The Furukawa Electric Co., Ltd.

Furukawa Techno Material Co., Ltd.

Tatsuhiko Ueki

Masaaki Yamamoto

Masami Ikeda

Mamoru Shimada

Kengo Mitose

Yuji Hiratani

Takehiko Nomura

Hideyuki Nasu

Ken Sasaki

Hiroyuki Kobayashi

Tatsuya Kimoto

Hiroshi Horikawa

Yuichi Kimura

Toshikazu Mukaihara

Kaisuke Shiroyama

George Murota

Kazuhiro Otsuka

Dmitrii Victorovich Golberg

Hitoshi Sho

An optical module including a temperature measurement module and an optical part having a temperature dependency. The module includes a temperature control part mounted directly or indirectly on the optical part and the temperature measurement part for controlling a temperature of the optical part and the measurement part by thermal contact. An adjustment system is also provided for adjusting a difference of the temperature of the optical part and the measurement part by controlling the heat flow into/out of the optical part or the measurement part.

Optical transmission module with temperature control

A plate-type heat pipe including a hermetically sealed container in which a working fluid is received, said container comprising a plate member on which at least one heat generating device is thermally connected and another plate member forming a cavity inside thereof in combination with said plate member, and said container being formed by pressure-bonding both peripheral portions of said plate member and said another plate member combined together.

Plate-type heat pipe and method for manufacturing the same

An optical module of the present invention can stabilize e.g. the temperature of a wavelength monitor portion so that the oscillating wavelength of a laser diode is stabilized. The laser diode and the wavelength monitor portion for monitoring the wavelength of the laser diode are included in a package, and are mounted onto a thermo module. The wavelength monitor portion comprise at least an optical filter positioned to receive and filter at least a component of the laser beam and a light receiving device to receive the filtered light through the optical filter and monitor a wavelength of the laser beam. A heat shield member for reducing heat transmission from the package to the wavelength monitor portion is arranged in at least one portion of a peripheral area of the wavelength monitor portion.

Optical module having temperature adjustment features

A temperature adjustment device has a first thermoelectric cooling module, a second thermoelectric cooling module on which the first thermoelectric cooling module is provided, and a heat generating element which is provided on the first thermoelectric cooling module and a temperature thereof is adjusted, where assuming that a substrate area of the first thermoelectric cooling module on which the heat generating element is provided is S(mm) and that an amount of generated heat of the heat generating element is Qd(mW), the relationship of 20&#x2266;Qd/S&#x2266;200 is met.

Temperature adjustment device and laser module

An optical filter is provided on a first thermo-module whose temperature is controlled to be constant, via a base. Accordingly, a wavelength discrimination characteristic of the optical filter and an optical isolator can be stabilized, thereby realizing more accurate wavelength locking. Further, a second thermo-module is provided on the first thermo-module whose temperature is controlled to be constant. Accordingly, the temperature control range of the second thermo-module can be expanded, and hence the wavelength variable range of a semiconductor laser device provided on the second thermo-module via a base and a submount can be expanded.

Laser module

A plate type heat pipe comprises: a plate type container which includes a heat absorbing side and a heat dissipating side to form a hermetically sealed hollow portion; at least one heat transfer block which is thermally connected to each of inner walls of the heat absorbing side and the heat dissipating side; a wick which is placed along a side wall of the heat transfer block through the inner wall of the heat dissipating side; and a working fluid enclosed in the hollow portion. A securing member to secure the wick and the heat transfer block in close contact may be further included.

Method of manufacturing plate type heat pipe

A plate type heat pipe having a hermetically sealed container installed so as to face a printed board on which at least one part to be cooled is mounted, wherein a block which passes through at least one main surface portion of the container is arranged within the container in a corresponding portion to the part(s) to be cooled.

Plate type heat pipe and a cooling system using same

A plate type heat pipe comprises two plate members facing each other to form a hermetically sealed container, on either one of which plate members at least one heat generating parts are mounted, at least one heat transfer block having a cross sectional area equal to or larger than a cross sectional area of the heat generating part, the heat transfer block being disposed at a prescribed position within the hollow portion corresponding to a position of the plate member to which the heat generating part is thermally connected, and a working fluid enclosed in the container.

Plate type heat pipe and cooling structure using it

Plate type heat pipe method of manufacturing same and cooling apparatus using plate type heat pipe

The present invention provides a Ni--Ti--Pd superelastic alloy material of a composition consisting of, by atomic percent, 34 to 49% nickel, 48 to 52% titanium and 3 to 14% palladium. Optionally, in a part of nickel and/or titanium of this alloy is replaced with one or more elements selected from a group of Cr, Fe, Co, V, Mn, B, Cu, Al, Nb, W and Zr such that these elements to be replaced amount to 2% or less in total (by atomic percent), wherein a stress hysteresis between the loading and unloading stresses in the stress-strain curve at temperatures between Af and Af+5.degree. is as small as 50 to 150 MPa. Since the Ni--Ti--Pd superelastic alloy material having the above composition is excellent in hot workability, it can be hot-worked into a wire having a diameter up to the range from 1 to 5 mm and manufactured at a low cost. Then, a final heat-treatment is given to the hot-worked material at a temperature in the range from 300 to 700.degree. C. through a step of final cold-drawing at a reduction ratio in a cross section area of not less than 20%, whereby an excellent superelastic material is obtained, with a stress hysteresis in the range from 50 to 150 MPa, and a residual strain of 0% or close to 0% after unloading, and which can be suitably used for an orthodontic archwire.

Ni-Ti-Pd superelastic alloy material, its manufacturing method, and

The present invention provides a Ni--Ti--Pd superelastic alloy material of a composition consisting of, by atomic percent, 34 to 49% nickel, 48 to 52% titanium and 3 to 14% palladium. Optionally, a part of nickel and/or titanium of this alloy is replaced with one or more elements selected from a group of Cr, Fe, Co, V, Mn, B, Cu, Al, Nb, W and Zr such that these elements to be replaced amount to 2% or less in total (by atomic percent), wherein a stress hysteresis between the loading and unloading stresses in the stress-strain curve at temperatures between Af and Af+5.degree. is as small as 50 to 150 MPa. Since the Ni--Ti--Pd superelastic alloy material having the above composition is excellent in hot workability, it can be hot-worked into a wire having a diameter up to the range from 1 to 5 mm and manufactured at a low cost. Then, a final heat-treatment is given to the hot-worked material at a temperature in the range from 300.degree. to 700.degree. C. through a step of final cold-drawing at a reduction ratio in a cross section area of not less than 20%, whereby an excellent superelastic material is obtained, with a stress hysteresis in the range from 50 to 150 MPa, and a residual strain of 0% or close to 0% after unloading, and which can be suitably used for an orthodontic archwire.

A device which is installed onto an ingrown nail of a human toe to correct the ingrown nail, includes a support member affixed to the ingrown nail, and a correcting member supported by the support member and effecting force on the ingrown nail toward the correcting direction for the ingrown portion of the nail. The correcting member may be formed of a superelastic material which is shape-memory-treated to memorize a first shape, and which is deformed to a second shape different from the first shape so as to be installed onto a surface of the ingrown nail of the human toe in the second shape.

Device for correcting an ingrown nail

A method of manufacturing a high-temperature shape memory alloy includes the steps of cold-working a high-temperature shape memory alloy, in which a reverse martensite transformation start temperature (As) in a first heating after cold working reaches 350.degree. C. or above. Thereafter, the cold-worked alloy undergoes a first heat treatment for a period of time within the incubation time required for recrystallization or less, and at a temperature higher than a reverse martensite transformation finish temperature (Af). Finally, the resultant alloy is annealed with a second heat treatment, at a temperature which is not less than the plastic strain recovery temperature and not more than the recrystallization temperature. Specifically, the first heat treatment is performed for a period of three minutes or less at a temperature which exceeds 500.degree. C. and which is lower than the melting point of the alloy. The composition of the high-temperature shape memory alloy is Ti.sub.50 Ni.sub.50-x Pd.sub.x (x being 35 to 50 at %), Ti.sub.50-x Ni.sub.50 Zr.sub.x (x being 22 to 30 at %), Ti.sub.50-x Ni.sub.50 Hf.sub.x (x being 20 to 30 at %) or the like.

Growing community of inventors

Tokyo, Japan

Tatsuhiko Ueki