Sony Corporation

Sony Semiconductor Solutions Corporation

Sony Group Corporation

Taro Sugizaki

Isao Hirota

Toru Nishi

Go Yamanaka

Daisuke Yoshioka

Norihiro Ichimaru

Yousuke Horie

Naoki Hosoi

Keneki Go

Takesi Kozasa

The present technology relates to a solid-state imaging device, an imaging apparatus, and an electronic apparatus, which can suppress a color mixture without lowering the sensitivity. In pixels (red pixels (R pixels), green pixels (G pixels), and blue pixels (B pixels)) other than W pixels and adjacent to the W pixels, light shielding films thicker than those of the W pixels are formed at positions adjacent to the W pixels. Furthermore, the shorter the wavelength, the thicker the light shielding film in the RGB pixels other than the W pixels. The present technology is applicable to the solid-state imaging device.

Solid-state imaging device, imaging apparatus, and electronic apparatus

The present technology relates to an electromagnetic wave processing device that enables suppression of a ripple. Provided are a photoelectric conversion element, a narrow band filter stacked on a light incident surface side of the photoelectric conversion element and configured to transmit an electromagnetic wave having a desired wavelength, and interlayer films respectively formed above and below the narrow band filter, and the narrow band filter is formed in a shape with a level difference. The level difference is formed for each photoelectric conversion element. Alternatively, the level difference is formed between the photoelectric conversion elements and in the interlayer film. The present technology can be applied to an imaging element or a sensor using a plasmon filter or a Fabry-Perot interferometer.

Electromagnetic wave processing device

According to some aspects, an imaging device is provided comprising a photoelectric conversion layer configured to receive light and to produce an electric charge in response to the received light, including a first filter region corresponding to a first pixel of the imaging device, the first filter region having a first thickness and a plurality of through holes formed therein, wherein the first filter region transmits light incident on the first filter region with a first peak transmission wavelength, and a second filter region corresponding to a second pixel of the imaging device, the second filter region having a second thickness greater than the first thickness and having a plurality of through holes formed therein, wherein the second filter region transmits light incident on the second filter region with a second peak transmission wavelength that is greater than the first peak transmission wavelength.

Imaging element, manufacturing method of imaging element, metal thin film filter, and electronic device

The present technology relates to an electromagnetic wave processing device that enables reduction of color mixture. Provided are a photoelectric conversion element formed in a silicon substrate, a narrow band filter stacked on a light incident surface side of the photoelectric conversion element and configured to transmit an electromagnetic wave having a desired wavelength, and interlayer films respectively formed above and below the narrow band filter, and the photoelectric conversion element is formed at a depth from an interface of the silicon substrate, the depth where a transmission wavelength of the narrow band filter is most absorbed. The depth of the photoelectric conversion element from the silicon substrate becomes deeper as the transmission wavelength of the narrow band filter is longer. The present technology can be applied to an imaging element or a sensor using a plasmon filter or a Fabry-Perot interferometer.

The present technology relates to an imaging device capable of selectively taking out only a specific electromagnetic wavelength and generating a signal with an enhanced wavelength resolution, and an electronic apparatus. There are provided a first pixel including a metallic thin film filter configured to transmit a light in a first frequency band and a second pixel including a color filter configured to transmit a light in a second frequency band wider than the first frequency band. A signal in a third frequency band is generated from the respective signals of a plurality of first pixels each including a metallic thin film filter configured to transmit a light in the different first frequency bands. The present technology can be applied to a CMOS image sensor of backside irradiation type or surface irradiation type, for example.

Imaging device and electronic apparatus

The present technology relates to a semiconductor device and an electronic apparatus that are capable of improving the characteristics of a semiconductor device or an electronic apparatus that includes a pixel having a metallic filter and a pixel not having the metallic filter. A semiconductor device includes: a pixel unit in which a first pixel including a metallic filter and a second pixel not including the metallic filter are disposed adjacent to each other; and a reflected light reduction unit that reduces reflected light on a sidewall of the metallic filter at a boundary portion between the first pixel and the second pixel. The present technology can be applied to an image sensor that includes a narrowband pixel including a plasmon filter and a normal pixel including a color filter, for example.

Semiconductor device and electronic apparatus

A solid-state imaging element includes a pixel array in which a plurality of pixels having different spectral characteristics are arranged and one or more pixels of the plurality of pixels have a spectral characteristic that includes spectral characteristics of two or more pixels that are different from the one or more pixels. The solid-state imaging element further includes a signal processing unit that synthesizes signals of one or more pixels of the pixels that have the included spectral characteristics with a luminance signal, when a signal of a pixel that has two or more spectral characteristics in the pixel array is used to generate the luminance signal.

Solid-state imaging element, signal processing circuit, and electronic equipment

The present technology relates to a solid-state image capturing apparatus and an electronic device that can acquire a normal image and a narrow band image at the same time. The solid-state image capturing apparatus includes a plurality of substrates laminated in two or more layers, and two or more substrates of the plurality of substrates have pixels that perform photoelectric conversion. At least one substrate of the substrates having the pixels is a visible light sensor that receives visible light, and at least another substrate of the substrates having the pixels is a narrow band light sensor that includes narrow band filters being optical filters permeating light in a narrow wavelength band, and receives narrow band light in the narrow band.

Solid-state image capturing apparatus and electronic device for acquiring a normal image and a narrow band image

The present technology relates to an image sensor and an electronic device capable of performing imaging in which mixed color is reduced. Photoelectric conversion layers including photoelectric conversion units separated in units of pixels are stacked in two or more layers, the image sensor is configured to include a state in which light incident on one pixel in a first photoelectric conversion layer closer to an optical lens is received by the photoelectric conversion unit in a second photoelectric conversion layer distant from the optical lens, the image sensor includes a light-shielding layer configured to shield light transmitted through the first photoelectric conversion layer, between the first photoelectric conversion layer and the second photoelectric conversion layer, the light-shielding layer has an opening to transmit the light from the first photoelectric conversion layer to the second photoelectric conversion layer, and the openings are made to be asymmetric with respect to the pixel in the first photoelectric conversion layer. The present technology can be applied to an image sensor with a multi-layered structure.

Growing community of inventors

Kanagawa, Japan

Taro Sugizaki