Finisar Corporation

Jds Uniphase Corporation

Ii-vi Delaware, Inc.

Stmicroelectronics International N.v.

Stmicroelectronics Asia Pacific Pte Limited

Tat Ming Teo

Chris Togami

Frank J Flens

Jinxiang Liu

Troy Wy Piew Chiang

William H Wang

Liew Chuang Chiu

Ron C Pang

Songyang Li

Yong Hwee Sim

Kee Hian Tan

John Hsieh

Gary Landry

Harold Y Walker, Jr

Stefan Martin Pfnuer

Hon Siu Wee

JianBing Zhao

Wendy Pei Fen Lau

Wenbin Jiang

Gary D Sasser

Yunpeng Song

Laurent Schwartz

Yong Peng Sim

Yew-Tai Chieng

Patrick Laurent

Ronson K Tan

Hsing Chung Lee

Kai Quan Cheng

Maxime Pailhes

Paul Thien Vui Chia

Andrew John Price

Derek Soon

Siu Wee Hon

Julia Koh

Jaspreet Singh Sidhu

Methods, systems, and apparatuses for electromagnetic interference (EMI) shielding are provided. An apparatus comprises a plurality of electrical components coupled to a substrate. The plurality of electrical components comprises a first electrical component coupled to a first region of the substrate and at least one other electrical component coupled to at least one other region of the substrate. The first electrical component is configured to emit electromagnetic waves. The apparatus also comprises an EMI shield forming a conductive envelopment around the first region. The first electrical component is inside the conductive envelopment and the one other electrical component is outside of the conductive envelopment. The EMI shield comprises an aperture positioned above the first electrical component. The apparatus further comprises a lens coupled to the EMI shield. The lens is positioned above the first electrical component and is substantially aligned with the aperture.

Electromagnetic interference (EMI) shielding in optical sensors

A method of making a light sensor module includes connecting a light sensing circuit to an interconnect on a substrate, and forming a cap. The cap is formed by producing a cap substrate from material opaque to light to have an opening formed therein, placing the cap substrate top-face down, dispensing a light transmissible material into the opening, compressing the light transmissible material using a hot tool to thereby cause the light transmissible material to fully flow into the opening to form at a light transmissible aperture, and placing the cap substrate into a curing environment. A bonding material is dispensed onto the substrate. The cap is picked up and placed onto the substrate positioned such that the light transmissible aperture is aligned with the light sensing circuit, with the bonding material bonding the cap to the substrate to thereby form the light sensor module.

Method for integrating a dispensable light transmissible aperture in the cap of a thin light sensor module

A communication module handle may include a base, a grasp, a hinge, and a detent. The hinge may connect the base and the grasp. The detent may be configured to maintain a position of the grasp relative to the base in an extended position. In response to the detent being subjected to a detent-releasing force, the detent may release the grasp from the extended position to a collapsed position. The grasp may be rotatable relative to the base by way of the hinge in the collapsed position.

Communication module handle

An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board ('PCB') that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference ('EMI') attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.

Strategic placement of plastic structures for EMI management of transceiver module

An example embodiment includes an electromagnetic radiation (EMR) shield. The EMR shield is configured to reduce EMR from escaping a host device. The EMR shield includes a structure, two or more module-grounding tabs, and multiple fingers. The structure is configured to substantially surround two or more adjacent transceiver modules positioned in an opening defined in a bezel. The two or more module-grounding tabs extend from the structure. Each of the module-grounding tabs is configured to contact one of the transceiver modules. The fingers extend from the structure and are configured to contact the bezel at multiple contact areas substantially surrounding the opening.

Electromagnetic radiation shielding on a PCI express card

A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.

Thermal interface

One example embodiment includes an optical subassembly (OSA). The OSA includes a leadframe circuit, an optical port, and an active optical component subassembly. The active optical component subassembly is mounted to the leadframe circuit. The optical port is mechanically coupled to the leadframe circuit.

Chip on leadframe optical subassembly

An example embodiment includes a thermal conduction system for dissipating thermal energy generated by operation of an optical subassembly that is disposed within a shell of a communication module. The thermal conduction system can include a thermally conductive flexible member that contacts the optical subassembly and the shell of the communication module. By contacting the optical subassembly and the shell, the thermal energy generated by operation of the optical subassembly can transfer from the optical subassembly to the shell. The thermally conductive flexible member defines thermally conductive flexible member holes that correspond to pins extending from the optical subassembly. The pins pass through the thermally conductive flexible member holes enabling the thermally conductive flexible member to contact the optical subassembly.

Thermally conductive flexible member for heat transfer

An example embodiment includes a communication module. The communication module includes a shell, a printed circuit board assembly ('PCBA') at least partially positioned within the shell, an optical transmitter electrically coupled to the PCBA, an optical receiver electrically coupled to the PCBA, and a biasing assembly. The biasing assembly includes a latch cover configured to be attached to the shell, a slider, and a spring. The slider is configured to operate a latching mechanism that releasably connects the module to a host device through a mechanical connection. The slider includes a main body including a first end, an arm extending from the first end, and a stopper feature extending from the arm. The spring is positioned between the latch cover and the stopper feature to bias the latching mechanism.

Biasing assembly for a latching mechanism

In one embodiment, an optical subassembly includes a housing, a ball lens, a constraining insert, and a ball lens constraint. The housing includes a fiber receptacle formed in a first end of the housing and a second receptacle formed in a second end of the housing opposite the first end. The fiber receptacle and second receptacle define a cavity through the housing from the first end to the second end of the housing. The ball lens and the constraining insert are disposed within the cavity. The ball lens constraint is configured to cooperate with the constraining insert to constrain the ball lens in three dimensions within the cavity.

Constraining ball lens in an optical subassembly

A pluggable ONU transceiver module comprises a top shell, a bottom shell configured to mate with the top shell to form a cavity, and a PCB disposed within the cavity. A plurality of pins are coupled to the PCB and are configured to be inserted into a protruding socket of a host device through the bottom shell. The protruding socket is mounted on a PCB of the host device. The pluggable ONU transceiver module further comprises one or more guiding features integrated with the bottom shell and configured to ensure that the pins are inserted correctly into the protruding socket, and means for positioning the top shell at a predetermined height above the PCB of the host device to allow coupling of the top shell to a heatsink of the host device.

Optical network unit transceiver

One embodiment includes a latching mechanism having a latch, a cam and a slider. The cam is configured to rotate about an axis of rotation. The cam is also configured to displace an end of the latch when the cam is rotated about the axis of rotation. The slider is operably connected to the cam and is configured to cause the cam to rotate about the axis of rotation.

Latching mechanism for a module

In an embodiment, a shell assembly for a communications module is described that includes a top shell, a bottom shell, and a thermal boss. The top shell has a top panel and opposing lateral side portions. The bottom shell has a bottom panel and opposing lateral side portions. The top shell and the bottom shell are configured to be assembled together to define a cavity therebetween. The cavity may be configured to receive a transceiver assembly. The thermal boss extends from the top panel and includes a thermal interface surface defining a thermal interface plane oriented at an angle relative to the top panel.

Communications module with a shell assembly having thermal mechanical features

Growing community of inventors

Singapore, Singapore

Tat Ming Teo