Renesas Electronics Corporation

Tatsuaki Tsukuda

Hideki Sasaki

Masayoshi Hirata

Akihiro Nakahara

Tadashi Shimizu

Hiroki Shibuya

Shinji Nishizono

Kazuaki Tsuchiyama

Masahiro Dobashi

Hiroko Kubota

A performance of a semiconductor device is improved. The semiconductor device includes a semiconductor chip, and a clip mounted on the semiconductor chip via a silver paste. Here, the semiconductor chip includes a passivation film having an opening, a source pad of a main transistor having a portion exposed from the passivation film at the opening, and a wall portion provided on the passivation film so as to surround the source pad in a plan view. At this time, a whole of the portion (exposed surface) of the source pad, which is exposed from the passivation film, is covered with the silver paste. Further, in the plan view, the silver paste connecting the source pad with the clip is positioned inside of an area surrounded by the wall portion, without overflowing.

Semiconductor device

A semiconductor device includes a wiring substrate including a first wiring layer. The first wiring layer includes a first wiring pattern which is a transmission path of a first signal, a second wiring pattern which is a transmission path of a second signal and which is arranged next to one side of the first wiring pattern, and a third wiring pattern which is a transmission path of a third signal and which is arranged next to the other side of the first wiring pattern. A wiring pattern group including the first through third wiring patterns has: a first portion in which wiring widths of the first through third wiring patterns are equal to each other; and a second portion in which the wiring width of the first wiring pattern is larger than the wiring width of each of the second and third wiring patterns.

A width of each of a first signal terminal and a reference potential terminal formed in a first connection region of a core insulating layer constituting a flexible substrate is larger than a width of each of a first backside signal terminal and a backside reference potential terminal formed in a second connection region of the core insulating layer. In addition, a first separation distance between the first signal terminal and the reference potential terminal arranged adjacent to the first signal terminal is smaller than a second separation distance between the first backside signal terminal and the backside reference potential terminal arranged adjacent to the first backside signal terminal. An insulating film formed on a first surface of the core insulating layer at a position overlapping each of the first connection region and the second connection region covers the first connection region such that the second connection region is exposed.

Electronic device

An electronic device comprises a switching regulator. Here, the switching regulator has a first wiring portion (including a parasitic inductance) coupling the high-side element and the low-side element, and a second wiring portion (including a parasitic inductance) coupled with the low-side element. Also, the switching regulator has a first region in where the first wiring portion and the second wiring portion are lined up with each other. As a result, the performance of the electronic device can be improved.

Electronic device with reduced parasitic inductance

An electronic device includes a wiring board and a semiconductor device on the wiring board's main surface. The semiconductor device includes a semiconductor chip on a die pad sealed by a sealing body. A back surface of the die pad is directed to a main surface of the sealing body. A back surface of the sealing body faces the main surface of the wiring board. First and second electrodes are formed on the wiring board and in the sealing body, respectively. The second electrode is disposed in the back surface of the sealing body, and is bonded to a metal plate connecting a lead and a pad. A distance between the first and second electrodes is shorter than that between the metal plate and the first electrode. The first and second electrodes overlap each other in a plan view. A capacitor is composed of the first and second electrodes.

An electronic device according to one embodiment includes a wiring substrate, the wiring substrate having a first wiring connected to a first external terminal and a second wiring connected to a second external terminal and extending along the first wiring. Additionally, the above electronic device has a semiconductor device mounted on the above wiring substrate and electrically connected to each of the first and second wirings. Further, the above electronic device has a capacitor mounted on the above wiring substrate and electrically connected to the semiconductor device via each of the above first and second wirings. Furthermore, a distance between the above semiconductor device and capacitor is shorter than a distance between each of the above first and second external terminals and the above capacitor.

A loop antennaincludes: a first electrode terminal; a second electrode terminalarranged to make a pair with the first electrode terminal; and a loop-shaped memberwhich has one end connected to the first electrode terminaland the other end connected to the second electrode terminal, is wound a plurality of times, and is made of a conductive material. The first electrode terminaland the second electrode terminalare arranged so as to make a pair with respect to a center lineof the loop-shaped member. Further, the loop-shaped memberincludes a first loop-shaped member, a second loop-shaped member, and an intersection part. The intersection partis arranged on the center linein a plan view, and the loop-shaped memberis continuously connected and formed to be symmetrical with respect to the center line

Loop antenna and communication control device

A wiring board of an electronic device includes: a board terminal connected to a semiconductor device (semiconductor component); a wire formed in a first wiring layer and electrically connected to the board terminal; a conductor pattern formed in a second wiring layer and electrically connected to the wire via a via wire; and another conductor pattern formed in a third wiring layer and supplied with a first fixed potential. The conductor pattern and the another conductor pattern face each other with an insulating layer interposed therebetween, and an area of a region where the conductor pattern and the another conductor pattern face each other is larger than an area of the wire.

To achieve a reduction of noise in a wireless system of an electronic device for communication. The electronic device for communication includes: a bottom lid; a loop antenna that forms an electromagnetic field; a communication circuit coupled to the loop antenna; a battery pack that is a metallic part; a magnetic sheet arranged between the loop antenna and the metallic part, the magnetic sheet including a protruding portion that protrudes outside an outer peripheral portion of the loop antenna; a wiring substrate arranged over the battery pack and having an IC and the like mounted thereon; and a lid with a display arranged over the wiring substrate, in which, with the outer peripheral portion of the loop antenna as a base point, a protruding amount from the base point of the protruding portion of the magnetic sheet is twice or more a wiring width of the loop antenna.

Electronic device for communication

In a communication control device in which an antenna electrode having an antenna connected thereto, a power supply circuit, and a communication circuit are mounted on a mounting board, the antenna electrode is disposed at one corner portion on a principal surface of the mounting board, the communication circuit is disposed on a side of a first side of the principal surface that shares the corner portion, and the power supply circuit is disposed on a side of a second side facing the first side. Further, a first signal path connecting the antenna electrode and the communication circuit extends along the first side, and a second signal path connecting the antenna electrode and the power supply circuit extends along a third side that shares the corner portion and is perpendicular to the first side.

Communication control device and mounting board

A semiconductor device has a wiring board having a wiring, a semiconductor chip that is mounted on the wiring board, and an electric conductor reference plane provided in the inside of the wiring board, in which in top view. The wiring includes a first region that overlaps the electric conductor reference plane and a second region that is the whole region except for the first region. A conductor chip is mounted above the second region.

Semiconductor device having wiring formed on wiring board and electric conductor formed in wiring board and conductor chip formed over wiring

A semiconductor device includes an interposer, and a semiconductor chip mounted on the interposer. In a plan view, the interposer includes a first region overlapping the semiconductor chip, and a second region excluding the first region. The interposer includes at least one wiring formed astride the first region and the second region. The cross-sectional area of the wiring in the first region and the cross-sectional area of the wiring in the second region are different from each other.

Growing community of inventors

Tokyo, Japan

Tatsuaki Tsukuda