Shin-etsu Chemical Co., Ltd.

Taro Shimoda

Kazuaki Sumita

Yoshihiro Tsutsumi

Tadashi Tomita

Kaoru Katoh

Masahiro Kaneta

Set of compositions for preparing system-in-package type semiconductor device. The composition set consists of underfill composition for preparing underfill part and encapsulation resin composition for preparing resin encapsulation part. 1) A cured product of the underfill composition has a glass transition temperature, Tg, &#x2267;100&#xb0; C. and is the same with or differs from a Tg of a cured product of the encapsulation resin composition by &#x2266;20&#xb0; C. 2) Total linear expansion coefficient of the cured product of the underfill composition at a temperature not higher than (Tg&#x2212;30)&#xb0; C. and a linear expansion coefficient of the cured product of the encapsulation resin composition at a temperature not higher than (Tg&#x2212;30)&#xb0; C. is &#x2266;42 ppm/&#xb0; C. 3) A ratio of the linear expansion coefficient of the cured product of the encapsulation resin composition to the linear expansion coefficient of the cured product of the underfill composition ranges from 0.3 to 1.0.

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Annaka, Japan

Taro Shimoda