Parade Technologies, Ltd.

Tatao Hsu

Haijun Chen

Yueh-Lin Yang

Jonathan Huang

Quan Yu

An electronic device has a display substrate including a display area, a driver area, and a fan-out area. The fan-out area has interconnects providing electrical accesses to display elements of the display area. The device has a driver chip disposed on the driver area. The driver chip includes a first edge adjacent to the display area and multiple pad groups, each pad group including a respective row of electronic pads that is (i) arranged substantially in parallel with the first edge and (ii) electrically coupled to a respective subset of display elements via respective interconnects routed on a respective region of the fan-out area. The pad groups include a first pad group and a second pad group. The first and second pad groups have two different distances from the first edge and correspond to two different subsets of interconnects routed on two non-overlapping regions of the fan-out area.

Distributed and multi-group pad arrangement

An electronic device has a display screen and a driver chip disposed on a driver area of the display screen. A fan-out area of the display screen has interconnects configured to provide electrical accesses to display elements of the display area. The driver chip includes a first edge, a second edge, and a row of electronic pads proximate to the first edge. The electronic pads have a first subset of end pads at a first end of the first row, a second subset of end pads at a second opposite end of the first row, and a subset of intermediate pads located between the first subset and second subset of end pads. The first subset of end pads physically contact a first subset of interconnects from the first edge, and the subset of intermediate pads physically contact a second subset of interconnects from the one or more second edges.

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Taipei, Taiwan

Tatao Hsu