Kabushiki Kaisha Yaskawa Denki

Tasuku Isobe

Yasuhiko Kawanami

Masato Higuchi

Koji Higashikawa

Akira Sasaki

Tetsuya Ito

Kenji Yamada

Takayuki Morihara

Akira Soma

Katsushi Terazono

Kiyonori Koguma

Takashi Aoki

Tomohiko Sanada

Aiko Higuchi

Fumiaki Ikeda

Yukihisa Nakabayashi

A drive unit includes: an inverter; an electric motor that has a first winding connected to an output part of the inverter and a second winding connected to the first winding; a first semiconductor switch that has a first end connected to the first winding and a second end connected to the second winding; a second semiconductor switch that has a first end and a second end connected to the first winding and the first semiconductor switch; and a snubber circuit that is provided between the second end of the first semiconductor switch and the first end of the second semiconductor switch and has a capacitor and a diode.

Drive unit and transport machine

The present power converter includes a power conversion semiconductor device, an electrode connection conductor which electrically connects multiple electrodes having the same potential, and also has a generally flat upper surface for electrically connecting to an exterior portion, and a sealing material provided so as to cover the power conversion semiconductor device, and also to expose the generally flat upper surface of the electrode connection conductor.

Power converter

A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.

Wiring board and power conversion device

The present invention provides a power module in which a first semiconductor device disposed on a first substrate and a second semiconductor device disposed on a second substrate are disposed at symmetrical positions with a third substrate interposed therebetween.

Power semiconductor module

Growing community of inventors

Kitakyushu, Japan

Tasuku Isobe