Kabushiki Kaisha Toshiba

Nec Corporation

Nec C Orporation

Takashi Mukaibo

Tatsuo Akiyama

Yutaka Koshino

Kizashi Shimada

Masahiro Abe

Shigeru Komatsu

Yoshiro Baba

Shunichi Hiraki

Mayumi Kamura

Shoji Yachida

Yukihiro Ushiku

Naoto Miyashita

Yoshiyuki Sato

Yasuyoshi Matsumoto

Shigeki Sugimoto

Akira Ogawa

Tomonobu Noda

Yoichi Okabe

Souichi Imamura

Kenji Hirakawa

Ichiro Katakabe

Takuo Sugano

Kazuo Tsuru

Hidenori Kakinuma

Eiji Niki

Shunji Shuto

An object tracking device includes an image buffer configured to store a plurality of images included in a video, a detection part configured to detect an object position by executing a detection process with respect to an object reflected in the plurality of images, a tracking part configured to execute a tracking process with respect to a tracking-image string representing a scope of images ranging from an image producing an object-detection result and an image producing a next object-detection process, and an integration part configured to calculate an integrative object position by integrating a detection result and a tracking result. Herein, the scope of images is determined based on an execution timing or a termination timing of the detection process, thus executing the detection process and the tracking process in parallel.

Object tracking device, object tracking method, and object tracking program

The present invention provides a new image processing device that is robust against a change in capturing conditions. An image processing devicehas an acquisition unitfor acquiring an image, a smoothing unitfor smoothing the acquired image with a prescribed smoothing level, a binarization unitfor binarizing the smoothed image, and a control unitfor making the smoothing unitexecute multiple sessions of smoothing differing in the smoothing level.

Image processing device, image processing method, and program recording medium

An object tracking means tracks objects in a video image. An object consolidation determination means generates a 'container' which includes a plurality of objects located in proximity. When an object separation determination means determines that an object is released from the 'container', the object tracking means restarts tracking the object released from the &#x201c;container&#x201d;.

Object tracking device, object tracking method, and recording medium

In order to reduce the labor and processing load required during list production and list verification without requiring a specialized reading apparatus, and achieve sufficient identification performance, this management system includes a list storage means that stores a list of objects to be managed, an identification image generating means that detects, from an input image, an identifying part of the objects to be managed and generates the identification image in which the identifying part detected is depicted at a predetermined orientation and size in an image region, an identification image recording means that, when a first image capturing the identifying part of an object to be managed is inputted, records an identification image generated from the first image in the list of objects to be managed as the identification image of a designated identification unit and an identification image verification means that, when a second image capturing the identifying part of an object to be managed is inputted, uses an identification image generated from the second image as a key image, and verifies the key image against respective identification images recorded in the list of objects to be managed.

Management system, list production device, method, computer readable recording medium, data structure, and printed label

An image comparison unit () compares a query image with a registered image to detect, in the registered image, a region corresponding to the query image. An action information determining unit (), on the basis of intermediate information in which sub-region information identifying sub-regions in the registered image and action information representing information processing to be executed by a target device are associated with each other, identifies sub-regions on the basis of the sub-region information, chooses a sub-region having the highest degree of matching with the detected region among the identified sub-regions, and identifies action information corresponding to the chosen sub-region. An action information execution unit () causes the target device to execute information processing corresponding to the action information.

Information processing device, information processing method and information processing program

A feature point matching device includes a position feature generation unit for generating a position feature quantity for a feature point based on a position of the feature point included in an image, a pixel value feature generation unit for generating a pixel value feature quantity for the feature point based on a pixel value of the feature point included in the image, and a feature matching unit for matching a first feature point and a second feature point based on a degree of matching between a first position feature quantity generated from a first image and a second position feature quantity generated from a second image and a degree of matching between a first pixel value feature quantity generated from the first image and a second pixel value feature quantity generated from the second image.

Feature point matching device, feature point matching method, and non-transitory computer readable medium storing feature matching program

The arrangements of feature points are computed based on feature points acquired from checking target images. The feature amount having invariants as elements regarding a geometrical transformation is generated for each of the checking target images based on a computed result. And when checking whether or not the feature point arrangements of the checking target images are the same feature point arrangements by using the feature point amounts of the checking target images, at least each of the feature point arrangements that are bases for generating the feature amounts is stored, and a parameter regarding the geometrical transformation is computed based on the feature point arrangements of the checking target images. By utilizing the computed parameter regarding the geometrical transformation, whether or not the feature point arrangements of the checking target images are the same feature point arrangements is checked.

Document retrieval of feature point groups using a geometrical transformation

An arithmetic device () calculates a moving amount based on an image sensed before movement and an image sensed after movement. The arithmetic device () generates a difference image with minimum noise using the calculated moving amount. The arithmetic device () removes noise from the difference image by performing image processing of the difference image. The arithmetic device () determines based on the size of a binarized region in a binarized difference image whether an obstacle exists. This makes it possible to accurately calculate the moving amount and accurately determine whether an obstacle exists.

Moving amount calculation system and obstacle detection system

The present invention provides a solution for interleaving data frames, in a semiconductor device manufacturing system in which the processing apparatus for conducting a process on any one of a semiconductor substrate and a thin film on a surface thereof; a self-diagnostic system for diagnosing a state of the processing apparatus; and a parameter fitting apparatus for maintaining a parameter of the self-diagnostic system when an inspection result of the semiconductor substrate having undergone the process has been determined to be correct, and for changing the parameter of the self-diagnostic system when the inspection result has been determined to be incorrect.

Semiconductor device manufacturing system and method for manufacturing semiconductor devices including calculating oxide film thickness using real time simulator

A method for designing a manufacturing process of an electronic device includes calibrating a technology computer-aided design system by fitting simulation parameters of manufacturing process and electrical characteristic simulations, using first feature of commercial manufacturing process of first electronic device manufactured by first manufacturing facilities, and first electrical characteristic of the first electronic device; acquiring second feature of trial manufacturing process of second electronic device manufactured by second manufacturing facilities, and second electrical characteristic of the second electronic device; calculating simulation electrical characteristic of the second electronic device by substituting the second feature to the manufacturing process simulation corresponding to the trial manufacturing process; comparing the second electrical characteristic with the simulation electrical characteristic; and creating design specification of commercial manufacturing process of the second manufacturing facilities based on difference between the second electrical characteristic and the simulation electrical characteristic.

Method for designing a manufacturing process, method for providing manufacturing process design and technology computer-aided design system

A semiconductor design/fabrication system which combines a plurality of function blocks and arranges the combined function blocks on a chip, comprising: a function block selector which selects the function blocks to be arranged on the same chip from a plurality of function blocks for each of which a critical area indicating a range where defective products occur due to existence of defects is known; a chip information calculator which calculates a sum of the critical areas on each of the selected function blocks; an yield calculator which calculates an yield based on a calculation result of the chip information calculator and defect occurrence rate information of a chip fabrication line; a cost delivery time information calculator which calculates information relating to fabrication cost and delivery time of the chip based on a calculation result of the yield calculator and fabrication management information relating to cost and fabrication period of the chip fabrication line; and a combination selector which selects a combination of the function blocks constituting the chip based on the information relating to the fabrication cost and the delivery time of the chip calculated by the cost delivery time information calculator.

Semiconductor design/fabrication system, semiconductor design/fabrication method and semiconductor design/fabrication program

Critical location information is used for providing a critical location evaluation method for a semiconductor apparatus pattern. The critical location information includes coordinate information about the critical location and characteristic information indicating a thinning direction and a magnitude thereof at the critical location. Use of this evaluation method can accurately evaluate specification and analysis of thinning or a pattern which makes it difficult to pinpoint a critical location through the visual inspection.

Method of evaluating critical locations on a semiconductor apparatus pattern

A polishing method and apparatus are provided for detecting the polishing end point of a semi-conductor wafer having a polishing film and a stopper film formed thereon. First driving means are provided having a first drive shaft for rotating a polishing plate and a polishing cloth thereon. Second driving means having a second rotatable drive shaft are also provided. Mounting means for mounting the semi-conductor wafer is adapted to be rotated by the second driving means for polishing the wafer. Energy supplying means for supplying prescribed energy to the semi-conductor wafer are also included. Finally, detecting means for detecting a polishing end point of the polishing film is included and detects a variation of the energy supplied to the semi-conductor wafer. Different types of energy can be utilized such as infrared light and a vibration wave.

Polishing method and apparatus for detecting a polishing end point of a

A compound semiconductor device such as HEMTs (High Electron Mobility Transistors), metal semiconductor field effect transistors, and the like includes a compound semiconductor substrate having an active region, an insulating film provided over the semiconductor substrate, source and drain electrodes provided on the active region, and a gate electrode located between the source and drain electrodes. In the structure, the gate electrode has a lower electrode portion for providing a Schottky barrier contact with the active region through an opening of the insulating film, and an upper electrode portion provided on the insulating film to extend toward only the drain electrode.

Field effect transistor using compound semiconductor

A semiconductor device having a GaAs substrate and an ohmic electrode. An electrode pad is on part of the ohmic electrode and on part of the GaAs substrate outside the ohmic electrode. The electrode pad includes a first platinum film, a titanium film, a second platinum film, and a gold film which are sequentially deposited on one another. The first platinum film is thinner than each of the titanium film, second platinum film and gold film.

Growing community of inventors

Tokyo, Japan

Tatsuo Akiyama