Isola USA Corp.

Avishtech, LLC

Other

Advanced Chip and Circuit Materials, Inc.

Tarun Amla

Peggy Conn

Jyoti Amla

Keshav Amla

David Bedner

Johann R Schumacher

Sascha Kreuer

Stanley E Wilson

Larry D Olson

Guroen He

Peggy M Conn

Jeff Kamla

Dielectric materials including non-woven inorganic fabrics impregnated with a low-density resin are disclosed. The dielectric materials may have a thickness in a range of about 5 to about 125 microns for use in printed circuit boards.

Use of inorganic thin non-woven dielectrics in printed circuit boards

Systems and methods disclosed relate to autonomous vehicle technology. A follow vehicle having driving controls for use by humans may be equipped with a wireless transceiver, controller, sensors, and interfaces for use with control systems such that the follow vehicle may be caused to follow the lead vehicle without human interaction with the follow vehicle. The follow vehicle may wirelessly receive information from the lead vehicle regarding position, movement, acceleration or deceleration, steering, or other information relevant to following the lead vehicle. The follow vehicle may include sensors for sensing the position, movement, acceleration, deceleration, steering, or other properties of the lead vehicle. The lead vehicle may be equipped with RF transmitters that provide indicators to the follow vehicle, such that the sensors can more readily sense the lead vehicle. Multiple follow vehicles may be wirelessly linked to form a train that is not mechanically linked.

Autonomous vehicle towing system and method

Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3.

High Tg epoxy formulation with good thermal properties

Prepregs and laminates made from resin compositions having a free resin portion and a resin impregnated reinforcing material portion where the resin includes one or more base resins and one or more high Dk materials wherein the one or more high Dk materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured Dkthat matches the Dkof a resin impregnated reinforcing material to which the resin composition is applied to within plus or minus (&#xb1;) 15%.

Prepregs and laminates having homogeneous dielectric properties

Synthesized base resin compositions that include a raw resin and a maleimide and/or bismaleimide monomer as well as compounded varnishes that include a raw resin or synthesized base resin as well as a monomer, flame retardant and initiator as well as prepregs and laminates made using the synthesized base resin and compounded varnishes.

Synthesized resins and varnishes and prepegs and laminates made therefrom

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Chandler, AZ, United States of America

Tarun Amla