Tokyo Electron Limited

Nikon Corporation

Tokyo Electron Limi Ted

Taro Yamamoto

Kousuke Yoshihara

Hideharu Kyouda

Yasushi Takiguchi

Hirofumi Takeguchi

Masahiro Fukuda

Atsushi Ookouchi

Yuichi Yoshida

Akihiro Fujimoto

Koshi Muta

Hitoshi Kosugi

Seiki Ishida

Akihiro Kubo

Koki Yoshimura

Yoshiaki Yamada

Osamu Hirakawa

Naoto Yoshitaka

Yoichi Tokunaga

Yasuhito Saiga

Yoshiki Okamoto

Hiroshi Arima

Hiroyuki Nagasaka

Suguru Enokida

Masashi Tsuchiyama

Tsuyoshi Watanabe

Takahiro Kitano

Junichi Kitano

Yuichiro Inatomi

Nobuhiro Ogata

Hiroichi Inada

Masashi Enomoto

Keiichi Tanaka

Teruhiko Kodama

Shuuichi Nishikido

Yoshinori Ikeda

Masahiro Nakaharada

Hideo Funakoshi

Kenji Yada

Hayato Hosaka

Dai Kumagai

Noboru Nakashima

Shuichi Nishikido

Shuichi Nagamine

Katsuhiro Morikawa

Junji Nakamura

Satoru Shimura

Osamu Miyahara

Kouichirou Tanaka

Tetsu Kawasaki

Hiroshi Ichinomiya

Koichi Obata

Kouji Fujimura

Kenji Tsutsumi

Ryuto Ozasa

Yuji Ariuchi

Shinsuke Kimura

Shogo Takahasi

Kenzi Yada

Tsutomu Yamahata

Nozomu Kanetake

A substrate warpage correction method according to this disclosure corrects warpage of a substrate without performing a process on a front surface of the substrate. The substrate warpage correction method includes a surface roughening of performing a surface roughening process on a rear surface of the substrate using a surface roughening processing apparatus configured to be able to perform the surface roughening process on the rear surface of the substrate, to form grooves in the rear surface to thereby correct the warpage of the substrate.

Substrate warpage correction method, computer storage medium, and substrate warpage correction apparatus

A substrate processing apparatus includes; a carrier block; a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block; a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks; a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks; a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block; and a bypass transfer mechanism provided for each of the first and second processing blocks.

Substrate processing apparatus and substrate processing method

A substrate processing apparatus includes a carrier block, a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block, a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks, a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks, a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block, and a bypass transfer mechanism provided for each of the first and second processing blocks.

A substrate processing apparatus includes a carrier block on which a carrier configured to store a substrate is placed, first processing block including a plurality of first processing modules, and a first transport mechanism shared by the plurality of first processing modules to transport the substrate, second processing block overlapping the first processing block, including a plurality of second processing modules, and a second transport mechanism shared by the plurality of second processing modules to transport the substrate, and configured to transport the substrate to the carrier block. The substrate processing apparatus includes a lifting and transferring mechanism including a shaft extending in a horizontal direction and a support part configured to face and support the substrate, and a rotation mechanism configured to rotate the support part around the shaft such that an orientation of the support part is changed between a first orientation and the second position.

A liquid processing apparatus for performing liquid processing with respect to a substrate using processing fluid, includes: a plurality of substrate holding units arranged side by side in a left-right direction; a nozzle configured to supply the processing fluid to the substrate held in each of the substrate holding units; and a nozzle moving mechanism configured to move the nozzle forward and backward in a front-rear direction intersecting an arrangement direction of the substrate holding units between a supplying position in which the processing fluid is supplied to a region including a central portion of the substrate and a waiting position which is defined at a rear side of a row of the substrate holding units opposite to a front side of the row of the substrate holding units at which the substrate is loaded and unloaded.

Liquid processing apparatus

A substrate processing apparatus includes: a first holding part configured to hold a substrate; a second holding part configured to hold the substrate; a sliding member configured to rotate about a vertical axis so that the sliding member slides on a back surface of the substrate; a revolution mechanism configured to revolve the sliding member under rotation about a vertical revolution axis; and a relative movement mechanism configured to horizontally move a relative position between the substrate and a revolution trajectory of the sliding member so that when the substrate is held by the first holding part, the sliding member slides on a central portion of the back surface of the substrate, and when the substrate is held by the second holding part, the sliding member slides on the peripheral portion of the back surface of the substrate under rotation.

Substrate processing apparatus, substrate processing method and storage medium

Disclosed is a liquid processing apparatus for performing a liquid processing by supplying a processing liquid from a nozzle to a substrate. The apparatus includes: a cup body provided to surround a substrate holding unit; a nozzle arm provided with a nozzle and supported by a support unit; a moving mechanism configured to move the nozzle arm via the support unit between a stand-by position and a processing position; an elevating mechanism configured to move up and down the support unit; a cover member including a top plate portion provided above a driving region and configured to partition the driving region from a region where the substrate is held within the cup body; an opening formed in a portion corresponding to a moving path of the support unit in the top plate portion; and an exhaust mechanism configured to evacuate the driving region.

There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.

Polishing cleaning mechanism, substrate processing apparatus, and substrate processing method

A developing apparatus includes: a substrate holder that hold a substrate horizontally; a developer nozzle that supplies a developer onto the substrate to form a liquid puddle; a turning flow generation mechanism including a rotary member that rotates about an axis perpendicular to the substrate while the rotary member is being in contact with the liquid puddle thereby to generate a turning flow in the liquid puddle of the developer formed on the substrate; and a moving mechanism for moving the turning flow generation mechanism along a surface of the substrate. The line-width uniformity of a pattern can be improved by forming turning flows in a desired region of the substrate and stirring the developer.

Developing apparatus, developing method and storage medium

There is provided a guide memberin which an inclined surfacethereof is inclined downwardly outwards from an edge portion of a rear surface of a horizontally held wafer W; and a cylindrical surrounding memberwhich surrounds the wafer W and in which an upper peripheral portion thereof is inwardly extended obliquely upwards. Further, the surrounding memberhas, at an inner surface side thereof, two groove portionsextended along an entire circumference and located above a height position of the horizontally held wafer W. If an air flow flows along the surrounding member, a vortex flow is formed within the groove portionsand stays therein. Thus, mist can be captured, so that the flow of the mist to the outside of a cup bodycan be suppressed. Accordingly, the adhesion of the mist to the wafer W can be suppressed.

Liquid processing apparatus and liquid processing method

A developing apparatus including a horizontal substrate holder, a rotating mechanism to rotate the substrate holder, a developer nozzle to supply a developer onto a part of the substrate to form a liquid puddle, a moving mechanism to move the developer nozzle in a radial direction of the rotating substrate, a contact part that moves with the developer nozzle and has a surface opposed to the substrate, which is smaller than the surface of the substrate, and a control unit to output a control signal such that a supply position of the developer on the substrate is moved in the radial direction of the substrate so that the liquid puddle is spread out on a whole surface of the substrate while the contact part is in contact with the liquid puddle.

Developing method, developing apparatus and storage medium

There are provided first and second cleaning members which are configured to clean a central zone in a rear surface of a wafer when the wafer held by an absorption pad is horizontally held, and configured to clean a peripheral zone in the rear surface of the wafer when the wafer is held by the spin chuck. Due to the provision of the first and second cleaning members, detergency can be improved as compared with a case in which only one cleaning member is used. The first and second cleaning members are configured to be horizontally turned by a common turning shaft. When the central zone in the rear surface of the wafer is cleaned, the turning shaft is located to be overlapped with the wafer. Since the turning shaft is located by using the moving area of the wafer, a size of an apparatus can be reduced.

Substrate cleaning apparatus, substrate cleaning method, and storage medium

A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the back surface.

Substrate cleaning method

Growing community of inventors

Koshi, Japan

Taro Yamamoto