Intel Corporation

Altera Corporation

Spansion LLC.

Tat Hin Tan

Bok Eng Cheah

Jackson Chung Peng Kong

Choong Kooi Chee

Wai Ling Lee

Choong Kit Wong

Chenchu Punnarao Bandi

Lip Khoon Teh

Ker Yon Lau

Chieu Fung Tan

Pankaj Vinayak Dudulwar

Chee Hak Teh

Yue-Song He

Allan Parker

Yu Ying Ong

Chee Seng Leong

Hoong Chin Ng

Jackson Huang

Bryan William Hancock

Hsiao Wei Su

Kian Boon How

My Chien Yee

William Walter Fergusson

Ed Bautista

Wilfred Wee Kee King

Tick Sern Loh

An electronic device comprises an integrated circuit (IC) die. The IC die includes a first bonding pad surface and a first backside surface opposite the first bonding pad surface; a first active device layer arranged between the first bonding pad surface and the first backside surface; and at least one stacked through silicon via (TSV) disposed between the first backside surface and the first bonding pad surface, wherein the at least one stacked TSV includes a first buried silicon via (BSV) portion having a first width and a second BSV portion having a second width smaller than the first width, and wherein the first BSV portion extends to the first backside surface and the second BSV portion extends to the first active device layer.

Micro through-silicon via for transistor density scaling

Disclosed embodiments include a multi-chip package that includes a stacked through-silicon via in a first semiconductive device, and the first semiconductive device is face-to-face coupled to a second semiconductive device by the stacked through-silicon via. The stacked through-silicon via includes a first portion that contacts a second portion, and the first portion emerges from an active semiconductive region of the first semiconductive device adjacent a keep-out region.

Stacked through-silicon vias for multi-device packages

An integrated circuit is operable to communicate with an external component. The integrated circuit may include driver circuits for outputting clock signals and associated control signals to the external component in accordance with a predetermined interface protocol. The clock signals may toggle more frequently than the associated control signals. To help mitigate potential transistor aging effects that could negatively impact timing margins for the control signals, the control signals may be periodically toggled even during idle periods as allowed by the predetermined interface protocol to help improve timing margins.

Methods for mitigating transistor aging to improve timing margins for memory interface signals

Described is an apparatus which comprises: an input sensing stage for sensing an input signal relative to another signal; a decision making circuit, coupled to the input sensing stage, for determining whether the input signal is a logic low or a logic high; and a power management circuit, coupled to the input sensing stage and the decision making circuit, which is operable to monitor a state of the decision making circuit and to disable the input sensing stage according to the monitored state. Described is an apparatus which comprises: a decision making circuit integrated with an input sensing stage, wherein the decision making circuit is operable to pre-charge its internal nodes during a phase of the clock signal; and a latching circuit to latch an output of the decision making circuit.

High speed sense amplifier latch with low power rail-to-rail input common mode range

An integrated circuit (IC) device includes a first input/output (I/O) buffer circuit. The first input/output buffer circuit includes first and second groups of stacked transistors. The first group of stacked transistors transfer signals formatted in accordance with only one signal protocol from the group of signal protocols. The second group of stacked transistors transfers the signals formatted in accordance with more than one signal protocols. In addition, integrated circuit device also includes a second input/output buffer circuit. The second input/output buffer circuit includes third and fourth groups of stacked transistors. The third group of stacked transistors transfers the signals formatted in accordance to the first signal transmission protocol from the group of signal transmission protocols. The fourth group of stacked transistors transfers the signals formatted in accordance to the plurality of signal transmission protocols from the group of signal transmission protocols.

Dual signal protocol input/output (I/O) buffer circuit

A methodology for defining resistance-capacitance (RC) design targets based on radio-frequency (RF) simulation is provided. In particular, the method may involve first determining capacitance targets and then determining resistance targets. To compute the capacitance targets, integrate circuit design and simulations tools may run transient analysis to identify critical nodes, perform small signal and sensitivity analysis for the capacitance on the critical nodes, revise original RF specifications by allocating additional margin, and perform interpolation among multiple capacitance values to obtain capacitive design targets that meet the revised specifications. To compute the resistance targets, the circuit design tools may identify critical transistors, run single-pass and DC operating point simulation to determine initial resistance values for the critical transistors, simplify parallel resistive networks, perform sensitivity analysis on the simplified networks, and perform interpolation among multiple resistive values to obtain resistive design targets meet the original RF performance specifications.

Methods for determining resistive-capacitive component design targets for radio-frequency circuitry

A delay-locked loop includes multiple inverters coupled together, wherein the inverters receive an input clock signal and output a first clock signal and a second clock signal. The input clock signal passes through a first set of inverters having a first number of inverters to generate the first clock signal. The input clock signal also passes through a second set of inverters having a second number of inverters one inverter greater than the first number of inverters to generate the second clock signal. The delay-locked loop also includes a polarity matching block that receives the first clock signal and the second clock signal and changes polarity of one of the first clock signal and the second clock signal.

High resolution and low power interpolator for delay chain

Systems and methods for extracting one or more electrical specifications from a prelayout simulation of an integrated circuit design, where the one or more electrical specification are utilized to generate a physical layout of one or more components of an integrated circuit.

Systems and methods for extraction of electrical specifications from prelayout simulations

An input/output (I/O) circuit for an integrated circuit includes an input-output terminal, a termination circuit and an impedance compensation circuit. The termination circuit includes a node that is coupled to the input-output terminal. The termination circuit exhibits substantially constant first impedance below a first frequency of signals received at the input-output terminal. Furthermore, the termination circuit exhibits second impedance that is less than the first impedance when signals having a second frequency that is higher than the first frequency are received at the input-output terminal. The impedance compensation circuit is coupled to the input-output terminal. The impedance compensation circuit compensates for differences between the first and second impendences when the signal having the second frequency that is higher than the first frequency is received at the input-output terminal.

Integrated circuit with an increased signal bandwidth input/output (I/O) circuit

An output driver circuit includes a control circuit and first and second transistor legs that are coupled to an output pad. Each of the first and second transistor legs includes a pull-up transistor and a pull-down transistor. The control circuit is coupled to the first and second transistor legs. The control circuit enables the first transistor leg to generate an output signal at the output pad and disables the second transistor leg during a first phase of a cycle. The control circuit enables the second transistor leg to generate the output signal at the output pad and disables the first transistor leg during a second phase of the cycle. The control circuit repeats the first and the second phases of the cycle.

Growing community of inventors

Bayan Lepas, Malaysia

Tat Hin Tan