Asm Assembly Automation Limited

Tat Wing Lee

Yiu Ming Cheung

Chi Ming Chong

Ka Lok Leung

The invention provides an apparatus and method for thin die detachment involving the use of a collet for holding and detaching a die mounted on an adhesive surface of an adhesive film. An ejector device comprising a plurality of ejector pins is employed to partially delaminate said die from the adhesive surface for detachment by the collet. Each ejector pin is operative to contact and raise a second surface of the film opposite the adhesive surface at a position substantially at a corner of the die to be detached within a predetermined distance from the edges of said die.

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Hong Kong, China

Tat Wing Lee