Hitachi, Ltd.

Ncr Corporation

Tatsuhiro Suzuki

Shinichi Arai

Gyozo Toda

Takashi Kuroki

Noriyuki Taguchi

Michio Takahashi

Tooru Mita

Makoto Saruta

Tsuyoshi Fuzita

Syoosaku Ishihara

An optical wireless communications system includes a plurality of terminals each having a transmitter which transmits optical signals on a first carrier frequency and a receiver which receives optical signals on a second carrier frequency, and a plurality of optical repeaters each having a plurality of transmitters, a plurality of receivers and an optical signal destination determining structure, the optical repeaters being coupled to communicate with each other and with the terminals wherein each of the optical repeaters converts the carrier frequency of the received optical signals from one frequency to another frequency and transmits the latter frequency signals to all the terminals and to all the optical repeaters except the transmitting optical repeater of the latter frequency signals.

Optical wireless communication system

As a die bonding apparatus for establishing electrical connection between electrodes on one side of a semiconductor chip and associated electrodes on a package comprises a pair of pinching and pressing mechanisms having a pair of pinching and pressing surfaces adapted to be moved closer relative to each other and so as to pinch and press semiconductor chip and package and at least one remote center mechanism provided in at least one of the pair of pinching and pressing mechanisms, in such a manner that a remote center thereof is positioned in the pinching and pressing surface of above-mentioned one pinching and pressing mechanism, for adjusting orientations of the pair of pinching and pressing surfaces to make the orientations thereof correspond to those of both surfaces of the semiconductor chip and the package at the time of the pressing and pinching operation all of the electrodes on one side of the semiconductor chip are thereby uniformly pressed against the corresponding electrodes on the package without any laterally shifting movement thereof even if the chip is inclined relative to the package because the sizes of bumps of the electrodes on the chip are not constant.

Die bonding apparatus

A ceramic multilayer circuit board is provided by sintering a multilayer wiring substrate containing alumina as a main component, which was prepared by the green sheet process, nickel plating and gold plating in this order on the superficial wiring conductor layer, printing a thick film conductor paste on the gold plating layer, firing the printed substrate and finally printing a thick film resistor paste on at least part of the thick film conductor layer and firing to form a thick film resistor layer.

Ceramic multilayer circuit board and a process for manufacturing the same

Growing community of inventors

Yokohama, Japan

Tatsuhiro Suzuki