Shin-etsu Chemical Co., Ltd.

Tarou Shimoda

Toshio Shiobara

Kazutoshi Tomiyoshi

Takayuki Aoki

Shoichi Osada

Eiichi Asano

Yasuo Kimura

Hiroyuki Takenaka

Shingo Ando

A flame retardant epoxy resin composition for semiconductor encapsulation includes as essential components, (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a phosphazene compound of the average compositional formula (1) having a melting point of 110&#x2013;130&#xb0; C., wherein a, b and n are numbers satisfying 0&#x3c;a&#x2266;0.05n, 1.90n&#x2266;b&#x3c;2n, 2a+b=2n, and 3&#x2266;n&#x2266;6, the composition being substantially free of bromides and antimony compounds.

Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device

Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a &bgr;-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.

Semiconductor encapsulating epoxy resin composition and semiconductor device

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Usui-gun, Japan

Tarou Shimoda