Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Tateo Nakashima

Masato Hirano

Yoshinori Sakai

In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzleand that of the picked-up componentis measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassettefrom which the componenthas been fed is in abnormal condition, as well as the mounting action of the componentis stopped.

Method and device for mounting electronic component

In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle and that of the picked-up component is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette from which the component has been fed is in abnormal condition, as well as the mounting action of the component is stopped.

In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle,and that of the picked-up component,is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette,from which the component,has been fed is in abnormal condition, as well as the mounting action of the component,is stopped.

Growing community of inventors

Kyoto, Japan

Tateo Nakashima