Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Hitachi-lg Data Storage, Inc.

Other

Hitachi Global Storage Technologies Netherlands B.v.

Hitachi Metals, Ltd.

Elpida Memory, Inc.

Hgst Netherlands, B.v.

Hitachi Cable, Inc.

Hitachi Consumer Electronics Co., Ltd.

Opnext Japan, Inc.

Hitachi, Ltd., Intellectual Property Group

Tatemi Ido

Hirohisa Sano

Makoto Takahashi

Masahiro Aoki

Kazuhisa Uomi

Taira Kinoshita

Takamitsu Nagara

Takayuki Tsutsui

Atsushi Nakamura

Toshiki Sugawara

Kunio Harada

Makoto Okai

Atsushi Takahashi

Nobumasa Nishiyama

Tomonobu Tsuchiya

Yasunobu Matsuoka

Masaaki Shida

Kouji Yoshida

Tsuyoshi Sonehara

Tooru Takahashi

Hiroshi Kawazoe

Akira Kitayama

Kouichi Ihara

Tomoyuki Kamata

Kenji Kogo

Tomonori Sekiguchi

John Thomas Contreras

Mitsuaki Katagiri

Hideki Osaka

Osamu Nagashima

Noriyuki Sakuma

Kimio Tatsuno

Ichiro Anjo

Tatsuyuki Saito

Akira Kuriyama

Atsushi Isobe

Shinji Sakano

Makoto Suzuki

Tomoaki Shibata

Atsushi Takai

Shigehisa Tanaka

Nobuo Miyadera

Eriko Takeda

Yuudai Kamada

Xinzhi Xing

Chisaki Takubo

Hideyuki Kuwano

Hiroharu Sakai

Shigeki Makino

Kazuhiro Nagaoka

Naohiko Baba

Nobuaki Sato

Yuji Soga

Takashi Shiota

Tadahiro Kimura

Hideaki Takano

Ryoji Suzuki

Yasunori Iwafuji

Toshiya Yuhara

Hiroyuki Gomyo

Kenji Takahashi

Akira Kuwahara

Hirokazu Ichikawa

Mari Koizumi

Airtightness in a cavity of an inertial sensor (acceleration sensor) is increased to achieve high sensitivity. In the acceleration sensor having movable electrodes VE, VEand fixed electrodes FE, FE, the fixed electrodes are formed by portions surrounded by a through hole THprovided in a cap layer CL, and the through hole is filled with an insulating film IFand polysilicon P and has a wide portion (WP). The wide portion has a gap SP that is not filled with the insulating film IFand the polysilicon P, and the gap SP is filled with the interlayer insulating film ID. With such a configuration, degassing can be exhausted through the gap (airway) SP in a pressure reducing step.

Inertia sensor and method of manufacturing the same

A method and apparatus is provided for extending a read bandwidth and increasing a high-frequency signal-to-noise ratio (SNR) of a front-end of a read path of a hard disk drive (HDD) by introducing a high impedance section at the front-end of the read path. The high impedance section may mitigate capacitive effects found at the front-end of the read path, thereby improving signal transfer by extending the read bandwidth.

Read path compensation for SNR and signal transfer

There are provided an optical interconnection module and an optical-electrical hybrid board using the same to process optical and electric signals on a board at a low transmission loss at high speed in transmitting high-speed optical signals sent and received between chips or between boards in a data processing apparatus. An optical interconnection module has a structure in which an optical signal is emitted from a laser optical source device, propagates the inside of a modulator device, and is deflected by a beam turning structure in the vertical direction of a substrate, an optical signal is incident from the outside of a semiconductor substrate, and transmitted and received at a photo diode provided on the semiconductor substrate, and the optical signals are optically connected to each other through the inside of the semiconductor substrate in the vertical direction of the substrate with the outside of the semiconductor substrate.

Optical interconnection module and optical-electrical hybrid board

An optical module providing higher reliability during high-speed light modulation and a lower bit error rate when built into a transmitter (transceiver). An optical module contains a taper mirror for surface emission of output light, an optical modulator device, and an optical modulation drive circuit, and the optical modulator device and the optical modulation drive circuit are mounted at positions so as to enclose the taper mirror.

Optical module

There is provided an optical disc drive comprises an optical pick-up including a laser diode (LD) and a laser diode driver (LDD) for driving the laser diode, a digital signal processor (DSP) including a write strategy circuit and low voltage differential signaling (LVDS) drivers for transmitting a produced write strategy signal, a circuit board having the DSP mounted thereon and including a line for transmitting the write strategy signal, a transmission line connecting the circuit board and the LDD and transmitting a write strategy signal, and differential resistors connected between differential lines of outputs of the LVDS drivers. Especially, a resistor having a resistance value in a range of 80 to 500&#x3a9; is inserted between the differential lines of outputs of the LVDS driver inside the DSP.

Optical disc drive

An electronic device including a mechanism for changing the relative positions of two circuit boards such as in an optical disc drive is provided. A flexible printed circuit electrically connected between the two circuit boards changes shape to suppress fluctuations in the transmission characteristics occurring due to contact with metal such as a case, and provides stable signal transmission. The flexible printed circuit includes at least one or more differential lines, a fixed unit affixed to a case at least at one location, and a movable unit that changes shape according to the relative positions of two cases. The lines adjacent to the differential line are a grounded surface, and the flexible printed circuit is formed to narrow the distance between the movable unit lines more than the distance between the fixed unit lines.

Flexible printed circuit and electric apparatus and optical disc drive having flexible printed circuit

A head-stack assembly. The head-stack assembly includes: a magnetic-recording head; a lead-suspension supporting the magnetic-recording head on an actuator arm; a metal plate coupled with the actuator arm; a resin layer disposed on the metal plate; a flexible-printed-circuit board disposed on the resin layer, and substantially perpendicularly connected to the lead-suspension; a arm-electronics module disposed on the flexible-printed-circuit board configured to shape a write-signal current waveform of a write signal to said magnetic-recording head; transmission lines disposed on the flexible-printed-circuit board configured to transmit the write signal to, and a read-back signal from, the lead-suspension; and, a single intermediate conductor layer that is disposed between the resin layer and the flexible-printed-circuit board, and having a planar shape substantially facing a bottom of the arm-electronics module and a bottom of the transmission lines.

Head-stack assembly including heat-dissipation and impedance-matching structure and hard-disk drive using the head-stack assembly

In a MIMO wireless transceiver, priority control that judges priority of transmit data and a transmission mode table are provided to control an option as to which transmission system SDM or STBC is selected, coding rate and modulation method based on a transmission mode for a transmission destination that is determined by priority of transmission data and status of a communication matrix at the time of data transmission. With such arrangement, a wireless communication system composed of the MIMO wireless transceiver can control coding, MIMO signal processing and modulation methods according to priority of transmit data. More specifically, it is possible to ensure transmission of data having higher priority and improve throughput in total when a plurality of types of data are transmitted.

Wireless transceiver

A radio frequency circuit apparatus and a radio frequency module which permit alleviation of the PA efficiency drop and are compatible with both a MIMO system and a conventional system are to be provided. They are provided with a plurality of power amplifiers for amplifying a transmit signal and the plurality of power amplifiers include at least two power amplifiers differing in maximum output power from each other, and at least one out of the plurality of power amplifiers is used according to the communication system.

Radio frequency circuit apparatus and radio frequency module

An electrophoresis member is produced by laying a plurality of capillaries on an adhesive layer born on a support layer to form a capillary layer, laminating thereon a second support layer, and partially removing the first support layer, the first adhesive layer and the second support layer to partially expose the capillaries to form a window portion for irradiation and detection and a sample injection portion for injecting a sample.

Electrophoresis member, production thereof and capillary electrophoresis apparatus

Wireless transceiver having plural transmission methods

A semiconductor storage employs a base substrate () having a command/address external terminal group (CA), a data input/output external terminal group (DQ), and a single chip select external terminal (CS), and also comprises a plurality of memory chips () to () mounted on a base substrate (), each of which can individually carry out read and write operations. The terminals (CA), (DQ), and (CS) are connected to an interface chip (). The interface chip () has a chip select signal generation circuit that can individually activate a plurality of memory chips () to () on the basis of an address signal fed by way of the terminal (CA) and on the basis of a chip select signal fed by way of the terminal (CS).

Semiconductor storage device having a plurality of stacked memory chips

The present invention provides an optical module using optical waveguides which permits easy fabrication of a PLC type optical multiplexer/demultiplexer with reduced loss. The optical module comprises cores which are contiguous to each other through a dicing groove adapted to position and fix an optical functional part such as a wavelength selection filter and a core branched from the said cores. A slight gap is present between the former and the latter core and both cores are narrower in width in the vicinity of the dicing groove than the other portions.

Optical waveguide apparatus

An object of disclosed technology is to control lasing wavelengths so that a wavelength shift does not occurs. Another object is to permit wavelengths of a light source for wavelength division multiplexing optical-fiber communication system to be variable in response to an ITU-TS grid. A means for achieving the objects is as follows: locating an etalon in a light path of diode laser light, which is a parallel plane wave changed by a collimator lens; generating a wavelength error signal from a difference between both of divided pieces of light from transmitted light or reflected light; and locking a wavelength of a diode laser device according to the wavelength error signal.

Optical fiber communication equipment and its applied optical systems

Growing community of inventors

Kodaira, Japan

Tatemi Ido