The Furukawa Electric Co., Ltd.

Tatsuhiko Eguchi

Koji Sato

Kuniteru Mihara

Kiyoshige Hirose

Hiroshi Kaneko

Isao Takahashi

Daisuke Kikuchi

Nobuyuki Tanaka

A method of producing a copper alloy containing a precipitate X composed of Ni and Si and a precipitate Y that includes (a) Ni and 0% Si, (b) Si and 0% Ni, or (c) neither Ni nor Si, wherein the precipitate X has a grain size of 0.001 to 0.1 &#x3bc;m, and the precipitate Y has a grain size of 0.01 to 1 &#x3bc;m.

Copper alloy

A copper alloy material, having an alloy composition containing any one or both of Ni and Co in an amount of 0.4 to 5.0 mass % in total, and Si in an amount of 0.1 to 1.5 mass %, with the balance being copper and unavoidable impurities, wherein a ratio of an area of grains in which an angle of orientation deviated from S-orientation {2 3 1}&#x3c;3 4 6&#x3e; is within 30&#xb0; is 60 % or more, according to a crystal orientation analysis in EBSD measurement; an electrical or electronic part formed by working the copper alloy material; and a method of producing the copper alloy material.

Copper alloy material, electrical or electronic parts, and method of producing a copper alloy material

Provided is a clathrate compound represented by a following chemical formula, for example,BaGaAlSi(where 7.77&#x2266;a&#x2266;8.16, 7.47&#x2266;b&#x2266;15.21, 0.28&#x2266;c&#x2266;6.92, 30.35&#x2266;d&#x2266;32.80, and a+b+c+d=54), and a thermoelectric material containing the clathrate compound. A producing method of the thermoelectric material is also provided.

Clathrate compound, thermoelectric material, and method for producing thermoelectric material

A copper alloy for electric and electronic equipments, containing from 0.5 to 4.0 mass % of Ni, from 0.5 to 2.0 mass % of Co, and from 0.3 to 1.5 mass % of Si, with the balance of copper and inevitable impurities,

Copper alloy for electric and electronic equipments

A copper alloy strip material for electrical/electronic equipment includes a copper alloy containing 2.0 to 5.0 mass % Ni, 0.43 to 1.5 mass % Si, and a remaining component formed of Cu and an unavoidable impurity. Three types of intermetallic compounds A, B, and C comprising Ni and Si in a total amount of 50 mass % or more are contained. The intermetallic compound A has a compound diameter of 0.3 &#x3bc;m to 2 &#x3bc;m, the intermetallic compound B has a compound diameter of 0.05 &#x3bc;m to less than 0.3 &#x3bc;m, and the intermetallic compound C has a compound diameter of more than 0.001 &#x3bc;m to less than 0.05 &#x3bc;m.

Copper alloy strip material for electrical/electronic equipment and process for producing the same

A conductor of an electric cable for wiring, containing a copper alloy material containing 1.0 to 4.5 mass % of Ni, 0.2 to 1.1 mass % of Si, and the balance of Cu and unavoidable impurities, in which the copper alloy material has an average grain diameter of 0.2 to 5.0 &#x3bc;m.

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Tokyo, Japan

Tatsuhiko Eguchi