surfaces, a dielectric layeris formed on the porous portion, a through holeis provided in the aluminum foilat a certain specific location. An insulation layeris formed to cover the other surface, viz. non-porous surface, of the aluminum foiland the inner wall surface of through hole, a solid electrolytic layeris provided on the dielectric layer, and a through hole electrodeis formed in the through hole, and then a collector layeris formed on the solid electrolytic layer. The insulation layerdisposed on aluminum foilis provided with an openingat a certain specific location, and a connection terminalis provided at the openingof insulation layerand the exposed surface of the through hole electrode, respectively.

Method for producing solid electrolytic capacitor

A method for manufacturing solid electrolytic capacitor that can be mounted direct on a semiconductor component and offers a superior high frequency characteristic. An aluminum foilis provided on one surface with a resist filmand then with a through hole. Next, an insulation filmis formed to cover the other surface of aluminum foiland to fill the first through hole, and then the resist filmis removed; and then the surface of aluminum foilis roughened to be provided with a dielectric layerthereon. A second through holeis formed in the insulation film, which is filling the first through hole. A through hole electrodeis formed in the second through hole; and then, on the surface of the dielectric layer, a solid electrolytic layerand a collector layerare formed. After an openingis provided, a first connection terminalis formed therein, and a second connection electrodeon the exposed surface of the through hole electrode

Method for manufacturing solid electrolytic capacitor

A solid electrolytic capacitor includes a bulb-metal sheet of which first face has a porous section. A dielectric film, a solid electrolyte layer, and a current-collecting layer are formed in this order on the porous section. On top of the current-collecting layer, a reinforcing plate is bonded. A second face opposite to the first face of the sheet has a connecting terminal conductive to the current-collecting layer. This connecting terminal is coupled to a through-hole electrode which extends through the bulb-metal sheet for appearing outside the second face. The second face has another connecting terminal conductive to the bulb-metal sheet. This structure makes the capacitor thin, and allows the capacitor to increase its stress-resistance and be excellent in responsiveness to a high frequency as well as in mounting convenience.

Solid electrolytic capacitor and manufacturing method of the same

A method of manufacturing solid electrolytic capacitors that can be directly connected to semiconductor components and have a faster response to a high frequency as well as a larger capacitance includes: a dielectric forming stage where a valve metal sheet ( ) is made porous and a dielectric coating ( ) is provided on the porous face ( ); an element forming stage where a solid electrolytic layer ( ) and a collector layer ( ) are formed on the dielectric coating ( ); and a terminal forming stage where a connecting terminal ( ) for connecting to an external electrode is formed. The element forming stage includes the steps of forming the solid electrolytic layer ( ); a forming through-hole electrode ( ) in a through-hole ( ) that is prepared on the valve metal sheet ( ); and forming the collector ( ) on the solid electrolytic layer ( ).

Method of manufacturing solid-state electrolytic capacitor

A dielectric layer is formed on a surface of a porous portion formed at least on a surface of a valve metal sheet. A solid electrolyte layer is formed on the dielectric layer, and a collector layer is formed on the solid electrolyte layer. A first insulating portion is formed on an outer periphery of the dielectric layer, and a solid electrolyte layer is formed on a portion of the dielectric layer corresponding to an opening of the first insulating portion. A portion of the solid electrolyte layer is formed on the first insulating portion. A second insulating portion is formed on the first insulating portion and on the outer periphery of the solid electrolyte layer. A collector layer is formed on a surface of the solid electrolyte layer exposed through an opening of the second insulating portion, thus providing a solid electrolytic capacitor. The solid electrolytic capacitor has less current leakage and a high withstand voltage.

Solid electrolytic capacitor and method of manufacturing capacitor

A solid electrolytic capacitor having a high capacitance and excellent high frequency response including a valve metal sheet which is made porous, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer and an electrode exposure area formed on the solid electrolyte layer, and an insulating section electrically insulating the electrode exposure area from the collector layer, in which the electrode exposure area and the collector layer are formed on the same surface of the valve metal sheet.

Solid electrolytic capacitor and method of manufacturing the capacitor

A dielectric coating, a solid electrolytic layer and a collector layer are provided to one face of a porous valve metal sheet. An insulating section covers this metal sheet including the layers discussed above. Conductive bodies, which are coupled with a first connecting terminal and a second connecting terminal, respectively, are surfaced on at least one face of the insulating section. Connecting bumps are formed on these conductive bodies, so that ICs and other parts are coupled with these bumps. This structure realizes a thin composite electronic component having an excellent high-frequency response.

Composite electronic components

The anisotropic conductive adhesives containing the conductive, multilayer-structured resin particles in which at least one inner layer is more flexible than the outermost layer and is chemically bound to at least one of the two adjacent layers and the surface of the outermost layer is covered with a metal make connections at lowered pressure enough to suppress development of cracking of the ITO electrode and also can provide enhanced stability, especially stability of connection over a prolonged period of time.

Conductive, multilayer-structured resin particles and anisotropic conductive adhesives using the same

A powder coating composition comprising a multilayer polymer particle, in which at least one inner layer is a polymer layer having a glass transition temperature (Tg) of not over 20&deg; C. and the outermost layer is a polymer layer having a Tg of not less than 60&deg; C. and, the monomer components forming the polymer layer having a Tg of not over 20&deg; C. are those having an unsaturated double bond in the molecule, and among the monomer components, a crosslinking monomer and a grafting monomer are used, respectively, within the ranges of 0.3 to 5 weight % and of 1 to 10 weight %, is dispersed in an amount of 1 to 30 parts by weight per 100 parts by weight of the total components other than the multilayer polymer particle can show excellent dispersibility to various powder coatings and can improve workability and impact resistance of a coat film while maintaining inherent characteristics of a powder coating such as appearance of a coat film and an anti-blocking property.

Growing community of inventors

Osaka, Japan

Tatsuo Fujii