Kabushiki Kaisha Toshiba

Sony Semiconductor Solutions Corporation

Tatsuji Ashitani

Yukiyasu Tatsuzawa

Shiroshi Kanemitsu

Kazuhiro Hiwada

Jun Deguchi

Yoshitaka Miyatani

Hideaki Majima

Motohiro Morisaki

Ryuta Okamoto

Miho Iizuka

Shape measuring systems are disclosed. In one example, a shape measuring system includes a light source part with a light source, a waveform control lens, and a scan mechanism. It also includes light receiving parts that each include a light receiving lens on which reflected light reflected by the measurement target among measurement light from the light source part is incident, an EVS, which is an asynchronous imaging device that is a light receiving element, an event issuing part that detects an event on the basis of output data from the EVS and outputs event data, and a transmitting part that outputs the event data to the signal processing part. A signal processing part includes an unwanted signal removing part that removes an unwanted signal resulting from incidence of secondary reflected light, and a three-dimensional calculating part that calculates a three-dimensional shape of the measurement target.

Shape measuring system

An imaging device according to the present disclosure includes a plurality of pixel units each including a first pixel unit and a second pixel unit and a vertical signal line, in which each of the first pixel unit and the second pixel unit includes an amplification transistor, a selection transistor connected between the amplification transistor and the vertical signal line, and a connection unit that selectively connects between a common connection node of the amplification transistor and the selection transistor of the first pixel unit and a common connection node of the amplification transistor and the selection transistor of the second pixel unit.

Imaging device and electronic apparatus for effective pixel signal reading

According to one embodiment, a solid state imaging device includes a first image sensor, a second image sensor, and an imaging processing circuit. A plurality of photoelectric conversion units are arranged in each of the first image sensor and the second image sensor. All of the photoelectric conversion units are configured to include pixels with different charge storage times. The imaging processing circuit includes an output combining unit. The output combining unit combines outputs by the pixels with different charge storage times with respect to each of the photoelectric conversion units.

Solid state imaging device, distance measuring device, and distance measuring method

According to one embodiment, a solid-state imaging device includes a high dynamic range (HDR) synthesizing unit. The HDR synthesizing unit synthesizes a first image signal from a first pixel and a second image signal from a second pixel. The first pixel is a pixel to which a first exposure time is applied. The second pixel is a pixel to which a second exposure time is applied. The second exposure time is shorter than the first exposure time. The first and second horizontal lines form a periodic array. The first horizontal line is a horizontal line formed by the first pixels. The second horizontal line is a horizontal line formed by the second pixels. In the periodic array, a combination of the first horizontal lines and the second horizontal lines of the number which is twice the number of first horizontal lines is formed as units.

Solid-state imaging device, image processing method, and camera module for creating high dynamic range images

According to one embodiment, a light receiver includes a light reception module, a multi-exposure area selector, a multi-exposure controller, and a readout module. The light reception module includes N lines, each of the N lines having a plurality of light receiving elements. The multi-exposure area selector is configured to select one or a plurality of single-exposure lines and one or a plurality of multi-exposure lines. The multi-exposure controller is configured to, per the unit time, perform an exposure on the single-exposure lines one time for a first exposure time; and a first exposure and a second exposure on the multi-exposure lines. The readout module is configured to read exposure amounts of the lines line by line. The multi-exposure controller is configured to start the second exposure on the multi-exposure lines before reading of the exposure amounts of all the single-exposure lines is completed.

Light receiver, method and transmission system with time variable exposure configurations

According to embodiment, an image processing device includes a black level correcting section. The black level correcting section includes a first input restricting unit and a second input restricting unit. The second input restricting unit performs a second input restriction, having a second signal level range including a moving average as a reference, on a black level signal subjected to a first input restriction by the first input restricting unit. A correction amount calculation unit calculates a difference of an average of signal values subjected to the second input restriction and a black level standard value as a correction value to apply on an effective pixel signal.

Image processing device, image processing method, and solid-state imaging device

According to embodiments, an image processing apparatus includes an image signal holding unit. The image processing apparatus uses an image signal passing through the common image signal holding unit to generate first, second and third correction values. The first correction value is a signal value applied to a pixel in which saturation of an output occurs in a saturation determination. The second correction value is a signal value subjected to a noise cancellation process. The third correction value is a signal value applied to a pixel in which defect occurs in a defect determination.

Growing community of inventors

Kanagawa, Japan

Tatsuji Ashitani