Taiyo Yuden Co., Ltd.

Taro Yasuda

Koji Saito

Kikuji Fukai

Hiroyuki Matsui

Kazushige Koyama

Kiyoshi Murase

Masaru Aoki

Atsuo Kamimura

Tatsuichi Ito

Yutaka Aikawa

Jinichi Ohkawara

A chip component take-in apparatus takes in and guides downward prismatic chip components stored in a bulk state in a storage chamber one by one in a predetermined direction. When a first take-in member and a second take-in member are relatively moved up and down in each flat face contact state, the chip components in face contact with the flat faces of the take-in members are gradually guided to a center along guide ways. The guided chip components in the longitudinal direction thereof are taken into a passage constituted by grooves and are moved downward along the passage by self-weight.

Chip component take-in apparatus

A component transfer mechanism transfers chip components along a liner passage by applying an inhaling pressure or a discharging pressure of an air bag or an air cylinder directly to the chip components in the liner passage, or by operating a component transfer member through an air actuator by the inhaling pressure or the discharging pressure. A component take-in mechanism stirs chip components in a storage chamber and takes them into a feeding passage by applying the inhaling pressure or the discharging pressure of the air bag or the air cylinder directly to the chip components in the storage chamber, or by operating a component stirring member through the air actuator by the inhaling pressure or the discharging pressure. A component separating mechanism separates the foremost chip component from the succeeding chip components by applying the inhaling pressure or the discharging pressure of the air bag or the air cylinder directly to the foremost chip component in the liner passage, or by operating a component separating member through the air actuator by the inhaling pressure or the discharging pressure.

Electronic component feeding apparatus

A chip component supplying apparatus is disclosed. The chip component supplying apparatus includes a storage chamber for storing chip components in random directions. A discharge channel allows the chip components in the storage chamber to move downward in a predetermined direction. A conveying channel conveys the chip components discharged from the discharge channel and wherein the discharge channel has an inclined portion at a lower part thereof and the chip components in the discharge channel are discharged to the conveying channel through the inclined portion.

Method and apparatus for supplying chip parts

A chip component feeding apparatus translates chip components in alignment along a passage and feeds the foremost chip component to a predetermined take-out position. The foremost chip component is separated from the remaining translated chip components. A stopper is displaceable between a predetermined stop position where the foremost chip component stops, and a predetermined take-out position spaced from the stop position. A first attracting section attracts the foremost chip component to the stopper to displace the stopper and the foremost chip component at the stopped position. A second attracting section attracts the foremost chip component to a transport belt.

Chip component feeding apparatus and attracting plate for use in same

An electronic component feeding apparatus for separating a foremost electronic component conveyed to a predetermined takeout position from a succeeding electronic component, wherein, the separating device includes a first component stopper, a second component stopper projecting from the first component stopper and having a magnetic attractive force at a tip end thereof for separating a foremost electronic component. The second component stopper is movable within the first component stopper between a retracted and a protruding position so that the foremost electronic component engages both the first and second component stoppers during separation from a succeeding electronic component.

Electronic component moving mechanism

A supply apparatus for prism-shaped chip components has two relatively movable taking-in members. When the members move relative to each other, flat surfaces thereof contact each other and a parallel space is formed between the upper portions of the two taking-in members. Relative movement of the two talking-in members causes the components in a storage chamber to enter the parallel space between the upper portions of the two taking-in members. The components entering the parallel space have the same thickness-wise orientation and are lengthwise in a supply passageway in a one by one in a state. The components move downward by gravity in the supply passageway and then in a discharge passageway.

Electronic component supply apparatus

An electronic component supplying apparatus conveys electronic components in an aligned state to supply the same to a predetermined taking-out position. When a leading chip component abuts on a component stopper and a component conveyance is stopped, a plurality of the chip components including the leading chip component are covered in a non-contacting state by a slider, the leading chip component which has abutted on the component stopper is attracted to the component stopper. In a state where the component conveyance by the conveying path is stopped, the component stopper is displaced in a component conveying direction, the leading chip component is separated from a second leading chip component, and also the slider is displaced in a direction opposite to the component conveying direction, so that the slider covering is uncovered, and the leading chip component is allowed to be taken out.

Electronic component supplying apparatus

Method and apparatus for supplying electronic components

In an electronic component placing apparatus, four magazines are mounted on a head, and yet electronic components are housed in each magazine. In this apparatus, by an operation of selectively inserting a suction nozzle into four insertion openings in the magazines, it is possible to load a desired electronic component on a substrate, and this component loading can be repeatedly performed until the housed components are exhausted.

Electronic component placing apparatus

A chip component conveyor belt of the present invention comprises an endless timing belt having a plurality of teeth at predetermined intervals on its back surface. Wherein a height of the teeth is made uniform by polishing or grinding the tip of each tooth. Thus, there arises no variation of surface height of the endless timing belt even when any tooth of the endless timing belt meshes a timing pulley, or even when the endless timing belt is supported by a belt guide member.

Belt for conveying chip components, and method of manufacturing the same

A component supply apparatus includes a rectangular cross-sectional component passage which can house a plurality of chip components in a longitudinal direction, and at a first side surface of the tip of this component passage a rectangular-shaped component discharge opening is formed, and at a second side surface opposing the first side surface of the tip of the component passage a rectangular-shaped pusher insertion opening is formed. Inserting the pusher into the component passage through the pusher insertion opening enables a forefront electronic component to be pushed by the pusher and be discharged outside from the component discharge opening in a predetermined direction.

Component supply apparatus

Electronic chips accumulated at random directions are arranged in an orderly line by a chip part supplier. A chip part feeder transfers the first aligned chip onto a printed circuit board. Chip parts having random directions in a hopper are fed to a discharge channel, organized in a prescribed direction and transferred through the discharge channel before being discharged through the channel bottom end onto a conveying belt before being carried by the belt in a prescribed direction. A clearance forcefully caused between the first chip and next chip separates the two chips completely just before the first chip is picked up. The thus separated first chip part is picked up by a suction head before being transferred to the printed circuit board.

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Tokyo, Japan

Taro Yasuda