Denso Corporation

Toyota Jidosha Kabushiki Kaisha

Uacj Corporation

Denso Air Systems Corporation

Furukawa-Sky Aluminum Corporation

Tatsuhito Matsumoto

Kiyoshi Kawaguchi

Hiroshi Tanaka

Hidefumi Aikawa

Naoki Kato

Kazuo Kobayashi

Satoshi Ito

Tadayoshi Terao

Ryo Michikawauchi

Yu Ofune

Toshiyuki Kakinoki

Akira Ichinose

Satoshi Wakaguri

Masanari Numata

A system includes: a low-temperature circuit having a chiller and in which a cooling water circulates therethrough; a heat dissipation unit for dissipating heat to an air; a refrigeration circuit in which a refrigerant circulates and for absorbing heat from the cooling water to the refrigerant at the chiller and dissipating heat from the refrigerant at the heat dissipation unit; a ratio adjusting device for adjusting a heat dissipation unit passing ratio; and a controller for controlling an heat transfer amount adjusting apparatus capable of adjusting the heat transfer amount in the refrigeration circuit and the ratio adjusting device. If it is predicted that the temperature of the cooling water decreases, the controller controls the apparatus so that the heat transfer amount is increased and controls the ratio adjusting device so that the ratio is decreased, before the temperature of the cooling water flowing through the chiller decreases.

In-vehicle temperature control system

An aluminum alloy connector which is excellent in extrusion property and sacrificial anode property, the connector being extruded in a hollow shape from an aluminum alloy extrusion material consisting of 0.2 to 0.8% (hereinafter, '%' means 'mass %') of Si, 0.45 to 0.9% of Mg, 1.0 to 3.5% of Zn, 0.001 to 0.2% of Ti and the balance of Al plus unavoidable impurities. An electric potential of said aluminum alloy extrusion connector is lower than an electric potential of a pipe member made of an Al&#x2014;Mg&#x2014;Si series alloy or an Al&#x2014;Mn series alloy which is to be swaged to the connector, by 100 mV or more.

Hollow connector of aluminum alloy extrusion material which is excellent in extrusion property and sacrificial anode property

A cooling apparatus for cooling a heating body such as a CPU by boiling and condensing refrigerant has a tank having a heating body mounting portion on which the CPU is mounted; a porous metallic sintered body arranged in the tank; and refrigerant contained in the tank. The tank has a pair of faced walls including a heat-receiving wall and a radiation wall. The porous metallic sintered body is arranged along the heat-receiving wall, and transports the refrigerant collected at the bottom of the tank to an adjacent portion of the heating body mounting portion by using a capillary action. Since the refrigerant is boiled at such a wide adjacent portion, a superheat degree of the heating body mounting portion can decrease. Furthermore, since the refrigerant collected at the bottom of the tank is transported to the adjacent portion by the capillary action, an area of the radiation wall soaked in the refrigerant becomes small. As a result, a condensation area for condensing the vapor refrigerant becomes large, and then the supercool degree of the radiation wall can decrease. In this way, a cooling capacity of the cooling apparatus can increase.

Cooling apparatus by boiling and cooling refrigerant

Growing community of inventors

Aichi-ken, Japan

Tatsuhito Matsumoto